Specifications
| Type | Description |
|---|---|
| Part Number | XLR2223 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Device Function | Random-phase triac driver photocouple |
| Minimum Trigger Current Feature | 10 mA |
| Peak Off-State Voltage Feature | 600 V |
| Load Current Feature | 0.9 A |
| Isolation Voltage Feature | 5000 Vrms |
| Operating Temperature Feature | -55 to +100 °C |
| Package Options | DIP7, DIP7-M, SMD7 |
| Molding Compound Flammability | UL 94V-0 |
| Lead Finish | Matte tin-plated leads |
| Shipping Quantity | 65 pcs/tube |
| Shipping Quantity | 1000 pcs/tape & reel |
| Marking Code | XLRX223 |
| Forward Current | 50 mA |
| Input Reverse Voltage | 5 V |
| Peak Forward Current | 1 A |
| Input Power Dissipation | 75 mW |
| Output Power Dissipation | 300 mW |
| Off-State Output Terminal Voltage | 600 V |
| Output ON-State RMS Current | 0.9 A |
| Non-Repetitive Surge Current | 9 A |
| Total Power Dissipation | 375 mW |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -40 to +85 °C |
| Storage Temperature Range | -40 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.4 V |
| Input Reverse Leakage Current | max 10 µA |
| Input Capacitance | typ 45 pF |
| Peak Blocking Current | max 100 µA |
| Peak On-State Voltage | max 2.5 V |
| Critical Rate of Rise of Off-State Voltage | min 200 V/µs |
| Minimum Trigger Current | max 10 mA |
| Holding Current | max 25 mA |
| Turn-On Time | typ 10 µs, max 100 µs |
| Isolation Resistance | min 1×10^11 Ω |
| Isolation Capacitance | typ 0.25 pF |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | max 260 °C |
| Reflow Peak Dwell Time | max 30 s |
| Reflow Ramp-Down Rate | max 6 °C/s |
| Reflow Cycle Limit | No more than three times |
| Wave Soldering Average Ramp-Up Rate | approximately 200 °C/s |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s |
| Wave Soldering Final Preheat Temperature | approximately 130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s |
| DIP7 Packing Quantity | 65 pcs/tube, 50 tubes/box, 10 boxes/carton |
| DIP7-M Packing Quantity | 65 pcs/tube, 50 tubes/box, 10 boxes/carton |
| SMD7 Packing Quantity | 1000 pcs/reel, 2 reels/box, 5 boxes/carton |
| Document Validity | Valid until Dec 31, 2026 |
| Datasheet Status | request_only |
Product Overview
The XLR2223 is a XINGLIGHT random-phase triac driver photocouple in the LED category. It provides optical isolation between input and output, with 5000 Vrms isolation voltage specified between the shorted input pins and shorted output pins under the datasheet test condition.
Key output ratings include 600 V off-state output terminal voltage, 0.9 A output on-state RMS current for the XLR2223 variant, and 9 A non-repetitive surge current. Electrical characteristics include a maximum 10 mA trigger current, maximum 2.5 V peak on-state voltage, minimum 200 V/µs critical rate of rise of off-state voltage, and turn-on time of typically 10 µs with a 100 µs maximum.
Package options include DIP7, DIP7-M, and SMD7. Assembly data covers reflow soldering up to 260 °C peak, wave soldering at 260 °C for 10 s, and hand soldering at 360 °C +5 °C within 3 s for rework or sample testing. The device fits isolated triac gate-drive and random-phase AC switching circuits where the listed current, voltage, isolation, and soldering limits are required.
Key Features
- Random-phase triac driver photocouple function
- Maximum 10 mA trigger current
- 600 V off-state output terminal voltage
- 0.9 A output on-state RMS current
- 9 A non-repetitive surge current rating
- 5000 Vrms input-to-output isolation voltage
- DIP7, DIP7-M, and SMD7 package options
- UL 94V-0 molding compound flammability
- Matte tin-plated leads with solderability condition
- Reflow peak temperature up to 260 °C
Typical Applications
- Isolated triac gate drive
- Random-phase AC switching
- AC load triggering circuits
- Input-to-output isolated control
- DIP7 tube assembly builds
- SMD7 tape-and-reel assembly
- Reflow soldered photocoupler boards
- Wave soldered through-hole assemblies
Procurement Notes
When requesting a quote for XLR2223, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XLR2223?
The XLR2223 is a XINGLIGHT random-phase triac driver photocouple in the LED category. It is specified for isolated input-to-output triac drive functions, with package options including DIP7, DIP7-M, and SMD7.
What are the main output ratings for XLR2223?
The XLR2223 output ratings include 600 V off-state output terminal voltage, 0.9 A output on-state RMS current, 9 A non-repetitive surge current, and 300 mW output power dissipation under the stated datasheet conditions.
What isolation rating is specified for this photocouple?
The datasheet specifies 5000 Vrms isolation voltage between input and output. The listed test condition shorts pins 1, 2, and 3 together and pins 4, 5, and 6 together, with AC applied for 1 minute at 40 to 60% RH.
Which soldering profiles are listed for XLR2223?
The extracted data lists reflow soldering with a maximum 260 °C peak, wave soldering at 260 °C for 10 s, and hand soldering at 360 °C +5 °C within 3 s for rework or sample testing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.