Specifications
| Type | Description |
|---|---|
| Part Number | XLR3213 |
| Manufacturer | XINGLIGHT |
| Product Type | LDO Regulator |
| Category | Power Management |
| Component Type | Power_IC |
| Package Case | DIP7, DIP7-M, SMD7; package outline dimensions referenced in mm but numeric dimensions not provided in extracted text |
| Peak Breakdown Voltage | 600 V; feature summary |
| Peak Current Load | 1.2 A; XLR3213 variant |
| Isolation Voltage | 5000 Vrms; between input and output |
| Operating Temperature | -55 to +100 °C; feature summary |
| Package Options | DIP7, DIP7-M, SMD7; mechanical data / ordering information |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; mechanical data |
| Solderability Standard | MIL-STD-202 Method 208; mechanical data |
| Shipping Quantity | 65 pcs/tube; XLR3213 DIP7 or XLR3213M DIP7-M |
| Shipping Quantity | 1000 pcs/tape & reel; XLR3213S SMD7 |
| Marking Code | XLR3213; XLR3213, XLR3213M, or XLR3213S |
| Input Forward Current | 50 mA; maximum rating, TA=25°C unless otherwise specified |
| Input Reverse Voltage | 5 V; maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation | 75 mW; maximum rating, TA=25°C unless otherwise specified |
| Output Power Dissipation | 300 mW; maximum rating, TA=25°C unless otherwise specified |
| Off-State Output Terminal Voltage | 600 V; VDRM maximum rating, TA=25°C unless otherwise specified |
| Peak Repetitive Surge Current | 12 A; ITSM, XLR3213, TA=25°C unless otherwise specified |
| Turn-On Current RMS | 1.2 A; IT(RMS), XLR3213, TA=25°C unless otherwise specified |
| Total Power Dissipation | 375 mW; thermal characteristic, TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; VISO, 40-60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted |
| Operating Temperature | -40 to +85 °C; TOPR thermal characteristic |
| Storage Temperature Range | -40 to +125 °C; TSTG thermal characteristic |
| Soldering Temperature | 260 °C; TSOL for 10 seconds |
| Forward Voltage | Max 1.4 V; VF, IF=10 mA, TA=25°C unless otherwise specified |
| Input Reverse Leakage Current | Max 10 µA; IR, VR=5 V, TA=25°C unless otherwise specified |
| Input Capacitance | Typ 45 pF; CIN, f=1 kHz, TA=25°C unless otherwise specified |
| Peak Blocking Current | Max 100 µA; IDRM, VDRM=600 V, IF=0 mA, TA=25°C unless otherwise specified |
| Peak On-State Voltage | Max 2.5 V; VTM, ITM=100 mA peak, IF=rated IFT, TA=25°C unless otherwise specified |
| Critical Rate of Rise of Off-State Voltage | Min 200 V/µs; dv/dt, VPEAK=rated VDRM, TA=25°C unless otherwise specified |
| LED Trigger Current | Max 10 mA; IFT, main terminal voltage=3 V, TA=25°C unless otherwise specified |
| Holding Current | Max 25 mA; IH, terminal voltage from ON to OFF state, IF=0 mA, TA=25°C unless otherwise specified |
| Turn-On Time | Typ 10 µs, max 100 µs; Ton, IF=20 mA, VD=6 V, RL=100 Ω, TA=25°C unless otherwise specified |
| Isolation Resistance | Min 1×10^11 Ω; RIO, VIO=500 VDC, TA=25°C unless otherwise specified |
| Isolation Capacitance | Typ 0.25 pF; CIO, f=1 MHz, TA=25°C unless otherwise specified |
| Reflow Preheat Temperature | 150 to 200 °C; Ts, recommended reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; ts, recommended reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP, recommended reflow soldering profile |
| Reflow Liquidus Temperature | 217 °C; TL, recommended reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; tL, recommended reflow soldering profile |
| Reflow Peak Temperature | 260 °C; Tp, recommended reflow soldering profile |
| Reflow Peak Dwell Time | Max 30 s; tp, time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL, recommended reflow soldering profile |
| Maximum Reflow Cycles | No more than 3 times; recommended reflow soldering note |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, maximum 4 °C/s; wave soldering profile feature |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts, wave soldering profile feature |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp, wave soldering profile feature |
