LM1117IMPX-3.3-NOPB Low-Dropout Linear Regulator

Specifications

Product Overview

LM1117IMPX-3.3-NOPB is the Texas Instruments LM1117I-3.3 fixed-output member of the LM1117 low-dropout linear regulator family. The device is specified as a 3.3 V regulator with an 800 mA output current capability and ±1% band-gap reference accuracy. The family also includes fixed 1.8 V, 2.5 V, 3.3 V, and 5 V outputs, plus an adjustable version covering 1.25 V to 13.8 V with two external resistors.

For operation, the recommended VIN-to-GND maximum is 15 V, while the absolute maximum input rating is 20 V. The LM1117I operating junction temperature range is -40°C to 125°C, with an absolute maximum junction temperature of 150°C and storage range of -65°C to 150°C. Protection functions include current limiting and thermal shutdown, and power dissipation is internally limited.

The part uses the DCY SOT-223 package with 4 pins and a 6.50 mm × 3.50 mm nominal body. SOT-223 pin 3 is VIN, pins 2 and 4/tab are VOUT, and pin 1 is ADJ/GND, serving as ground for the fixed-output option. A 10 µF minimum tantalum output capacitor is required for transient response and stability.

Key Features

• 3.3 V fixed-output low-dropout linear regulator
• 800 mA specified output current capability
• 1.2 V dropout stated at 800 mA
• ±1% output voltage accuracy from band-gap reference
• 10 µF minimum tantalum output capacitor required
• Current limiting and thermal shutdown protection
• 15 V recommended maximum input voltage
• -40°C to 125°C recommended junction temperature range
• DCY SOT-223 package with 4 pins
• Ripple regulation typ 75 dB, min 60 dB

Typical Applications

• Local 3.3 V power rails
• Post-regulation from higher supply rails
• Embedded controller supply regulation
• Power_Management regulator circuits
• Ripple-filtered linear supply outputs
• Thermally limited SOT-223 designs

Procurement Notes

When requesting a quote for LM1117IMPX-3.3-NOPB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.