TPS5430DDAR 3A Step-Down Buck Converter

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

TPS5430DDAR 3A Step-Down Buck Converter

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Part Number
TPS5430DDAR
Manufacturer
Texas Instruments
Package
DDA, 8-pin HSOIC PowerPAD thermal pad package
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

TPS5430DDAR from Texas Instruments is a Power_Management Power_IC configured as a 3A step-down buck converter in a DDA, 8-pin HSOIC PowerPAD thermal pad package. It supports a 5.5-36 V recommended input range, 3 A continuous output current, 4 A peak current, and an adjustable output down to 1.22 V. The converter uses constant-frequency voltage-mode control with voltage feedforward and switches at 400-600 kHz across -40°C to 125°C junction temperature. Key design parameters include up to 95% efficiency, internal slow-start, enable control, UVLO, overcurrent hiccup protection, and thermal shutdown.

Specifications

TypeDescription
Part NumberTPS5430DDAR
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Component TypePower_IC
Package / CaseDDA, 8-pin HSOIC PowerPAD thermal pad package
Input Voltage Range5.5-36 V; TPS5430 recommended operating condition
Output Current3 A continuous, 4 A peak; device feature specification
Switching Frequency400 min, 500 typ, 600 max kHz; TJ=-40°C to 125°C, VIN=5.5 V to 36 V
Output Voltage RangeAdjustable down to 1.22 V; 1.5% initial accuracy
EfficiencyUp to 95%; enabled by integrated MOSFET switch
Feedback Voltage1.202 min, 1.221 typ, 1.239 max V; TJ=25°C
Feedback Voltage1.196 min, 1.221 typ, 1.245 max V; TJ=-40°C to 125°C
VIN Quiescent Current2 typ, 4.4 max mA; non-switching, VSENSE=2 V, PH pin open
VIN Shutdown Supply Current15 typ, 50 max µA; shutdown, ENA=0 V
VIN UVLO Rising Threshold5.3 min, 5.5 max V; VVIN rising
VIN UVLO Hysteresis0.35 typ V; undervoltage lockout
Minimum On Pulse Width150 typ, 200 max ns; TJ=-40°C to 125°C, VIN=5.5 V to 36 V
Maximum Duty Cycle87% min, 89% typ; fSW=500 kHz
ENA Rising Threshold1.3 V; device starts switching above this threshold
ENA Falling Threshold0.5 V; device stops switching below this threshold
ENA Hysteresis325 mV; enable pin threshold hysteresis
ENA Pullup Resistance1.5 MΩ; internal pullup resistor, ENA can be left floating
Internal Slow-Start Time5.4 min, 8 typ, 10 max ms; 0 to 100%
High-Side Peak Current Limit4.0 min, 5.0 typ, 6.0 max A; overcurrent protection
Hiccup Time Before Restart13 min, 16 typ, 20 max ms; overcurrent protection
High-Side MOSFET On-Resistance100 typ, 230 max mΩ; VIN=12 V, VBOOT-SW=4.5 V
High-Side MOSFET On-Resistance125 typ mΩ; VIN=5.5 V, VBOOT-SW=4.0 V
Thermal Shutdown Threshold135 min, 162 typ °C; temperature rising, specified by design/statistical analysis/correlated testing
Thermal Shutdown Hysteresis14 typ °C; specified by design/statistical analysis/correlated testing
Operating Junction Temperature-40 to 125 °C; recommended operating condition
Absolute Maximum VIN to GND-0.3 to 40 V; TPS5430 absolute maximum rating
Absolute Maximum ENA to GND-0.3 to 7 V; absolute maximum rating
Absolute Maximum VSENSE to GND-0.3 to 3 V; absolute maximum rating
Absolute Maximum BOOT to PH-0.3 to 6 V; BOOT-PH capacitor rated at least 10 V
Absolute Maximum PH to GND-0.6 to 40 V; TPS5430 steady-state absolute maximum rating
PH Transient Voltage-1.2 V; transient less than 10 ns
PH Leakage Current10 µA; absolute maximum source current leakage current
Absolute Maximum Operating Virtual Junction Temperature-40 to 150 °C; absolute maximum rating
Storage Temperature-65 to 150 °C; absolute maximum rating
ESD Rating HBM±2000 V; human-body model per ANSI/ESDA/JEDEC JS-001
ESD Rating CDM±750 V; charged-device model per JEDEC JESD22-C101
Junction-to-Ambient Thermal Resistance45 °C/W; DDA package, TPS5430EVM
Junction-to-Ambient Thermal Resistance42.3 °C/W; DDA package, JESD 51-7 4-layer JEDEC board
Junction-to-Case Top Thermal Resistance46 °C/W; DDA package
Junction-to-Board Thermal Resistance15 °C/W; DDA package
Junction-to-Top Characterization Parameter5.2 °C/W; DDA package
Junction-to-Board Characterization Parameter15.3 °C/W; DDA package
Junction-to-Case Bottom Thermal Resistance6 °C/W; DDA package
BOOT Pin Capacitor0.01 µF; low ESR capacitor from BOOT pin to PH pin
Control TopologyConstant-frequency voltage-mode control with voltage feedforward
Datasheet Statusrequest_only

