LTST-C171TBKT Chip LED

Chip LED — specifications, applications, sourcing support and RFQ.

LTST-C171TBKT Chip LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
LTST-C171TBKT
Manufacturer
Lite-On
Package
Not specified; affected chip LED die dimensions include original (L)229 x (W)178 x (T)80 um, new (L)200 x (W)300 x (T)90 um and (L)178 x (W)221 x (T)90 um
Category
LED
Product Type
SMD LED

Quick Sourcing Note

LTST-C171TBKT is a Lite-On Chip LED in the LED category. The referenced manufacturer document is Product / Process Change Notification PCN-20210076, covering affected chip LED part numbers and the introduction of additional dice materials. The package case is not specified in the extracted facts, but affected die dimensions are documented: original die size is 229 x 178 x 80 um, with new die options of 200 x 300 x 90 um and 178 x 221 x 90 um. Lite-On states the change was made to mitigate potential risk to supply continuity, with alternative dice qualified in its materials pool.

Specifications

TypeDescription
Part NumberLTST-C171TBKT
ManufacturerLite-On
Product TypeSMD LED
CategoryLED
Inferred CategoryLED
Component TypeLED
Package CaseNot specified; affected chip LED die dimensions include original (L)229 x (W)178 x (T)80 um, new (L)200 x (W)300 x (T)90 um and (L)178 x (W)221 x (T)90 um
Document TypeProduct / Process Change Notification
PCN NumberPCN-20210076
Effective DateSep. 1st 2021
Product ClassChip LED
Affected Part NumberLTST-C171TBKT
Change DescriptionIntroduction of additional dice materials
Reason for ChangeMitigate potential risk to supply continuity
Alternative Material QualificationAlternative dice qualified in Lite-On materials pool
Original Die Length229 um
Original Die Width178 um
Original Die Thickness80 um
New Die Option 1 Length200 um
New Die Option 1 Width300 um
New Die Option 1 Thickness90 um
New Die Option 2 Length178 um
New Die Option 2 Width221 um
New Die Option 2 Thickness90 um
Reliability QualificationLite-On internal qualification process implemented
Quality Requirement StatementDevices meet and exceed Lite-On quality and reliability requirements
Running Change DateSep. 1st 2021
Customer Response Window1 month after PCN issuance date
Issue DateJun 1st 2021
Issuing OrganizationLITEON OPS SMD LOB
Datasheet Statusrequest_only

Product Overview

LTST-C171TBKT is listed by Lite-On as an affected Chip LED part number in Product / Process Change Notification PCN-20210076. The document describes the introduction of additional dice materials for chip LED products, with the change effective Sep. 1st 2021 and issued on Jun 1st 2021 by LITEON OPS SMD LOB.

The extracted facts do not specify a package case outline. The documented structure-level change concerns die dimensions: the original die is 229 um long, 178 um wide, and 80 um thick. Two new die options are listed: 200 x 300 x 90 um and 178 x 221 x 90 um.

Lite-On identifies the reason for change as mitigation of potential risk to supply continuity through an alternative bill of materials. The alternative dice are qualified in the Lite-On materials pool, and Lite-On states that its internal qualification process was implemented for alternative material reliability evaluation.

Key Features

  • Lite-On LTST-C171TBKT affected Chip LED part number
  • Covered by PCN-20210076 product/process notification
  • Additional dice materials introduced for chip LED products
  • Original die dimensions are 229 x 178 x 80 um
  • New die option one is 200 x 300 x 90 um
  • New die option two is 178 x 221 x 90 um
  • Alternative dice qualified in Lite-On materials pool
  • Internal qualification process implemented for alternative material reliability
  • Running change date listed as Sep. 1st 2021
  • PCN issued by LITEON OPS SMD LOB

Typical Applications

  • Chip LED material review
  • Supply continuity planning
  • Alternative BOM qualification tracking
  • PCN impact assessment
  • Die dimension comparison
  • Sourcing support and RFQ

Procurement Notes

When requesting a quote for LTST-C171TBKT, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What type of component is LTST-C171TBKT?

LTST-C171TBKT is identified in the extracted facts as a Lite-On Chip LED and is listed in the LED category. It appears as an affected part number in Product / Process Change Notification PCN-20210076.

What changed for LTST-C171TBKT in the PCN?

The PCN describes the introduction of additional dice materials for affected chip LED part numbers, including LTST-C171TBKT. Lite-On states the reason was to mitigate potential risk to supply continuity through an alternative bill of materials.

What die dimensions are listed for this Chip LED?

The original die dimensions are 229 um length, 178 um width, and 80 um thickness. New die option one is 200 x 300 x 90 um, and new die option two is 178 x 221 x 90 um.

Is a package case specified for LTST-C171TBKT?

The extracted facts do not specify a package case outline. They identify the product class as Chip LED and provide affected die dimensions for the original and new die material options.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 31, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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