TPS54331DR Step-Down DC-DC Converter

Specifications

Product Overview

TPS54331DR is a Texas Instruments step-down DC-DC converter in the Power_Management category. The device uses an integrated high-side MOSFET to support up to 3 A continuous output current, with a recommended VIN operating range of 3.5 to 28 V and adjustable output regulation down to 0.8 V through the feedback reference.

The converter operates at a switching frequency of 456 kHz minimum, 570 kHz typical, and 684 kHz maximum under VIN=12 V and TJ=25°C conditions. Control and protection-related parameters include 3.5 V internal undervoltage lockout, 1.25 V to 1.35 V enable threshold, 3.5 A minimum to 5.8 A maximum current-limit threshold, 165°C thermal shutdown, and 160 mA Eco-mode pulse-skipping threshold.

Package options are D (SOIC-8) or DDA (SO PowerPAD-8), with nominal package size of 4.90 mm × 6 mm. Assembly notes include a required 0.1 µF bootstrap capacitor between BOOT and PH pins and, for the DDA package, connection of the GND pin to the exposed pad for proper operation.

Key Features

• 3.5 to 28 V recommended VIN operating range
• Up to 3 A continuous output current
• Adjustable regulated output voltage down to 0.8 V
• 570 kHz typical switching frequency at VIN=12 V
• Integrated high-side MOSFET with 80 mΩ typical resistance
• 1 µA typical shutdown supply current at EN=0 V
• Internal undervoltage lockout threshold at 3.5 V
• Pulse-skipping Eco-mode threshold at 160 mA
• Thermal shutdown threshold at 165°C junction temperature
• Minimum controllable on time of 130 ns typical
• Maximum controllable duty ratio of 93% typical
• 0.1 µF bootstrap capacitor required between BOOT and PH

Typical Applications

• Step-down DC-DC conversion
• 3 A point-of-load rails
• Low-voltage rails down to 0.8 V
• 28 V input bus regulation
• Enable-controlled power rails
• Eco-mode light-load supplies
• SOIC-8 power management assemblies
• PowerPAD thermal assembly designs

Procurement Notes

When requesting a quote for TPS54331DR, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.