📌 Product Overview
The XL-PD638C is a silicon photodiode optimized for 940nm infrared reception, housed in a transparent epoxy package with dimensions of 7.6mm x 5.25mm x 2.75mm. This component is engineered to convert light signals into electrical currents in applications requiring fast response times. 👉 With a Reverse Light Current ($I_L$) range of 15μA to 25μA and a Rise Time of 50μs, it serves as a critical sensor node in non-contact switching and data transmission systems.
🛠 Typical Applications
Based on its spectral characteristics and environmental ratings, the XL-PD638C is deployed across the following scenarios:
- Industrial Automation: Counters, thermal imaging sensors, and smart metering infrastructure.
- Consumer Electronics: Infrared remote controllers for home appliances.
- Robotics: Intelligent cars and obstacle detection systems requiring fast reaction.
- Security: Camera monitoring heads and optical data transmission modules.
⚡ Key Technical Specifications
💡 The table below outlines the optoelectronic performance under standard test conditions ($T_a=25^{\circ}C$), critical for signal integrity calculations.
| Parameter | Symbol | Test Condition | Min / Typ / Max | Unit |
|---|---|---|---|---|
| Peak Sensitivity | $\lambda_P$ | - | / 940 / | nm |
| Spectral Range | $\lambda_{0.5}$ | - | 400 / / 1100 | nm |
| Reverse Light Current | $I_L$ | $V_R=5V, E_e=1mW/cm^2$ | 15 / 25 / | $\mu A$ |
| Reverse Dark Current | $I_D$ | $V_R=10V, E_e=0$ | / 5 / 30 | $nA$ |
| Total Capacitance | $C_t$ | $V_R=5V, f=1MHz$ | / 25 / | $pF$ |
| Rise/Fall Time | $T_r / T_f$ | $V_R=10V, R_L=1k\Omega$ | / 50 / | $\mu S$ |
⚠️ Absolute Maximum Ratings & Process Limits
🔒 Exceeding these limits risks permanent damage to the diode junction or package integrity. Design margins must account for these absolute boundaries to prevent thermal runaway during soldering or operation.
| Parameter | Symbol | Maximum Rating | Unit | Notes |
|---|---|---|---|---|
| Power Dissipation | $P_d$ | 150 | mW | Derating necessary above 25°C |
| Reverse Voltage | $V_R$ | 32 | V | Continuous operation limit |
| Operating Temp. | $T_{opr}$ | -40 ~ +85 | °C | Ambient range |
| Storage Temp. | $T_{stg}$ | -40 ~ +85 | °C | Non-operating |
| Soldering Temp. | $T_{sol}$ | 260 | °C | Max 6 Seconds duration |
📦 Package, Dimensions & Assembly Notes
The device utilizes an EIA standard compliant package with a moisture sensitivity level (MSL) of 3.
- Dimensions: The outline measures 7.6 x 5.25 x 2.75mm. Note that tolerances are $\pm 0.30mm$ unless otherwise specified.
- Soldering Guidelines:
- Wave Soldering: Recommended max temperature is $240^{\circ}C$ for $\le 6$ seconds.
- Manual Soldering: Iron tip temp must be $< 300^{\circ}C$ for $< 3$ seconds per terminal.
- 👉 Caution: Do not apply mechanical stress to the leads during heating or warp the PCB after soldering.
- Cleaning: Use ethanol only; avoid chemicals like Trichloroethylene or Acetone which may damage the transparent colloid.
🚢 Sourcing & Supply Considerations
When integrating the XL-PD638C into a BOM, consider the following supply chain factors:
- Packaging: Verify receipt in moisture-proof anti-static bags to prevent MSL degradation.
- Storage: Components must be used within 3 months of original sealing; longer storage requires nitrogen cabinets or desiccants.
- Authenticity: Source through XINGLIGHT authorized channels to ensure ROHS compliance and correct binning (Rank BIN1-BIN4).
- 🚀 Lead Time: Check availability for high-volume industrial runs to avoid production bottlenecks.
❓ Frequently Asked Questions
Q: What is the typical wavelength sensitivity for this diode? A: The XL-PD638C has a peak sensitivity wavelength ($\lambda_P$) of 940nm, making it ideal for standard infrared receivers. It covers a spectral bandwidth range from 400nm to 1100nm.
Q: Can this component be used for high-temperature industrial environments? A: Yes, the operating ambient temperature ($T_{opr}$) is rated from -40°C to +85°C. However, power dissipation ($P_d$) should be managed to ensure the junction temperature does not exceed safety limits.
Q: What are the specific soldering constraints to prevent damage? A: The maximum soldering temperature is 260°C for 6 seconds (Max). However, XINGLIGHT recommends a lower profile of 240°C/6s for optimal yield. Mechanical stress must not be applied to the leads while hot.
Q: How should I handle the MSL Level 3 packaging? A: MSL 3 means the component can withstand floor life of up to 168 hours (in climate <30°C/60% RH) after opening the moisture-proof bag before baking or reflow soldering is required.
Q: What is the Reverse Voltage limit? A: The absolute maximum Reverse Voltage ($V_R$) is 32V. Exceeding this may cause reverse breakdown (BVR), which is characterized at $I_R=100\mu A$.
Q: Are there specific cleaning agents recommended for the transparent colloid? A: Do not use ketones or harsh solvents. XINGLIGHT specifies that wiping or soaking with ethanol at room temperature for less than 3 minutes is safe.
