COB technology mounts multiple LED chips directly onto a metal-core printed circuit board (MCPCB). This design enables direct heat dissipation through the substrate, reducing manufacturing complexity and cost while achieving lower thermal resistance.
COB technology is primarily applied to high-power, multi-chip LED arrays, offering higher power density and lower thermal resistance (typically 6–12 W/m·K) compared with SMD structures. By integrating multiple chips on one board, COB modules achieve higher brightness, balanced current distribution, and efficient heat dissipation over a larger surface area.
From both cost and application perspectives, COB has become the mainstream direction for future luminaire design. Unlike traditional methods — where discrete LED components are first mounted on MCPCB modules and then assembled into luminaires — the COB approach simplifies production.
The “COB module → LED luminaire” route saves labor, time, and packaging costs, while improving overall performance and system integration.
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