XL-1608SURUGC Red Green Bicolor SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-1608SURUGC Red Green Bicolor SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-1608SURUGC
Manufacturer
XINGLIGHT
Package
1608 SMD, 1.6 mm x 0.8 mm x 0.6 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-1608SURUGC from XINGLIGHT is an LED in a 1608 SMD package measuring 1.6 x 0.8 x 0.6 mm. It is a red and green bicolor SMD LED with transparent colloid. Key electrical and optical parameters include 20 mA forward working current for both colors, 1.9-2.3 V red forward voltage, 2.5-3.3 V green forward voltage, 620-630 nm red dominant wavelength, 515-535 nm green dominant wavelength, and a typical 120 deg viewing angle. Assembly and handling data include MSL 3, RoHS compliance, reflow guidance, and defined storage conditions.

Specifications

TypeDescription
Part NumberXL-1608SURUGC
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case1608 SMD, 1.6 mm x 0.8 mm x 0.6 mm
Outline Dimensions1.6 x 0.8 x 0.6 mm; L/W/H
Luminous ColorRed and green bicolor; transparent colloid
Lens / ColloidTransparent; red green light LED
Moisture Sensitivity LevelMSL 3
RoHS ComplianceComplies with RoHS Directive
Power Dissipation Red50 mW; Ta=25°C, absolute maximum rating
Power Dissipation Green70 mW; Ta=25°C, absolute maximum rating
Peak Forward Current Red60 mA; Ta=25°C, pulse width <=0.1 ms, duty <=1/10
Peak Forward Current Green80 mA; Ta=25°C, pulse width <=0.1 ms, duty <=1/10
Forward Working Current Red20 mA; Ta=25°C, absolute maximum rating
Forward Working Current Green20 mA; Ta=25°C, absolute maximum rating
Reverse Voltage Red5 V; Ta=25°C, absolute maximum rating
Reverse Voltage Green5 V; Ta=25°C, absolute maximum rating
ESD Rating2000 V; antistatic ability
Operating Ambient Temperature-40°C to +85°C; Topr
Storage Temperature-40°C to +85°C; Tstg
Reflow Soldering Limit260°C, 6 s; absolute maximum welding condition
Manual Soldering Limit300°C, 3 s; absolute maximum welding condition
Luminous Intensity RedMin 150 mcd; IF=20 mA, Ta=25°C
Luminous Intensity GreenTyp 550 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength Red620-630 nm; IF=20 mA, Ta=25°C
Dominant Wavelength Green515-535 nm; IF=20 mA, Ta=25°C
Peak Wavelength RedTyp 630 nm; IF=20 mA, Ta=25°C
Peak Wavelength GreenTyp 525 nm; IF=20 mA, Ta=25°C
Half Wave Width RedTyp 20 nm; IF=20 mA, Ta=25°C
Half Wave Width GreenTyp 30 nm; IF=20 mA, Ta=25°C
Forward Voltage Red1.9-2.3 V; IF=20 mA, Ta=25°C
Forward Voltage Green2.5-3.3 V; IF=20 mA, Ta=25°C
Viewing AngleTyp 120 deg; 2θ1/2, red/green, IF=20 mA
Reverse Current RedMax 1 uA; VR=5 V, Ta=25°C
Reverse Current GreenMax 1 uA; VR=5 V, Ta=25°C
Brightness Bin D3120-150 mcd; IF=20 mA
Brightness Bin D4150-180 mcd; IF=20 mA
Brightness Bin D5180-210 mcd; IF=20 mA
Brightness Bin E5550-600 mcd; IF=20 mA
Brightness Bin E6600-700 mcd; IF=20 mA
Brightness Bin E7700-800 mcd; IF=20 mA
Brightness Bin E8800-900 mcd; IF=20 mA
Brightness Bin E9900-1000 mcd; IF=20 mA
Brightness Tolerance±10%; brightness grading
Voltage Bin N11-41.9-2.1 V; IF=20 mA
Voltage Bin N11-52.1-2.3 V; IF=20 mA
Voltage Bin N11-72.5-2.7 V; IF=20 mA
Voltage Bin N11-82.7-2.9 V; IF=20 mA
Voltage Bin N11-92.9-3.1 V; IF=20 mA
Voltage Bin N12-13.1-3.3 V; IF=20 mA
Voltage Tolerance±0.1 V; voltage grading
Wavelength Bin HR02620-625 nm; IF=20 mA
Wavelength Bin HG02515-520 nm; IF=20 mA
Wavelength Bin HG03520-525 nm; IF=20 mA
Wavelength Bin HG04525-530 nm; IF=20 mA
Wavelength Bin HG05530-535 nm; IF=20 mA
Wavelength Tolerance±1 nm; wavelength grading
Test Environment Temperature25±5°C; unless otherwise indicated
Recommended Maximum Reflow Soldering240±5°C for 6 s; Pb-free reflow soldering guideline
Maximum Reflow Cycles2 times; reflow soldering guideline
Hand Soldering Iron PowerLess than 30 W; hand soldering guideline
Hand Soldering TemperatureUnder 300°C; less than 3 s per terminal, one time only
Unopened Storage Condition30°C or less, less than 60% RH, use within 1 year
Opened Storage Condition30°C or less, less than 40% RH, solder within 168 hours / 7 days
Recommended Workshop Condition30°C or less, less than 60% RH
Baking Condition60±5°C for 24 hours; if storage limits are exceeded
Datasheet Statusrequest_only