| Wave Soldering Peak Time | 10 s; tp, time within peak temperature |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile feature |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; for product rework or sample testing |
| DIP7 Packing Quantity | 65 pcs/tube, 50 tubes/box, 10 boxes/carton; tube 500 mm, straight insert type material tube |
| DIP7 Carton Quantity | 32500 pcs/carton; 65 pcs/tube, 3250 pcs/box |
| DIP7-M Packing Quantity | 65 pcs/tube, 50 tubes/box, 10 boxes/carton; tube 500 mm, seagull foot M-foot tube |
| SMD7 Packing Quantity | 1000 pcs/reel, 2 reels/box, 5 boxes/carton; reel diameter 330 mm, guard band 200 mm minimum |
| SMD7 Carton Quantity | 20000 pcs/carton; 1000 pcs/reel, 2000 pcs/box |
| Document Validity | Valid until Dec 31, 2026; attention section |
| Datasheet Status | request_only |
Product Overview
The XLR3213 is a XINGLIGHT zero-cross triac driver in the Power_Management category. The extracted datasheet identifies the component as a Power IC with 600 V peak breakdown voltage, 600 V maximum off-state output terminal voltage, and a 1.2 A RMS turn-on current rating for the XLR3213 variant. Input-to-output isolation is specified at 5000 Vrms, including a one-minute AC isolation test condition with input-side and output-side pins shorted separately.
Input-side limits include 50 mA forward current, 5 V reverse voltage, 75 mW input power dissipation, and maximum 1.4 V forward voltage at 10 mA. Output and switching parameters include 300 mW output power dissipation, 12 A peak repetitive surge current, maximum 100 µA peak blocking current at 600 V, maximum 25 mA holding current, and typical 0.25 pF isolation capacitance.
Package options are DIP7, DIP7-M, and SMD7, with matte tin-plated leads, UL 94V-0 molding compound, and solderability per MIL-STD-202 Method 208. Assembly data covers recommended reflow, wave soldering, and hand soldering profiles, while packing data lists tube and tape-and-reel quantities for the available package formats.
Key Features
- Zero-cross triac driver for isolated trigger circuits
- 600 V peak breakdown voltage rating
- 1.2 A RMS turn-on current for XLR3213
- 5000 Vrms input-to-output isolation rating
- Maximum 10 mA LED trigger current
- Minimum 200 V/µs off-state dv/dt
- DIP7, DIP7-M, and SMD7 package options
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads with MIL-STD-202 solderability
- Reflow peak temperature specified at 260 °C
Typical Applications
- Zero-cross triac drive circuits
- Isolated AC switching interfaces
- 600 V off-state terminal designs
- LED-triggered output control
- DIP7 tube assembly builds
- SMD7 tape-and-reel assembly
- Reflow soldered power-control boards
- Wave soldered DIP assemblies
Procurement Notes
When requesting a quote for XLR3213, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What package options are listed for XLR3213?
The extracted datasheet lists DIP7, DIP7-M, and SMD7 package options for XLR3213 family ordering information. Package outline dimensions are referenced in millimeters, but numeric outline dimensions were not included in the extracted text.
What isolation rating does the XLR3213 provide?
XLR3213 is specified with 5000 Vrms isolation voltage between input and output. The detailed VISO condition states AC for 1 minute at 40-60% RH, with pins 1,2,3 shorted and pins 4,5,6 shorted.
What are the key output ratings for XLR3213?
Output-related ratings include 600 V maximum off-state output terminal voltage, 1.2 A RMS turn-on current for XLR3213, 12 A peak repetitive surge current, 300 mW output power dissipation, and maximum 2.5 V peak on-state voltage.
What soldering profiles are provided in the datasheet?
The extracted data includes reflow, wave, and hand soldering parameters. Reflow peak temperature is 260 °C with no more than three cycles, wave soldering peak temperature is 260 °C for 10 seconds, and hand soldering is 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.