XL-0201UOC High Brightness Orange LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-0201UOC High Brightness Orange LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-0201UOC
Manufacturer
XINGLIGHT
Package
0201 SMD, 0.65 x 0.35 x 0.4 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-0201UOC from XINGLIGHT is a high brightness orange LED in an 0201 SMD package measuring 0.65 x 0.35 x 0.4 mm. It uses transparent colloid construction and is specified for 80 to 240 mcd luminous intensity at IF=20 mA and Ta=25°C. Optical parameters include a 600 to 610 nm dominant wavelength, 605 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle. Electrical ratings include 1.7 to 2.3 V forward voltage, 20 mA continuous forward current, 80 mA peak forward current under pulsed conditions, and 5 V maximum reverse voltage. Typical applications include compact orange indication and status lighting.

Specifications

TypeDescription
Part NumberXL-0201UOC
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case0201 SMD, 0.65 x 0.35 x 0.4 mm
Appearance Dimensions0.65 x 0.35 x 0.4 mm; L/W/H
Luminous ColorHigh brightness orange; transparent colloid
Lens / ColloidTransparent colloid; orange LED
Moisture Sensitivity LevelMSL 3; stated moisture sensitivity level
RoHS ComplianceMeets RoHS requirements; environmental protection product
Maximum Power Dissipation50 mW; Ta=25°C
Maximum Continuous Forward Current20 mA; Ta=25°C
Peak Forward Current80 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD / Antistatic Ability2000 V; Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Storage Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Lead Soldering Temperature / Time260°C for ≤6 s; Ta=25°C absolute maximum rating table
Luminous Intensity80 to 240 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength600 to 610 nm; IF=20 mA, Ta=25°C
Peak Wavelength605 nm typ; IF=20 mA, Ta=25°C
Forward Voltage1.7 to 2.3 V; IF=20 mA, Ta=25°C
Half Wave Width20 nm typ; IF=20 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=20 mA, Ta=25°C
Reverse Current≤1 µA; VR=5 V, Ta=25°C
Brightness Bin D280 to 120 mcd; IF=20 mA
Brightness Bin D3120 to 150 mcd; IF=20 mA
Brightness Bin D4150 to 180 mcd; IF=20 mA
Brightness Bin D5180 to 210 mcd; IF=20 mA
Brightness Bin D6210 to 240 mcd; IF=20 mA
Brightness Measurement Tolerance±10%; brightness grading
Voltage Bin N11-31.7 to 1.9 V; IF=20 mA
Voltage Bin N11-41.9 to 2.1 V; IF=20 mA
Voltage Bin N11-52.1 to 2.3 V; IF=20 mA
Voltage Measurement Tolerance±0.1 V; voltage grading
Wavelength Bin HO01600 to 602.5 nm; IF=20 mA
Wavelength Bin HO02602.5 to 605 nm; IF=20 mA
Wavelength Bin HO03605 to 607.5 nm; IF=20 mA
Wavelength Bin HO04607.5 to 610 nm; IF=20 mA
Wavelength Measurement Tolerance±1 nm; wavelength grading
Reliability Test Ambient Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature High Humidity Storage Test240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min
Anti-tin Test260±5°C for 10±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature235°C +5/-0°C; keep at peak for 10-15 s
Lead-Free Reflow Peak Temperature255°C +0/-5°C; keep at peak for 5-10 s
Solderability Test235±5°C, 2±0.5 s immersion; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area
Unspecified Dimension Tolerance±0.25 mm; outline dimensions unless otherwise noted
Tape / Reel Dimension Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; recommended for hand soldering repair/rework
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Maximum Reflow Cycles2 times maximum; reflow soldering
Recommended Maximum Welding Temperature240±5°C for 6 s; product recommendation
Cleaning With Alcohol≤30°C for 3 min or ≤50°C for 30 s; after soldering
Ultrasonic Cleaning Power≤300 W; pretest recommended before cleaning
Unopened Storage Condition≤30°C, ≤60% RH, use within 1 year; before opening package
Opened Storage Condition≤30°C, ≤40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition≤30°C, ≤60% RH; operation after opening package
Baking Condition60±5°C for 24 hours; if moisture absorbent failed or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-0201UOC is a XINGLIGHT high brightness orange LED built in a compact 0201 SMD package. The device outline is specified as 0.65 x 0.35 x 0.4 mm, with transparent colloid over the orange emitter. It is intended for compact surface-mount indicator designs where package size, luminous intensity, wavelength binning, and assembly limits are critical design parameters.

At IF=20 mA and Ta=25°C, the LED provides 80 to 240 mcd luminous intensity, 600 to 610 nm dominant wavelength, 605 nm typical peak wavelength, and 1.7 to 2.3 V forward voltage. The viewing angle is 120° typical, with a 20 nm typical half wave width. Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for short duty pulses, and 5 V reverse voltage.

Assembly guidance includes MSL 3 handling, maximum two reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and opened-package storage at ≤30°C and ≤40% RH with soldering within 168 hours.

Key Features

  • 0201 SMD package, 0.65 x 0.35 x 0.4 mm
  • High brightness orange emission with transparent colloid
  • 80 to 240 mcd luminous intensity at 20 mA
  • 600 to 610 nm dominant wavelength range
  • 1.7 to 2.3 V forward voltage at 20 mA
  • 120° typical viewing angle for broad indication
  • 20 mA maximum continuous forward current
  • 80 mA peak forward current under specified pulse conditions
  • MSL 3 moisture sensitivity handling classification
  • RoHS requirements met according to datasheet

Typical Applications

  • Compact orange status indicators
  • 0201 SMD board indicators
  • Portable device indication
  • Panel and keypad backlighting
  • Small signal display points
  • Color-coded warning indicators
  • Dense PCB visual indicators

Procurement Notes

When requesting a quote for XL-0201UOC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does the XL-0201UOC use?

XL-0201UOC uses an 0201 SMD package with appearance dimensions of 0.65 x 0.35 x 0.4 mm for length, width, and height. The outline dimension tolerance is ±0.25 mm unless otherwise noted.

What optical output is specified at 20 mA?

At IF=20 mA and Ta=25°C, the datasheet specifies luminous intensity from 80 to 240 mcd, dominant wavelength from 600 to 610 nm, 605 nm typical peak wavelength, and a 120° typical viewing angle.

What are the main electrical limits for this LED?

Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for pulse width ≤0.1 ms and duty ≤1/10, plus 5 V maximum reverse voltage at Ta=25°C.

How should opened packages be stored before soldering?

After opening the package, the datasheet specifies storage at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. Recommended workshop conditions after opening are ≤30°C and ≤60% RH.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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