📌 Product Overview
The XL-2016 is a compact surface-mount device (SMD) from XINGLIGHT, designed for high-density illumination applications. 📏 Measuring just 2.0 x 1.6 x 0.6 mm, this component utilizes Flip Chip technology to optimize thermal dissipation and luminous efficacy within a minimal footprint.
💡 This component is engineered for environments requiring robust performance and reliability. It features a cool beam operation and is constructed with environmentally friendly materials that comply with ROHS standards. The XL-2016 is particularly suited for designs where space is constrained but high luminous flux is critical.
🚀 Typical Applications
Based on the datasheet parameters, the XL-2016 is optimized for the following use cases:
- Automotive Lighting: Ideal for indicator lights, interior illumination, and exterior signaling.
- Electric Motorcycle Lighting: Provides high-intensity output for headlamps and position lamps.
- Industrial & Commercial Lighting: Suitable for task lighting and compact luminaires.
- General Exterior/Interior Lighting: Versatile use in architectural and consumer electronics.
📊 Key Technical Specifications
📉 The following electrical and optical characteristics are measured at a test temperature of 25°C (Ta=25°C):
| Parameter | Symbol | Test Condition | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | Vf | IF = 350 mA | 2.8 | - | 3.4 | V |
| Luminous Flux | Φ | IF = 350 mA | 100 | - | 150 | LM |
| Color Temperature | TC | IF = 350 mA | 5500 | - | 7500 | K |
| Viewing Angle | 2θ1/2 | IF = 350 mA | - | 120 | - | Deg |
| Junction Temp | Tj | IF = 350 mA | - | - | 145 | °C |
💡 Note: The product features a high Color Rendering Index (CRI) typically rated at 70 Ra and offers an ESD withstand voltage of 2000V (HBM).
⚠️ Absolute Maximum Ratings & Process Limits
🔒 Stressing the device beyond these parameters may result in permanent damage. Operation at absolute maximum limits for extended periods is not recommended.
| Parameter | Symbol | Absolute Maximum Rating | Unit |
|---|---|---|---|
| Power Dissipation | Pd | 3 | W |
| Forward Current | If | 700 | mA |
| Pulse Forward Current | Ifp | 1500 | mA |
| Reverse Voltage | Vr | 5 | V |
| Operating Temperature | Topr | -40 to +135 | °C |
| Storage Temperature | Tstg | -40 to +85 | °C |
⚠️ Soldering Limit: Reflow soldering must not exceed 260°C for 6 seconds to prevent damage to the internal Flip Chip structure.
📦 Package, Dimensions & Assembly Notes
The XL-2016 features a standard 2016 metric package footprint. Key physical characteristics include:
- Dimensions: 2.0 mm (L) x 1.6 mm (W) x 0.6 mm (H).
- Colloid Appearance: Available in White or Yellow Fog finishes.
- MSL Level: Rated at Level 3, allowing for a floor life of up to 168 hours (one week) at <30°C / 60% RH after opening the vacuum seal before baking is required.
🔧 Assembly Guidelines:
- Soldering: Compatible with both Lead (Max 235°C) and Lead-free (Max 255°C) reflow profiles.
- Cooling: Maximum cooling rate should not exceed 6°C/second to prevent thermal shock.
🛒 Sourcing & Supply Considerations
- Binning Management: Components are binned by Luminous Flux (K3-K7), Voltage (N13-3 to N13-5), and Color Temperature (UW7-10 to UW11-10). Procurement must specify exact codes for color consistency.
- Authenticity Verification: Verify packaging markings to ensure MSL 3 compliance and ROHS authenticity for automotive supply chains.
- Sample Evaluation: Request specific bin samples to validate CRI and flux performance in the actual optical assembly before mass production.
❓ Frequently Asked Questions
Q: What is the maximum continuous drive current for the XL-2016? A: The Absolute Maximum Rating for continuous Forward Current (If) is 700 mA. However, typical application parameters are often tested at 350 mA to balance heat generation and lifespan.
Q: Is the XL-2016 suitable for automotive exterior applications? A: Yes, the datasheet explicitly lists "Automotive lighting" and "Exterior lighting applications." The operating temperature range extends up to +135°C, which is necessary for under-hood or exterior environments.
Q: What does the "Flip Chip Technology" feature imply for thermal design? A: Flip chip technology typically implies the die is mounted directly to the substrate, offering lower thermal resistance than wire-bonded alternatives. This allows for better heat extraction from the junction, supporting the high 700mA current rating.
Q: What are the storage requirements to prevent moisture damage? A: The XL-2016 has a Moisture Sensitivity Level (MSL) of 3. If the vacuum-sealed bag is opened, components must be mounted within 168 hours (1 week) or baked according to IPC/JEDEC standards to prevent popcorning during reflow.
Q: Can this LED be used with standard lead-free soldering processes? A: Yes. The datasheet provides a specific profile for Lead-free processing with a peak temperature of 255°C +0/-5°C for 5-10 seconds, compliant with J-STD-020C.