Product Overview

The XL-1608SURUGC is a XINGLIGHT red green bicolor SMD LED supplied in a compact 1608 surface-mount package. The outline dimensions are 1.6 x 0.8 x 0.6 mm, and the device uses transparent colloid for the red and green light LED structure.

At IF=20 mA and Ta=25°C, the red channel has a 620-630 nm dominant wavelength, typical 630 nm peak wavelength, typical 20 nm half wave width, and 1.9-2.3 V forward voltage. The green channel has a 515-535 nm dominant wavelength, typical 525 nm peak wavelength, typical 30 nm half wave width, and 2.5-3.3 V forward voltage. The specified viewing angle is typical 120 deg.

Absolute maximum and process data include 50 mW red power dissipation, 70 mW green power dissipation, 5 V reverse voltage per color, 2000 V ESD rating, -40°C to +85°C operating and storage temperature ranges, MSL 3 handling, and RoHS compliance. Reflow and hand soldering limits, storage conditions, and baking conditions are defined for assembly control.

Key Features

  • Red and green bicolor SMD LED
  • 1608 package measuring 1.6 x 0.8 x 0.6 mm
  • Transparent colloid lens construction
  • Red dominant wavelength range of 620-630 nm
  • Green dominant wavelength range of 515-535 nm
  • Typical 120 deg viewing angle at IF=20 mA
  • 20 mA forward working current for both colors
  • MSL 3 moisture sensitivity level
  • Complies with RoHS Directive
  • -40°C to +85°C operating temperature range

Typical Applications

  • Red green status indicators
  • Compact panel indicators
  • Bicolor signal displays
  • Surface-mount indicator assemblies
  • Color-coded equipment status
  • Small-format LED indication

Procurement Notes

When requesting a quote for XL-1608SURUGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

Alternatives

EVERLIGHT

18-225A/R6GHC-A01/3T

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

EVERLIGHT

SZC295QRLGCT-5A

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

EVERLIGHT

TJ-S1608SW6TDSLC2R2G-A5

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

EVERLIGHT

LTST-C295TGKRKT

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

Application Verification Recommended

FAQ

What package size does XL-1608SURUGC use?

XL-1608SURUGC uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The listed dimensions are specified as length, width, and height.

What are the red and green wavelength specifications?

At IF=20 mA and Ta=25°C, the red dominant wavelength is 620-630 nm with a typical 630 nm peak wavelength. The green dominant wavelength is 515-535 nm with a typical 525 nm peak wavelength.

What soldering limits are specified for this LED?

The absolute maximum reflow soldering condition is 260°C for 6 s, and the manual soldering limit is 300°C for 3 s. The Pb-free reflow guideline recommends 240±5°C for 6 s with up to 2 reflow cycles.

How should opened packages be stored before soldering?

After opening the package, storage should be 30°C or less and less than 40% RH, with soldering completed within 168 hours or 7 days. If storage time is exceeded, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

Request Quote Request Datasheet