Specifications
| Type | Description |
|---|---|
| Part Number | XL-0201UOC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 0201 SMD, 0.65 x 0.35 x 0.4 mm |
| Appearance Dimensions | 0.65 x 0.35 x 0.4 mm; L/W/H |
| Luminous Color | High brightness orange; transparent colloid |
| Lens / Colloid | Transparent colloid; orange LED |
| Moisture Sensitivity Level | MSL 3; stated moisture sensitivity level |
| RoHS Compliance | Meets RoHS requirements; environmental protection product |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C for ≤6 s; Ta=25°C absolute maximum rating table |
| Luminous Intensity | 80 to 240 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 600 to 610 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 605 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.7 to 2.3 V; IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | ≤1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA |
| Brightness Bin D6 | 210 to 240 mcd; IF=20 mA |
| Brightness Measurement Tolerance | ±10%; brightness grading |
| Voltage Bin N11-3 | 1.7 to 1.9 V; IF=20 mA |
| Voltage Bin N11-4 | 1.9 to 2.1 V; IF=20 mA |
| Voltage Bin N11-5 | 2.1 to 2.3 V; IF=20 mA |
| Voltage Measurement Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HO01 | 600 to 602.5 nm; IF=20 mA |
| Wavelength Bin HO02 | 602.5 to 605 nm; IF=20 mA |
| Wavelength Bin HO03 | 605 to 607.5 nm; IF=20 mA |
| Wavelength Bin HO04 | 607.5 to 610 nm; IF=20 mA |
| Wavelength Measurement Tolerance | ±1 nm; wavelength grading |
| Reliability Test Ambient Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min |
| Anti-tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s |
| Solderability Test | 235±5°C, 2±0.5 s immersion; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Unspecified Dimension Tolerance | ±0.25 mm; outline dimensions unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for hand soldering repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Cycles | 2 times maximum; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning With Alcohol | ≤30°C for 3 min or ≤50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended before cleaning |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; operation after opening package |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-0201UOC is a XINGLIGHT high brightness orange LED built in a compact 0201 SMD package. The device outline is specified as 0.65 x 0.35 x 0.4 mm, with transparent colloid over the orange emitter. It is intended for compact surface-mount indicator designs where package size, luminous intensity, wavelength binning, and assembly limits are critical design parameters.
At IF=20 mA and Ta=25°C, the LED provides 80 to 240 mcd luminous intensity, 600 to 610 nm dominant wavelength, 605 nm typical peak wavelength, and 1.7 to 2.3 V forward voltage. The viewing angle is 120° typical, with a 20 nm typical half wave width. Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for short duty pulses, and 5 V reverse voltage.
Assembly guidance includes MSL 3 handling, maximum two reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and opened-package storage at ≤30°C and ≤40% RH with soldering within 168 hours.
Key Features
- 0201 SMD package, 0.65 x 0.35 x 0.4 mm
- High brightness orange emission with transparent colloid
- 80 to 240 mcd luminous intensity at 20 mA
- 600 to 610 nm dominant wavelength range
- 1.7 to 2.3 V forward voltage at 20 mA
- 120° typical viewing angle for broad indication
- 20 mA maximum continuous forward current
- 80 mA peak forward current under specified pulse conditions
- MSL 3 moisture sensitivity handling classification
- RoHS requirements met according to datasheet
Typical Applications
- Compact orange status indicators
- 0201 SMD board indicators
- Portable device indication
- Panel and keypad backlighting
- Small signal display points
- Color-coded warning indicators
- Dense PCB visual indicators
Procurement Notes
When requesting a quote for XL-0201UOC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does the XL-0201UOC use?
XL-0201UOC uses an 0201 SMD package with appearance dimensions of 0.65 x 0.35 x 0.4 mm for length, width, and height. The outline dimension tolerance is ±0.25 mm unless otherwise noted.
What optical output is specified at 20 mA?
At IF=20 mA and Ta=25°C, the datasheet specifies luminous intensity from 80 to 240 mcd, dominant wavelength from 600 to 610 nm, 605 nm typical peak wavelength, and a 120° typical viewing angle.
What are the main electrical limits for this LED?
Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for pulse width ≤0.1 ms and duty ≤1/10, plus 5 V maximum reverse voltage at Ta=25°C.
How should opened packages be stored before soldering?
After opening the package, the datasheet specifies storage at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. Recommended workshop conditions after opening are ≤30°C and ≤60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
