Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608PGC-060603400-900IF |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1608 SMD LED, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm, L/W/H |
| Luminous Color | Green light / Green diffused |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 75 mW, Ta=25°C |
| Maximum Continuous Forward Current | 20 mA, Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD / Antistatic Ability | 2000 V, Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C <=6 s |
| Luminous Intensity | 400-900 mcd, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515-530 nm, IF=20 mA, Ta=25°C |
| Peak Wavelength | not specified, IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6-3.4 V, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA, VR=5 V, Ta=25°C |
| Brightness Bin E2 | 400-450 mcd, IF=20 mA; brightness error ±10% |
| Brightness Bin E3 | 450-500 mcd, IF=20 mA; brightness error ±10% |
| Brightness Bin E4 | 500-550 mcd, IF=20 mA; brightness error ±10% |
| Brightness Bin E5 | 550-600 mcd, IF=20 mA; brightness error ±10% |
| Brightness Bin E6 | 600-700 mcd, IF=20 mA; brightness error ±10% |
| Brightness Bin E7 | 700-800 mcd, IF=20 mA; brightness error ±10% |
| Brightness Bin E8 | 800-900 mcd, IF=20 mA; brightness error ±10% |
| Voltage Bin M18-8 | 2.6-2.7 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7-2.8 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8-2.9 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9-3.0 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0-3.1 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1-3.2 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2-3.3 V, IF=20 mA; voltage error ±0.1 V |
| Voltage Bin M19-6 | 3.3-3.4 V, IF=20 mA; voltage error ±0.1 V |
| Wavelength Bin HG02 | 515-520 nm, IF=20 mA; wavelength error ±1 nm |
| Wavelength Bin HG03 | 520-525 nm, IF=20 mA; wavelength error ±1 nm |
| Wavelength Bin HG04 | 525-530 nm, IF=20 mA; wavelength error ±1 nm |
| Test Environment Temperature | 25±5°C, unless otherwise indicated |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours, IR reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours, Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours, Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles, IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min |
| Anti-tin Test | 260±5°C for 10±1 s, 2 times, soldering temperature T.sol |
| Lead Process Infrared Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; heat-up rate max 3°C/s; cooling rate max 6°C/s |
| Lead-free Process Infrared Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; heat-up rate max 3°C/s; cooling rate max 6°C/s |
| Weldability Test | Tin loading rate >=95% pad area; soldering temperature 235±5°C; immersion speed 25±2.5 mm/s; immersion time 2±0.5 s |
| Outline Dimension Tolerance | ±0.25 mm, unless otherwise noted |
| Tape and Reel Dimension Tolerance | ±0.1 mm, belt and disk dimensions |
| Hand Soldering Iron Power | <30 W, recommended only for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times, reflow soldering |
| Recommended Maximum Welding Temperature | 240±15°C for 6 s, product recommendation |
| Cleaning Solvent Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s, after soldering |
| Ultrasonic Cleaning Power | <=300 W, pretest recommended |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year, before opening package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days, after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH, operation after opening |
| Baking Condition | 60±5°C for 24 hours, if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-1608PGC-060603400-900IF is a XINGLIGHT green diffused SMD LED built in a 1608 package case with 1.6 x 0.8 x 0.6 mm outline dimensions. Its optical specification at IF=20 mA and Ta=25°C includes 400-900 mcd luminous intensity, 515-530 nm dominant wavelength, 30 nm typical half wave width, and 120° typical viewing angle. The peak wavelength is not specified in the extracted datasheet facts.
Electrical and thermal limits include 75 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and reverse current of <=1 µA at VR=5 V. The operating and storage temperature ranges are both -40 to +85°C, and ESD / antistatic ability is specified as 2000 V.
Assembly guidance includes MSL 3 handling, lead soldering at 260°C for <=6 s, maximum reflow count of 2 times, and recommended product welding temperature of 240±15°C for 6 s. Storage, baking, cleaning, reflow, and binning data are defined for controlled use in compact green LED indication assemblies.
Key Features
- Green diffused SMD LED in 1608 package
- 1.6 x 0.8 x 0.6 mm outline dimensions
- 400-900 mcd luminous intensity at 20 mA
- 515-530 nm dominant wavelength at 20 mA
- 2.6-3.4 V forward voltage range
- 120° typical viewing angle
- 20 mA maximum continuous forward current
- MSL 3 moisture sensitivity level
- -40 to +85°C operating temperature range
- Defined brightness, voltage, and wavelength bins
Typical Applications
- Compact green status indicators
- PCB-mounted signal indication
- Low-profile front-panel indicators
- Portable device visual alerts
- Industrial control indication
- Consumer electronics indicators
- Green wavelength bin matched assemblies
Procurement Notes
When requesting a quote for XL-1608PGC-060603400-900IF, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for XL-1608PGC-060603400-900IF?
XL-1608PGC-060603400-900IF uses a 1608 SMD LED package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The extracted datasheet facts also list an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 400-900 mcd luminous intensity, 515-530 nm dominant wavelength, 120° typical viewing angle, and 30 nm typical half wave width. Peak wavelength is not specified.
What soldering and moisture handling limits are specified?
The part is listed as MSL 3. Lead soldering is specified at 260°C for <=6 s, maximum reflow count is 2 times, and recommended maximum welding temperature is 240±15°C for 6 s.
What storage conditions apply after opening the package?
After opening, storage is specified at <=30°C and <40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition after opening is <=30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.