XL-1606UWC High Brightness White SMD LED

Specifications

Product Overview

XL-1606UWC is a XINGLIGHT high brightness white SMD LED using a yellow colloid construction. The outline dimensions are 1.7 x 0.6 x 1.1 mm, making it a compact surface-mount LED package for assemblies requiring a small white indicator or illumination source.

At IF=20 mA and Ta=25°C, the LED is specified for 550-1000 mcd luminous intensity, 8000-12000 K color temperature, 2.7-3.3 V forward voltage, and a 120 deg viewing angle. Reverse current is specified as 5 µA maximum at VR=5 V and Ta=25°C. Brightness bins E5 through E9 cover 550-1000 mcd, while voltage bins cover 2.7-3.3 V.

Assembly handling includes MSL 3 moisture sensitivity, maximum two reflow soldering cycles, and a recommended soldering peak of 240±5°C for 6 s. Storage guidance includes unopened storage at <=30°C and <60% RH for use within 1 year, and opened-package soldering within 168 hours at <=30°C and <40% RH.

Key Features

• 1.7 x 0.6 x 1.1 mm SMD LED package
• High brightness white output with yellow colloid
• 550-1000 mcd luminous intensity at 20 mA
• 8000-12000 K color temperature at 20 mA
• 2.7-3.3 V forward voltage at 20 mA
• 120 deg viewing angle at 20 mA
• 20 mA maximum continuous forward current
• 80 mA peak forward current under pulse conditions
• MSL 3 moisture sensitivity level
• Meets RoHS requirements
• -40 to +85°C operating temperature range
• 2000 V ESD withstand voltage at Ta=25°C

Typical Applications

• White status indicators
• Compact panel indicators
• Backlighting in small electronics
• Portable device indication
• Consumer electronics lighting
• SMD board-level indication
• Cool-white visual signaling

Procurement Notes

When requesting a quote for XL-1606UWC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.