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XL-504PDC Infrared Receiver: Signal Integration & SMT Specs

The XL-504PDC is a 5mm infrared phototransistor optimized for 940nm signal reception in industrial control and consumer electronics. This technical brief analyzes critical parameters including breakdown voltage, respo...

XL-504PDC Infrared Receiver: Signal Integration & SMT Specs

📌 Product Overview

💡 The XL-504PDC is a discrete 5mm F5 infrared phototransistor designed for 940nm wavelength detection. 🚀 Unlike standard indicator LEDs, this component functions as a receiver unit, translating infrared light signals into electrical currents for processing systems. 👇 It features a black epoxy colloid to filter visible light interference, ensuring signal stability in ambient lighting conditions. 🔒 Designed for through-hole technology (THT) assembly, it provides a robust solution for applications requiring sensor integration on non-SMT PCBs or wire-ridged connections.

🎯 Typical Applications

  • Industrial Control Systems: Used in counters, smart meters, and thermal imaging equipment requiring non-contact signal detection.
  • Consumer Electronics: Essential component in infrared remote controllers for TVs and set-top boxes.
  • Robotics & Automation: Integrated into intelligent cars and robotic sensors for obstacle avoidance and line tracking.
  • Security & Surveillance: Utilized in camera monitoring heads for triggering signals or night-vision communication.
  • Medical Devices: Implemented in equipment needing safe, wireless infrared data transmission or control.
  • Wireless Communication: Facilitates short-range signal transmission between isolated circuits.

⚡ Key Technical Specifications

ParameterSymbolTest ConditionMin / Typ / MaxUnit
Collector-Emitter Breakdown Voltage$V_{(BR)CEO}$$I_C = 100\mu A$30 / - / -V
Emitter-Collector Breakdown Voltage$V_{(BR)ECO}$$I_E = 100\mu A$5 / - / -V
Collector Saturation Voltage$V_{CE(SAT)}$$I_C = 0.1mA$- / - / 0.8V
Collector Dark Current$I_o$$V_{CE} = 10V$- / - / 100nA
On-state Collector Current$I_{(on)}$$E_e = 1mW/cm^2$, $\lambda=940nm$-mA
Rise Time$t_r$$V_{CE}=5V, R_L=100\Omega$- / 3 / -$\mu s$
Fall Time$t_f$$V_{CE}=5V, R_L=100\Omega$- / 3 / -$\mu s$

📈 Note: Luminous intensity guarantees a simulated error of $\pm 15%$. Response times are critical for high-frequency signal transmission.

⚠️ Absolute Maximum Ratings & Process Limits

ParameterSymbolMaximum RatingUnit
Collector-Emitter Voltage$V_{CEO}$30V
Emitter-Collector Voltage$V_{ECO}$5V
Operating Temperature$T_{opr}$-20 to +85°C
Storage Temperature$T_{stg}$-40 to +85°C
Soldering (Reflow)$T_{sol}$240°C (≤6s)
Soldering (Manual)$T_{sol}$300°C (≤3s)

🔒 Critical Design Warning:

  • Pulse Handling: Ensure pulse width $\le 0.1ms$ and duty cycle $\le 1/10$ to prevent junction degradation.
  • Lead Forming: Bending stress must be minimized; bend points must be at least 2.0mm away from the epoxy colloid base to prevent seal damage.
  • Cleaning: Do not use harsh chemicals (Trichloroethylene, Acetone). Use Ethanol only for $<3$ minutes at room temperature.

📦 Package, Dimensions & Assembly Notes

  • Package Type: F5 Round Radial Lead.
  • Dimensions: Diameter $\approx 5.0mm$, Height $\approx 8.7mm$. Pitch and lead span adhere to EIA standard packaging.
  • Moisture Sensitivity: Classified as MSL 2. Components must be stored in $<30^{\circ}C / <70%$ RH environments.
  • Assembly:
    👇 Support forming must use fixtures to ensure consistent pin spacing matching the PCB layout.
    🚀 Soldering should occur after lead forming. Avoid applying mechanical pressure to the base once soldered to the PCB.

🏗️ Sourcing & Supply Considerations

  • Packaging Standard: Components are supplied in moisture-proof and anti-electrostatic foil bags, often in bulk quantities for volume manufacturing.
  • Authenticity Check: Verify the "XINGLIGHT" brand laser marking and confirm ROHS compliance certificates upon receipt.
  • BOM Integration: Suitable as a drop-in replacement for standard 5mm phototransistors in 940nm systems, provided pin-out and voltage limits are observed.
  • Sample Evaluation: Request binning data for light current ($I_{(on)}$) to ensure consistency in sensitivity across large batches.

❓ Frequently Asked Questions

Q: What is the operating wavelength range for the XL-504PDC?
A: The XL-504PDC is optimized for 940nm infrared light. It features a black colloid that filters out visible light, reducing noise from ambient sunlight or indoor lighting.

Q: Can this component be used for surface mount (SMT) assembly lines?
A: No, the XL-504PDC is a through-hole (THT) component with radial leads. It is designed for manual insertion or wave soldering processes, not reflow ovens (despite reflow temp ratings being provided for testing limits).

Q: What is the shelf life of the XL-504PDC?
A: The datasheet recommends using the components within 3 months of receipt if kept in the original packaging. For longer storage, use a dry box with desiccant or nitrogen.

Q: How do I prevent damage during the lead forming process?
A: Always use a professional fixture or jig. Ensure the bend point is at least 2mm away from the colloid body to avoid cracking the epoxy seal or stressing the internal wire bonds.

Q: What is the maximum switching speed I can achieve?
A: The typical rise and fall times ($t_r, t_f$) are 3$\mu s$. This supports signal switching up to approximately 100kHz, making it suitable for standard remote control protocols (NEC, RC5) but not for high-speed data fiber optics.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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