TUSB522P USB 3.1 Gen 1 Redriver

Texas Instruments Signal_Chain — specifications, applications, sourcing support and RFQ.

TUSB522P USB 3.1 Gen 1 Redriver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
TUSB522P
Manufacturer
Texas Instruments
Package
RGE 24-pin VQFN
Category
Signal Chain
Product Type
Operational Amplifier

Quick Sourcing Note

TUSB522P from Texas Instruments is a Signal_Chain USB 3.1 Gen 1 redriver in an RGE 24-pin VQFN package. It supports 5 Gbps operation as a dual-channel, single-lane USB redriver with a nominal 3.3 V supply. Key signal-conditioning settings include receiver equalization of 3 dB, 6 dB, or 9 dB at 2.5 GHz, output de-emphasis of 0 dB, -3.5 dB, or -6.2 dB, and output swing settings of 0.9 mV or 1.1 mV. It is suited to USB 3.1 Gen 1 signal-chain designs requiring AC-coupled differential channels, CMOS control inputs, and defined power-state currents.

Specifications

TypeDescription
Part NumberTUSB522P
ManufacturerTexas Instruments
Product TypeOperational Amplifier
CategorySignal Chain
Package / CaseRGE 24-pin VQFN
Supported InterfaceUSB 3.1 Gen 1; 5 Gbps dual-channel redriver
Data Rate5 Gbps; USB 3.1 Gen 1 operation
Number of Channels2 channels; dual-channel single-lane USB redriver
Supply Voltage3.3 V nominal power supply
Main Power Supply3.0 V min, 3.3 V nom, 3.6 V max; recommended operating conditions
Supply Ramp Requirement100 ms max; recommended operating conditions
Supply Noise on VCC100 mV max; recommended operating conditions
Operating Free-Air Temperature, TUSB522P0°C to 70°C; commercial temperature range
Operating Free-Air Temperature, TUSB522PI-40°C to 85°C; industrial temperature range
External AC Coupling Capacitor75 nF min, 100 nF nom, 265 nF max; C_AC-USB1 recommended operating conditions
Active Supply Current98 mA typ; link in U0 with Gen1 data transmission, RSV and EQ control pins NC, EN_RXD=VCC, k28.5 pattern at 5 Gbps, VID=1000 mVpp, OS=900 mV, DE=3.5 dB
U2/U3 Supply Current1.2 mA typ; link in U2 or U3
Disconnect Mode Supply Current265 µA typ; link in disconnect mode
Shutdown Supply Current60 µA typ; EN_RXD=Low
Receiver Equalization Gain3 dB, 6 dB, 9 dB at 2.5 GHz; EQ1/EQ2 low=3 dB, mid=6 dB, high=9 dB
Output De-Emphasis0 dB, -3.5 dB, -6.2 dB; DE1/DE2 low=0 dB, mid=-3.5 dB, high=-6.2 dB
Output Swing Setting0.9 mV or 1.1 mV; OS1/OS2 low=0.9 mV, high=1.1 mV as stated in pin functions
Enable Pin Pulldown Resistance660 kΩ; EN_RXD input, device active when EN_RXD=High
Recommended EN_RXD Pullup4.7 kΩ; normal operation when pullup resistor is installed
Absolute Maximum Supply Voltage-0.5 V to 4 V; VCC range with respect to GND
Absolute Maximum Differential I/O Voltage-0.5 V to 1.5 V; any differential input or output terminal
Absolute Maximum CMOS Input Voltage-0.5 V to 4 V; CMOS input terminals
Maximum Junction Temperature105°C; absolute maximum rating
Storage Temperature-65°C to 150°C; absolute maximum rating
HBM ESD Rating±2000 V; ANSI/ESDA/JEDEC JS-001
CDM ESD Rating±500 V; JEDEC JESD22-C101
Junction-to-Ambient Thermal Resistance51.2°C/W; RGE VQFN 24-pin package
Junction-to-Case Top Thermal Resistance55.9°C/W; RGE VQFN 24-pin package
Junction-to-Board Thermal Resistance28.3°C/W; RGE VQFN 24-pin package
Junction-to-Top Characterization Parameter2.0°C/W; RGE VQFN 24-pin package
Junction-to-Board Characterization Parameter28.3°C/W; RGE VQFN 24-pin package
Junction-to-Case Bottom Thermal Resistance9.7°C/W; RGE VQFN 24-pin package
3-State CMOS High-Level Input VoltageVCC × 0.8 min; EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS Mid-Level Input VoltageVCC / 2; EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS Low-Level Input VoltageVCC × 0.2 max; EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS Floating Voltage0.36 × VCC; VIN=high impedance, EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS Pull-Up Resistance410 kΩ typ; EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS Pull-Down Resistance240 kΩ typ; EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS High-Level Input Current26 µA typ; VIN=3.6 V, EQ1/EQ2 and DE1/DE2 inputs
3-State CMOS Low-Level Input Current-26 µA typ; VIN=GND, VCC=3.6 V, EQ1/EQ2 and DE1/DE2 inputs
2-State CMOS High-Level Input VoltageVCC × 0.7 min; OS1/OS2 and EN_RXD inputs
2-State CMOS Low-Level Input VoltageVCC × 0.3 max; OS1/OS2 and EN_RXD inputs
2-State CMOS Pull-Down Resistance660 kΩ typ; OS1/OS2 and EN_RXD inputs
2-State CMOS High-Level Input Current25 µA typ; VIN=3.6 V, OS1/OS2 and EN_RXD inputs
2-State CMOS Low-Level Input Current-10 µA typ; VIN=GND, VCC=3.6 V, OS1/OS2 and EN_RXD inputs
Receiver Input Differential Voltage Swing1200 mVpp max; AC-coupled differential peak-to-peak signal measured post CTLE through a 100 reference channel
Receiver Common-Mode Voltage Bias0.7 V typ; receiver DC common-mode voltage
Receiver Differential Input Impedance72 Ω min, 120 Ω max; DC differential input impedance
Receiver DC Common-Mode Impedance18 Ω min, 30 Ω max; present after a Gen1 device is detected on TXP/TXN
Datasheet Statusrequest_only

