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XL-4543PDC SMD LED — Technical Specifications & Design Guide

LED Technology · 2026-04-24

XL-4543PDC SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XL-4543PDC is a 940nm infrared phototransistor characterized by high energy efficiency and fast signal response. 📦 Encapsulated in a black epoxy colloid to minimize ambient light interference, this component is engineered for reliable performance in various photodetection scenarios. Designed for seamless SMT integration, it features an EIA standard-compliant package suitable for high-density PCB assembly.

🚀 Typical Applications

Based on its spectral sensitivity (700–1100nm) and switching speed (Tr/Tf ≤ 30ns), the XL-4543PDC is optimized for:

  • Consumer Electronics: Infrared remote controllers and camera monitoring heads.
  • Industrial Automation: Counters, thermal imaging sensors, and smart metering interfaces.
  • Robotics: Intelligent cars and navigation sensors requiring precise obstacle detection.
  • Wireless Systems: Short-range signal transmission and photoelectric switching logic.

📊 Key Technical Specifications

The table below outlines the electro-optical characteristics (Ta=25°C) essential for circuit design calculations.

ParameterSymbolMinTypMaxUnitTest Condition
Peak Wavelength$\lambda_p$-940-nm-
Light Current$I_L$253545$\mu A$$V_R=5V, E=1.0mW/cm^2$
Dark Current$I_D$--30$nA$$V_R=10V, E=0$
Rise / Fall Time$T_r / T_f$-30-$ns$$V_{CE}=5V, R_L=1k\Omega$
Reverse Voltage$V_r$30--$V$$I_r=100\mu A$
View Angle$2\theta_{1/2}$--$\pm60$deg$\lambda=940nm$

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent device failure. ⚡ Designers must strictly observe the Collector-Emitter voltage and power dissipation limits during operation.

ParameterSymbolMax RatingUnitNotes
Collector-Emitter Voltage$V_{CEO}$30$V$-
Emitter-Collector Voltage$V_{ECO}$5$V$-
Operating Temperature$T_{opr}$-20 ~ +85$^\circ C$Ambient range
Storage Temperature$T_{stg}$-40 ~ +85$^\circ C$-
Soldering (Reflow)$T_{sol}$260$^\circ C$Max 6 seconds
Soldering (Manual)-300$^\circ C$Max 3 seconds

Note: Pulse width must be ≤ 0.1ms with a duty cycle ≤ 1/10.

📐 Package, Dimensions & Assembly Notes

The component features a compact appearance dimension of 4.8 x 4.4 x 8.7 mm.

  • Soldering Profile: 👇 Recommended max reflow temperature is 240°C ± 5°C for 6s.
  • Moisture Sensitivity: Classified as MSL 3. Devices must be baked prior to reflow if moisture-sensitive handling is required to prevent popcorning.
  • Handling: Avoid direct contact with the epoxy encapsulant to prevent contamination or static damage. Do not apply mechanical stress to the resin during high-temperature phases.

📦 Sourcing & Supply Considerations

  • Compliance: 🌱 The product adheres to ROHS environmental directives, ensuring compatibility with global lead-free manufacturing standards.
  • Packaging: Supplied in EIA standard tape and reel formats, facilitating automated feeder setup for pick-and-place machines.
  • Quality Control: Typical luminous intensity error is guaranteed within ±15%, supporting consistent binning for mass production.

❓ Frequently Asked Questions (FAQ)

Q: What is the recommended soldering profile for the XL-4543PDC? A: For lead-free reflow soldering, the peak temperature should not exceed 260°C for 6 seconds. If manual soldering is necessary for repairs, use an iron below 30W and limit contact time to 3 seconds at 300°C to protect the internal die and bonds.

Q: How does the black epoxy colloid affect performance? A: The black encapsulant filters out visible light noise, enhancing the signal-to-noise ratio for the 940nm infrared receiver. This ensures reliable operation in environments with high ambient light intensity, such as near monitors or under industrial lighting.

Q: Can this component be used for high-speed data transmission? A: With a typical rise/fall time of 30ns, the XL-4543PDC supports moderate-speed carrier frequencies common in standard remote control protocols (e.g., 38kHz). However, for very high-speed data links, engineers should verify the bandwidth against specific signal modulation requirements.

Q: What are the storage requirements to prevent damage? A: The storage ambient temperature range is -40°C to +85°C. Given the MSL 3 classification, if the sealed bag has been opened, the components should be soldered within a specified window (usually 168 hours) or baked according to IPC/JEDEC standards to prevent moisture-induced damage during reflow.

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