Specifications
| Type | Description |
|---|---|
| Part Number | XL-1005UWC-A |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.0 x 0.5 x 0.4 mm |
| Outline Dimensions | 1.0 x 0.5 x 0.4 mm |
| Luminous Color | White |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 70 mW |
| Maximum Continuous Forward Current | 20 mA |
| Peak Forward Current | 80 mA |
| Maximum Reverse Voltage | 5 V |
| ESD Antistatic Ability | 2000 V |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C for <=6 s |
| Luminous Intensity | 500 to 1300 mcd |
| Color Temperature | 12000 K typ |
| CIE 1931 x Coordinate | 0.2735 typ |
| CIE 1931 y Coordinate | 0.2699 typ |
| Color Rendering Index | Ra 72 typ |
| Forward Voltage | 2.6 to 3.3 V |
| Viewing Angle | 120° typ |
| Reverse Current | <=1 µA |
| Brightness Bin E4 | 500 to 550 mcd |
| Brightness Bin E5 | 550 to 600 mcd |
| Brightness Bin E6 | 600 to 700 mcd |
| Brightness Bin E7 | 700 to 800 mcd |
| Brightness Bin E8 | 800 to 900 mcd |
| Brightness Bin E9 | 900 to 1000 mcd |
| Brightness Bin F1 | 1000 to 1150 mcd |
| Brightness Bin F2 | 1150 to 1300 mcd |
| Brightness Tolerance | ±10% |
| Voltage Bin M18-8 | 2.6 to 2.7 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V |
| Voltage Bin M19-3 | 3.0 to 3.1 V |
| Voltage Bin M19-4 | 3.1 to 3.2 V |
| Voltage Bin M19-5 | 3.2 to 3.3 V |
| Voltage Tolerance | ±0.1 V |
| Color Zone XT1 | CW13-28 |
| Color Zone XT2 | CW10-25 |
| Color Zone XT3 | CW8-23 |
| Color Zone XT4 | CW6-23 |
| Color Zone XT5 | CW2-23 |
| Chromaticity Coordinate Tolerance | ±0.01 |
| Test Environment Temperature | 25±5°C |
| Recommended Maximum Reflow Soldering | 240±5°C for 6 s |
| Hand Soldering Iron Power | <30 W |
| Hand Soldering Temperature | <300°C |
| Reflow Soldering Cycles | Maximum 2 times |
| Opened Package Floor Life | 168 hours / 7 days |
| Unopened Package Storage | 1 year |
| Baking Condition | 60±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL-1005UWC-A is a white chip LED supplied in a compact SMD LED package measuring 1.0 x 0.5 x 0.4 mm. The luminous color is white with yellow colloid construction, and the device is classified as MSL 3 for moisture sensitivity handling.
At IF=20 mA and Ta=25°C, the LED is specified for 500 to 1300 mcd luminous intensity, 2.6 to 3.3 V forward voltage, 12000 K typical color temperature, CIE 1931 coordinates of x=0.2735 and y=0.2699 typical, and Ra 72 typical color rendering index. The viewing angle is 120° typical under the stated test condition.
Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under pulse limits, 5 V reverse voltage, and 2000 V ESD antistatic ability at Ta=25°C. Assembly guidance includes recommended reflow up to 240±5°C for 6 s, maximum two reflow cycles, and defined storage, floor-life, and baking conditions.
Key Features
- 1.0 x 0.5 x 0.4 mm SMD LED package
- White luminous color with yellow colloid construction
- MSL 3 moisture sensitivity level
- 20 mA maximum continuous forward current at Ta=25°C
- 500 to 1300 mcd luminous intensity at IF=20 mA
- 2.6 to 3.3 V forward voltage at IF=20 mA
- 12000 K typical color temperature at IF=20 mA
- 120° typical viewing angle under stated test conditions
- -40 to +85°C operating temperature range
- Reflow soldering up to 240±5°C for 6 s
Typical Applications
- Compact white status indication
- Small-format panel indicators
- Portable electronics indicators
- White LED backlighting
- Space-constrained illumination layouts
- Low-current visual signaling
- SMD assembly lighting designs
Procurement Notes
When requesting a quote for XL-1005UWC-A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-1005UWC-A use?
XL-1005UWC-A uses an SMD LED package with outline dimensions of 1.0 x 0.5 x 0.4 mm for length, width, and height.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 500 to 1300 mcd luminous intensity, 12000 K typical color temperature, Ra 72 typical CRI, and a 120° typical viewing angle.
What forward voltage range is specified for this LED?
The forward voltage range is 2.6 to 3.3 V at IF=20 mA and Ta=25°C. The datasheet also lists voltage bins from M18-8 through M19-5 across that range.
What assembly limits apply to reflow and hand soldering?
Recommended maximum reflow soldering is 240±5°C for 6 s, with a maximum of two reflow cycles. Hand soldering is listed for repair or rework only, using less than 30 W and less than 300°C for under 3 s per terminal.
How should opened packages be handled for moisture control?
After opening, the floor life is 168 hours or 7 days when stored at <=30°C and <40%RH. Baking is specified at 60±5°C for 24 hours if the moisture absorbent material has faded or storage time is exceeded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.