Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608PDC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Sensor |
| Package Case | 0603 / 1608 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Package / Size Code | 0603; SMD photoreceiver package |
| Colloid Color | Black colloid |
| RoHS Compliance | Complied with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| Packaging Standard | EIA standard packaging |
| Mounting Process Compatibility | Suitable for SMT automatic production |
| Soldering Process Compatibility | Suitable for reflow soldering process |
| Power Dissipation | 100 mW; Ta=25°C |
| Collector-Emitter Voltage | 30 V; absolute maximum rating, Ta=25°C |
| Emitter-Collector Voltage | 5 V; absolute maximum rating, Ta=25°C |
| ESD Withstand Voltage | 2000 V; antistatic ability |
| Operating Temperature Range | -40 to +85 °C; Topr |
| Storage Temperature Range | -40 to +85 °C; Tstg |
| Reflow Soldering Condition | 260°C, 6 s; Tsol |
| Manual Soldering Condition | 300°C, 3 s; Tsol |
| Pulse Width Limit | ≤0.1 ms; note for maximum ratings |
| Duty Cycle Limit | ≤1/10; note for maximum ratings |
| Collector-Emitter Breakdown Voltage | min 85 V; ICEO=100 µA, Ee=0 mW/cm², Ta=25°C |
| Emitter-Collector Breakdown Voltage | min 8.2 V; IECO=10 µA, Ee=0 mW/m², Ta=25°C |
| Collector-Base Breakdown Voltage | min 85 V; ICBO=100 µA, Ee=0 mW/cm², Ta=25°C |
| Collector Dark Current | max 30 nA; VCE=20 V, Ee=0 mW/cm², Ta=25°C |
| Collector-Emitter Saturation Voltage | max 0.3 V; IC=2 mA, IB=100 µA, Ee=1 mW/cm², Ta=25°C |
| Peak Sensitive Wavelength | 880 nm; Ta=25°C |
| Current Amplification Factor | min 200, max 2300; VCE=5 V, IC=2 A, Ta=25°C |
| Photocurrent 1 | min 300 µA, max 400 µA; Ee=1 mW/cm², λp=850 nm, VCE=5 V, Ta=25°C |
| Photocurrent 2 | min 500 µA, max 600 µA; Ee=1 mW/cm², λp=940 nm, VCE=5 V, Ta=25°C |
| Spectral Bandwidth / Spectral Range | 700 to 1100 nm; λ0.5, Ta=25°C |
| Rise Time | 15 µs; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Fall Time | 15 µs; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Photocurrent Grading Code | IC6-12; photocurrent grading |
| Photocurrent Grading Range | min 0.3 µA, max 0.6 µA; code IC6-12 |
| Pin 1 Function | Collector |
| Pin 2 Function | Base / Emitter; pin 2 marking shown with base and emitter text |
| Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal, one time only |
| Hand Soldering Time | <3 s; each terminal, one time only |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning Solvent | Alcohol; recommended after soldering |
| Cleaning Condition | ≤30°C for 3 minutes or ≤50°C for 30 seconds; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest required |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening moisture-proof anti-static package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; operation after opening |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-1608PDC is a XINGLIGHT infrared phototransistor receiver classified in the LED category. It is supplied in a 0603 / 1608 SMD photoreceiver package with 1.6 x 0.8 x 0.6 mm outline dimensions and black colloid. The package is listed as suitable for SMT automatic production and compatible with reflow soldering, with EIA standard packaging and MSL 3 moisture sensitivity level.
At Ta=25°C, the device is rated for 100 mW power dissipation, 30 V collector-emitter voltage, 5 V emitter-collector voltage, and 2000 V ESD withstand voltage. Electrical and optical characteristics include 880 nm peak sensitive wavelength, 700 to 1100 nm spectral bandwidth, photocurrent ranges specified at 850 nm and 940 nm, and 15 us rise and fall times under VCE=5 V, IC=1 mA, and RL=1000 ohm conditions.
Assembly guidance includes 260°C for 6 s reflow soldering maximum rating, manual soldering at 300°C for 3 s, a recommended welding temperature of 240±5°C for 6 s, and a maximum of two reflow cycles. Storage and handling requirements include unopened storage at ≤30°C and ≤60% RH within one year, opened storage at ≤30°C and ≤40% RH with soldering within 168 hours / 7 days, and baking at 60±5°C for 24 hours when required.
Key Features
- Infrared phototransistor receiver in 0603 / 1608 SMD package
- 1.6 x 0.8 x 0.6 mm black colloid body
- Peak sensitive wavelength specified at 880 nm
- Spectral response range listed as 700 to 1100 nm
- Photocurrent specified at 850 nm and 940 nm test wavelengths
- 15 us rise time and 15 us fall time
- Collector dark current maximum 30 nA at VCE=20 V
- Operating and storage temperature range -40 to +85°C
- MSL 3 moisture sensitivity with EIA standard packaging
- Suitable for SMT automatic production and reflow soldering
Typical Applications
- Infrared phototransistor receiver circuits
- Compact optical sensing modules
- Reflective infrared detection
- Photointerrupter receiver layouts
- Encoder and position sensing
- IR beam detection
- SMT infrared sensor assemblies
Procurement Notes
When requesting a quote for XL-1608PDC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTR-C1903
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
LITEON
PT19-21B/L41/TR8
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What type of component is the XL-1608PDC?
The XL-1608PDC is identified as an infrared phototransistor receiver from XINGLIGHT. The extracted data classifies it in the LED category and lists the component type as a sensor in a 0603 / 1608 SMD photoreceiver package.
What package size does the XL-1608PDC use?
The device uses a 0603 / 1608 SMD photoreceiver package. Its outline dimensions are specified as 1.6 x 0.8 x 0.6 mm for length, width, and height, with a general dimension tolerance of ±0.25 mm unless otherwise noted.
What optical wavelength range is specified for this receiver?
The peak sensitive wavelength is listed as 880 nm at Ta=25°C. The spectral bandwidth or spectral range is specified from 700 to 1100 nm under the λ0.5 condition at Ta=25°C.
What soldering limits apply to the XL-1608PDC?
The extracted data lists a reflow soldering condition of 260°C for 6 s and a manual soldering condition of 300°C for 3 s. The product recommendation is 240±5°C for 6 s, with a maximum of two reflow soldering cycles.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.