Product Overview

TPS5430DDAR is a Texas Instruments Power_Management Power_IC for step-down conversion. The device is specified as a 3A buck converter with 3 A continuous output current and 4 A peak capability. Its recommended input range is 5.5-36 V, and the output is adjustable down to 1.22 V with 1.5% initial accuracy.

The converter uses constant-frequency voltage-mode control with voltage feedforward. Switching frequency is specified from 400 kHz minimum to 600 kHz maximum, with 500 kHz typical, across TJ=-40°C to 125°C and VIN=5.5 V to 36 V. The feedback reference is 1.221 V typical, and the device includes an internal 5.4-10 ms slow-start interval.

TPS5430DDAR is supplied in the DDA, 8-pin HSOIC PowerPAD thermal pad package. Package thermal data includes 45°C/W junction-to-ambient on the TPS5430EVM and 42.3°C/W on a JESD 51-7 4-layer JEDEC board. Protection and control functions include VIN UVLO, enable thresholds, high-side peak current limit, hiccup restart timing, and thermal shutdown.

Key Features

  • 5.5-36 V recommended input voltage range
  • 3 A continuous and 4 A peak output current
  • Adjustable output voltage down to 1.22 V
  • 400-600 kHz switching frequency across operating range
  • Up to 95% efficiency with integrated MOSFET switch
  • Constant-frequency voltage-mode control with voltage feedforward
  • Internal slow-start specified from 5.4 ms to 10 ms
  • High-side peak current limit from 4.0 A to 6.0 A
  • Hiccup restart timing for overcurrent protection
  • Thermal shutdown threshold of 135°C minimum, 162°C typical
  • Enable input with internal 1.5 MΩ pullup
  • DDA 8-pin HSOIC PowerPAD thermal pad package

Typical Applications

  • 5.5-36 V step-down rails
  • 3 A regulated outputs
  • Adjustable 1.22 V output supplies
  • 12 V input buck conversion
  • 24 V input buck conversion
  • PowerPAD thermal designs
  • Enable-controlled power rails
  • Voltage-mode buck regulator designs

Procurement Notes

When requesting a quote for TPS5430DDAR, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What input voltage range does TPS5430DDAR support?

TPS5430DDAR is specified for a 5.5-36 V input voltage range under the TPS5430 recommended operating condition. The absolute maximum VIN-to-GND rating is -0.3 to 40 V.

How much output current can TPS5430DDAR provide?

The device feature specification lists 3 A continuous output current and 4 A peak output current. High-side peak current limit is specified from 4.0 A minimum to 6.0 A maximum.

What package is used for the TPS5430DDAR device?

TPS5430DDAR uses the DDA, 8-pin HSOIC PowerPAD thermal pad package. Thermal data includes 45°C/W junction-to-ambient on the TPS5430EVM and 42.3°C/W on a JESD 51-7 4-layer JEDEC board.

What switching frequency is specified for TPS5430DDAR?

The switching frequency is specified as 400 kHz minimum, 500 kHz typical, and 600 kHz maximum across TJ=-40°C to 125°C with VIN from 5.5 V to 36 V.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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