Specifications
| Type | Description |
|---|---|
| Part Number | ZMY3V9 |
| Manufacturer | Vishay |
| Product Type | LDO Regulator |
| Category | Power Management |
| Component Type | Passive |
| Package Case | MELF (DO-213AB) glass; body length 4.8-5.2 mm, diameter 2.4-2.6 mm, terminal diameter 0.55 mm; recommended footprint 6.50 mm ref., 4.00 mm max., 1.25 mm min. |
| Manufacturer Full Name | Vishay Semiconductors |
| Device Function | Zener diode |
| Technology | Silicon planar power Zener diode |
| Circuit Configuration | Single |
| Nominal Zener Voltage Range | 3.9 to 75 V |
| Test Current Range | 10 to 100 mA |
| Zener Voltage Specification Method | Pulse current |
| Package Name | MELF (DO-213AB) |
| Package Material | Glass |
| Package Weight | approx. 135 mg |
| Molding Compound Flammability Rating | UL 94 V-0 |
| Moisture Sensitivity Level | MSL level 1 |
| Soldering Peak Temperature | 260 °C max. |
| Power Dissipation | 1000 mW |
| Power Dissipation Condition | Tamb=25°C; valid provided electrodes are kept at ambient temperature |
| Thermal Resistance Junction to Ambient Air | 170 K/W |
| Thermal Resistance Junction to Case | 60 K/W |
| Maximum Junction Temperature | 175 °C |
| Storage Temperature Range | -55 to +175 °C |
| Zener Voltage Minimum | 3.7 V |
| Zener Voltage Nominal | 3.9 V |
| Zener Voltage Maximum | 4.1 V |
| Zener Voltage Test Condition | IZT1=100 mA, Tamb=25°C, pulse test tp=5 ms |
| Zener Test Current | 100 mA |
| Reverse Voltage | 0.5 V |
| Reverse Current Maximum | 7 µA |
| Reverse Current Condition | IR at VR=0.5 V, Tamb=25°C |
| Dynamic Resistance Typical | 4 Ω |
| Dynamic Resistance Condition | ZZ at IZT1=100 mA, f=1 kHz, Tamb=25°C |
| Admissible Zener Current | 203 mA |
| Temperature Coefficient of Zener Voltage Minimum | -7 x 10^-4/°C |
| Temperature Coefficient of Zener Voltage Maximum | 2 x 10^-4/°C |
| Temperature Coefficient Condition | αVZ at IZT1=100 mA, Tamb=25°C |
| Ordering Code GS18 | ZMY3V9-series-GS18 |
| GS18 Packaging | 12 mm tape on 13 inch reel; 5000 taped units per reel; 10000 minimum order quantity per box |
| Ordering Code GS08 | ZMY3V9-series-GS08 |
| GS08 Packaging | 12 mm tape on 7 inch reel; 1500 taped units per reel; 12000 minimum order quantity per box |
| Package Body Diameter | 2.4 to 2.6 mm (0.094 to 0.102 inch) |
| Package Body Length | 4.8 to 5.2 mm (0.189 to 0.205 inch) |
| Terminal Diameter | 0.55 mm (0.022 inch) |
| Footprint Length Reference | 6.50 mm (0.256 inch) |
| Footprint Pad Dimension Maximum | 4.00 mm (0.157 inch) |
| Footprint Pad Dimension Minimum | 1.25 mm (0.049 inch) |
| Cathode Identification | Marked on package |
| Datasheet Status | request_only |
Product Overview
ZMY3V9 is a Vishay silicon planar power Zener diode configured as a single device. The datasheet identifies the series as ZMY3V9 to ZMY75, with nominal Zener voltages spanning 3.9 V to 75 V and test currents from 10 mA to 100 mA. For ZMY3V9 specifically, the Zener voltage is 3.7 V minimum, 3.9 V nominal, and 4.1 V maximum at IZT1 = 100 mA, Tamb = 25 °C, using a 5 ms pulse test.
The device is intended for stabilizing and clipping circuits with high power rating. Electrical parameters include 7 µA maximum reverse current at VR = 0.5 V, 4 Ω typical dynamic resistance at 1 kHz, and 203 mA admissible Zener current when electrodes are kept at ambient temperature.
The package is MELF (DO-213AB) glass with approximately 135 mg weight, UL 94 V-0 flammability rating, MSL level 1 according to J-STD-020, and 260 °C maximum soldering peak temperature. Body dimensions are 4.8 mm to 5.2 mm length and 2.4 mm to 2.6 mm diameter, with cathode identification marked on the package.
Key Features
- Single silicon planar power Zener diode configuration
- 3.9 V nominal Zener voltage for ZMY3V9
- 3.7 V to 4.1 V Zener voltage range
- 100 mA Zener test current at 25 °C
- 1000 mW power dissipation at Tamb 25 °C
- 4 Ω typical dynamic resistance at 1 kHz
- 7 µA maximum reverse current at 0.5 V
- MELF DO-213AB glass package construction
- MSL level 1 according to J-STD-020
- 260 °C maximum soldering peak temperature
- Cathode identification marked on package
Typical Applications
- Stabilizing circuits
- Clipping circuits
- High power Zener regulation
- 3.9 V voltage reference nodes
- Surface-mount MELF assemblies
Procurement Notes
When requesting a quote for ZMY3V9, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What type of device is the ZMY3V9?
ZMY3V9 is a Vishay silicon planar power Zener diode. The datasheet identifies it as a single Zener diode intended for stabilizing and clipping circuits with high power rating.
What is the Zener voltage rating for ZMY3V9?
For ZMY3V9, the Zener voltage is 3.7 V minimum, 3.9 V nominal, and 4.1 V maximum at IZT1 = 100 mA, Tamb = 25 °C, using a 5 ms pulse test.
What package does the ZMY3V9 use?
ZMY3V9 uses a MELF (DO-213AB) glass package. The package body is 4.8 mm to 5.2 mm long and 2.4 mm to 2.6 mm in diameter, with a 0.55 mm terminal diameter.
What are the main thermal ratings of ZMY3V9?
The datasheet lists 1000 mW power dissipation at Tamb = 25 °C, 170 K/W junction-to-ambient thermal resistance, 60 K/W junction-to-case thermal resistance, and 175 °C maximum junction temperature.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 26, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.