Product Overview

The TUSB522P is a Texas Instruments USB 3.1 Gen 1 redriver for 5 Gbps dual-channel, single-lane USB signal-chain use. It operates from a 3.3 V nominal supply, with recommended VCC limits of 3.0 V to 3.6 V, a maximum supply ramp of 100 ms, and maximum VCC supply noise of 100 mV.

Signal conditioning is set through control pins. Receiver equalization supports 3 dB, 6 dB, and 9 dB settings at 2.5 GHz, while output de-emphasis supports 0 dB, -3.5 dB, and -6.2 dB. Output swing is selected as 0.9 mV or 1.1 mV according to the OS1 and OS2 pin functions.

The device is supplied in an RGE 24-pin VQFN package. Thermal data for this package includes 51.2°C/W junction-to-ambient resistance and 9.7°C/W junction-to-case bottom resistance. TUSB522P covers a 0°C to 70°C free-air operating range, while TUSB522PI is specified for -40°C to 85°C.

Key Features

  • USB 3.1 Gen 1 redriver operation
  • 5 Gbps dual-channel signal path
  • Two-channel single-lane USB redriver architecture
  • 3.0 V to 3.6 V recommended supply range
  • 3 dB, 6 dB, and 9 dB receiver equalization
  • 0 dB, -3.5 dB, and -6.2 dB de-emphasis
  • 0.9 mV or 1.1 mV output swing setting
  • 98 mA typical active supply current
  • 1.2 mA typical U2 or U3 supply current
  • RGE 24-pin VQFN package thermal data

Typical Applications

  • USB 3.1 Gen 1 signal redriving
  • 5 Gbps dual-channel USB links
  • AC-coupled differential USB channels
  • Signal-chain USB interface conditioning
  • Commercial-temperature TUSB522P designs
  • Industrial-temperature TUSB522PI designs

Procurement Notes

When requesting a quote for TUSB522P, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.

FAQ

What interface and data rate does TUSB522P support?

TUSB522P supports USB 3.1 Gen 1 operation as a 5 Gbps dual-channel redriver. The extracted specifications identify it as a dual-channel, single-lane USB redriver for Signal_Chain applications.

What supply range is recommended for TUSB522P?

The recommended main power supply range is 3.0 V minimum, 3.3 V nominal, and 3.6 V maximum. The extracted operating conditions also specify a maximum supply ramp of 100 ms and maximum VCC supply noise of 100 mV.

Which signal-conditioning settings are available?

Receiver equalization gain can be set to 3 dB, 6 dB, or 9 dB at 2.5 GHz. Output de-emphasis supports 0 dB, -3.5 dB, and -6.2 dB, while output swing is listed as 0.9 mV or 1.1 mV.

What package and temperature ranges are specified?

The package is RGE 24-pin VQFN. TUSB522P is specified for 0°C to 70°C operating free-air temperature, while TUSB522PI is specified for -40°C to 85°C operation.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

Request Quote Request Datasheet