📌 Product Overview
The XL-4014UPC-02 is a surface-mount device (SMD) LED from XINGLIGHT, housed in a compact 4014 package (4.0mm x 1.4mm x 0.8mm). 💡 This component features a pink light source encapsulated in a matching pink colloid, making it suitable for applications requiring specific monochromatic aesthetics rather than general illumination. Designed for automated assembly, it complies with ROHS environmental standards and is optimized for SMT processes. ⚡ The component is specifically engineered to support high-density integration in decorative lighting and display backlights where space constraints and color consistency are critical factors.
💡 Typical Applications
Based on its optical characteristics and compact form factor, the XL-4014UPC-02 is utilized in specialized scenarios requiring pink hue generation:
- Indoor & Decorative Lighting: Rigid light strips on metal plates and custom ambient lighting fixtures.
- Commercial Displays: 🔝 Advertising boards and signage where specific brand colors are required.
- Backlighting: LCD backlights for indicator panels or small display modules.
- Automotive Interiors: Auxiliary lighting and dashboard indicators.
- Custom Illumination: Specialized light tubes and decorative arrays.
📊 Key Technical Specifications
The following optical and electrical parameters are measured at standard test conditions (Ta=25°C, IF=60mA), allowing engineers to determine power supply requirements and expected brightness output.
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Φ | 6 | 12 | 17 | LM | IF=60mA |
| Forward Voltage | VF | 2.8 | - | 3.4 | V | IF=60mA |
| Viewing Angle | 2θ1/2 | - | 120 | - | Deg | IF=60mA |
| Color Rendering Index | Ra | - | 70 | - | - | IF=60mA |
| Chromaticity (x) | X | - | 0.287 | - | - | IF=60mA |
| Chromaticity (y) | Y | - | 0.117 | - | - | IF=60mA |
| Reverse Current | IR | - | - | 5 | μA | VR=5V |
💡 Engineering Note: The component is available in specific brightness (H5-H8) and voltage (N13-3 to N13-5) bins, facilitating tight consistency in mass production.
⚠️ Absolute Maximum Ratings & Process Limits
Exceeding these limits may cause permanent device failure or degradation. 🔒 These ratings are critical for designing driver circuits and establishing thermal management boundaries.
| Parameter | Symbol | Value | Unit | Notes |
|---|---|---|---|---|
| Max Power Dissipation | PD | 200 | mW | Ta=25°C |
| Max Continuous Forward Current | IF | 60 | mA | - |
| Peak Forward Current | IFP | 120 | mA | Pulse width ≤0.1ms, Duty ≤1/10 |
| Max Reverse Voltage | VR | 5 | V | - |
| ESD Capability | ESD | 2000 | V | Human Body Model (HBM) |
| Operating Temperature | TOPR | -20 ~ +85 | °C | - |
| Storage Temperature | TSTR | -40 ~ +85 | °C | - |
| Soldering Temp/Time | TSOL | 260 | °C | ≤6 Seconds |
⚡ Design Caution: Proper thermal management is required to ensure junction temperature remains within safe limits during high-current operation.
📦 Package, Dimensions & Assembly Notes
The XL-4014UPC-02 utilizes a standard EIA-compliant 4014 footprint, providing a balance between surface area for heat dissipation and minimal board space consumption.
- Dimensions: 4.0mm (L) x 1.4mm (W) x 0.8mm (H).
- Packaging: EIA standard tape and reel for automated placement.
- Moisture Sensitivity: 🚨 Classified as MSL 3. Devices must be baked and reflowed according to IPC/JEDEC J-STD-033 standards to prevent popcorning or delamination.
- Soldering Compatibility: Suitable for infrared reflow soldering processes (both Lead-free and Lead profiles detailed in datasheet).
- Assembly: Designed for high-speed SMT pick-and-place machines.
🏗️ Sourcing & Supply Considerations
When integrating the XL-4014UPC-02 into BOMs, procurement teams should verify specific binning codes (H5-H8, N13-3/4/5) to ensure color and voltage uniformity across batches. 🌐 Supply channels should be validated to guarantee authentic XINGLIGHT products, as off-spec components can lead to visible color variations in decorative arrays. ⏳ Lead times can fluctuate based on bin availability; therefore, securing samples early for prototyping is recommended to validate the specific "Pink" hue against design requirements.
❓ FAQ
Q: What is the recommended reflow soldering profile for this LED?
A: The device supports infrared reflow soldering. For lead-free processes, the max peak temperature is 255°C (with 5-10s time above peak), while leaded processes allow up to 235°C. Always adhere to the ramp-up and cooling rates specified in J-STD-020C to prevent thermal shock.
Q: How strict is the color binning for the pink light?
A: The datasheet provides specific Chromaticity Coordinates (x/y) with BIN numbers #1 and #2. Tight control over these coordinates is essential for applications like advertising boards where uniform pink color perception is critical.
Q: What does MSL 3 mean for my production line?
A: Moisture Sensitivity Level 3 means the components have a floor life of 168 hours after opening the vacuum-sealed bag. If not used within this window, they must be baked at 125°C for a specified duration (usually 24-48 hours) to remove absorbed moisture before reflow soldering.
Q: Can this component be used in high-humidity environments?
A: Electrically, it operates up to 85% RH (implied by operating temp). However, physically, the epoxy colloid is standard. For extreme outdoor or high-humidity exposure, additional conformal coating or specific mechanical sealing is recommended to prevent long-term degradation of the LED colloid.
Q: What is the maximum current I can drive continuously?
A: The Absolute Maximum Rating for continuous forward current is 60mA. Exceeding this, even with good heat sinking, risks irreversible thermal damage to the LED chip.
