Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608SURC-06FJ |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1608 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | Red; water clear colloid |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C; TOPR |
| Storage Temperature Range | -40 to +85°C; TSTR |
| Lead Soldering Temperature/Time | 260°C, <=6 s; TSOL |
| Luminous Intensity | 240 to 600 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 615 to 630 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 625 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D7 | 240 to 270 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D8 | 270 to 300 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D9 | 300 to 350 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E1 | 350 to 400 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E2 | 400 to 450 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E3 | 450 to 500 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E4 | 500 to 550 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E5 | 550 to 600 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M17-9 | 1.8 to 1.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HR01 | 615 to 620 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR02 | 620 to 625 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR03 | 625 to 630 nm; IF=20 mA, wavelength error ±1 nm |
| Hand Soldering Temperature | <300°C; soldering iron <30 W, each terminal <=3 s, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; reflow soldering recommendation |
| Reflow Soldering Cycles | Maximum 2 times; reflow soldering |
| Opened Package Floor Life | 168 hours / 7 days; storage <=30°C and <40%RH after opening |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-1608SURC-06FJ is a XINGLIGHT red SMD chip LED supplied in a compact 1608 SMD package with 1.6 x 0.8 x 0.6 mm outline dimensions. The device is specified as a red luminous-color LED with water clear colloid, making it suitable for compact surface-mount indicator and signal-lighting positions where a red output and small package are required.
Electrical and optical ratings are characterized at IF=20 mA and Ta=25°C for the main LED parameters. Under those conditions, luminous intensity is 240 to 600 mcd, dominant wavelength is 615 to 630 nm, peak wavelength is 625 nm typical, forward voltage is 1.8 to 2.4 V, and the typical viewing angle is 120°.
Assembly constraints include MSL 3 handling, 168 hours / 7 days opened-package floor life at <=30°C and <40%RH, and baking at 60±5°C for 24 hours when required. Reflow soldering is recommended at 240±5°C for 6 s with a maximum of 2 cycles, while hand soldering is specified below 300°C using a soldering iron under 30 W for no more than 3 s per terminal.
Key Features
- Red SMD chip LED with water clear colloid
- 1608 SMD package, 1.6 x 0.8 x 0.6 mm
- 240 to 600 mcd luminous intensity at 20 mA
- 615 to 630 nm dominant wavelength at 20 mA
- 1.8 to 2.4 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulsed operation
- -40 to +85°C operating temperature range
- MSL 3 moisture sensitivity level
Typical Applications
- Red status indicators
- Compact panel indicators
- Signal indication LEDs
- Portable device indicators
- PCB-mounted red indicators
- Wide-angle red indication
- Low-profile surface-mount assemblies
Procurement Notes
When requesting a quote for XL-1608SURC-06FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-1608SURC-06FJ use?
XL-1608SURC-06FJ uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The part is specified as a red SMD chip LED.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED has 240 to 600 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, and a 120° typical viewing angle.
What soldering limits apply to this LED?
Lead soldering is rated at 260°C for no more than 6 s. Recommended reflow welding temperature is 240±5°C for 6 s with a maximum of 2 cycles. Hand soldering must be below 300°C for no more than 3 s per terminal.
How should opened packages be handled?
After opening, the package floor life is 168 hours / 7 days when stored at <=30°C and <40%RH. Baking is specified at 60±5°C for 24 hours if the moisture absorbent has faded or storage time is exceeded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.