Specifications
| Type | Description |
|---|---|
| Part Number | 333-2UTC_S400-A6 |
| Manufacturer | EVERLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | T-1 round package; dimensions in mm with general tolerance 0.25 mm except specified; lead spacing measured where lead emerges from package; protruded resin under flange 1.5 mm max |
| Chip Material | InGaN |
| Emitted Color | White |
| Resin Color | Water Clear |
| Continuous Forward Current | 30 mA, absolute maximum rating, Ta=25°C |
| Peak Forward Current | 100 mA, duty 1/10 at 1 kHz, Ta=25°C |
| Reverse Voltage | 5 V, absolute maximum rating, Ta=25°C |
| Power Dissipation | 100 mW, absolute maximum rating, Ta=25°C |
| Operating Temperature | -40 to +85 °C |
| Storage Temperature | -40 to +100 °C |
| Zener Reverse Current | 100 mA, absolute maximum rating, Ta=25°C |
| Soldering Temperature | 260 °C for 5 sec |
| Forward Voltage | min 2.8 V, max 3.6 V at IF=20 mA, Ta=25°C |
| Zener Reverse Voltage | min 5.3 V at IZ=5 mA, Ta=25°C |
| Reverse Current | max 50 µA at VR=5 V, Ta=25°C |
| Luminous Intensity | min 14250 mcd, max 28500 mcd at IF=20 mA, Ta=25°C |
| Viewing Angle | typ 15 deg, 2θ1/2, IF=20 mA, Ta=25°C |
| Chromaticity Coordinate x | typ 0.29 at IF=20 mA, Ta=25°C, CIE1931 |
| Chromaticity Coordinate y | typ 0.30 at IF=20 mA, Ta=25°C, CIE1931 |
| Luminous Intensity Bin W | 14250 to 18000 mcd at IF=20 mA |
| Luminous Intensity Bin X | 18000 to 22500 mcd at IF=20 mA |
| Luminous Intensity Bin Y | 22500 to 28500 mcd at IF=20 mA |
| Luminous Intensity Tolerance | ±10% |
| Forward Voltage Bin 0 | 2.8 to 3.0 V at IF=20 mA |
| Forward Voltage Bin 1 | 3.0 to 3.2 V at IF=20 mA |
| Forward Voltage Bin 2 | 3.2 to 3.4 V at IF=20 mA |
| Forward Voltage Bin 3 | 3.4 to 3.6 V at IF=20 mA |
| Forward Voltage Measurement Uncertainty | ±0.1 V |
| Color Coordinate Measurement Uncertainty | ±0.01 |
| ESD Withstand Voltage | up to 4 kV |
| Hand Soldering Tip Temperature | 300 °C max; 30 W max iron; 3 sec max; 3 mm min from solder joint to epoxy bulb |
| DIP Soldering Preheat Temperature | 100 °C max for 60 sec max |
| DIP Soldering Bath Temperature and Time | 260 °C max, 5 sec max; 3 mm min from solder joint to epoxy bulb |
| Storage Condition After Shipment | 30°C or less and 70% RH or less; storage life limit 3 months after shipment from Everlight |
| Extended Storage Condition | up to 1 year in sealed container with nitrogen atmosphere and moisture absorbent material after 3 months or more storage |
| Packing Quantity | 200 to 500 pcs per bag; 5 bags per inner carton; 10 inner cartons per outside carton |
| Datasheet Status | request_only |
Product Overview
EVERLIGHT 333-2UTC_S400-A6 is a white through-hole LED lamp using InGaN chip material and water-clear resin. The package is a T-1 round form, with dimensions specified in millimeters, a general tolerance of 0.25 mm except where otherwise specified, and lead spacing measured where the lead emerges from the package. Protruded resin under the flange is limited to 1.5 mm maximum.
Electrical ratings include 30 mA continuous forward current, 100 mA peak forward current under duty 1/10 at 1 kHz, 5 V reverse voltage, and 100 mW power dissipation at Ta=25°C. Optical and electrical characteristics at IF=20 mA include 2.8 to 3.6 V forward voltage, 14250 to 28500 mcd luminous intensity, and a typical 15-degree viewing angle.
Assembly guidance includes 260°C soldering for 5 seconds, hand soldering at 300°C maximum for 3 seconds, and DIP soldering with 100°C maximum preheat for 60 seconds. The device suits through-hole indicator and signaling applications where white emission, defined intensity bins, and compact T-1 mounting are required.
Key Features
- White emission with water-clear resin body
- InGaN chip material for white LED output
- T-1 round through-hole lamp package
- 30 mA continuous forward current rating
- 100 mA peak forward current rating
- 2.8 to 3.6 V forward voltage at 20 mA
- 14250 to 28500 mcd luminous intensity range
- Typical 15 degree viewing angle at 20 mA
- ESD withstand voltage specified up to 4 kV
- 260°C soldering temperature for 5 seconds
Typical Applications
- Panel status indicators
- Through-hole signal lamps
- White indicator lighting
- Compact equipment indicators
- Narrow-angle visual signaling
- PCB-mounted lamp positions
- Service and control panels
Procurement Notes
When requesting a quote for 333-2UTC_S400-A6, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of LED is 333-2UTC_S400-A6?
333-2UTC_S400-A6 is an EVERLIGHT white through-hole LED lamp. The extracted datasheet facts identify it as an LED using InGaN chip material, white emitted color, water-clear resin, and a T-1 round package.
What forward voltage range is specified at 20 mA?
At IF=20 mA and Ta=25°C, the forward voltage is specified from 2.8 V minimum to 3.6 V maximum. The datasheet also lists voltage bins from 2.8 to 3.0 V through 3.4 to 3.6 V.
What luminous intensity range does this LED provide?
At IF=20 mA and Ta=25°C, luminous intensity is specified from 14250 mcd minimum to 28500 mcd maximum. The listed luminous intensity bins are W, X, and Y, with a measurement tolerance of ±10%.
What soldering limits apply to this through-hole LED?
The general soldering temperature rating is 260°C for 5 seconds. For hand soldering, the tip temperature is 300°C maximum for 3 seconds using a 30 W maximum iron, with at least 3 mm from the solder joint to the epoxy bulb.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.