Specifications
| Type | Description |
|---|---|
| Part Number | XL-1615SURUYUGC-A |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD 1.6 x 1.5 x 0.6 mm |
| Outline Dimensions | 1.6 x 1.5 x 0.6 mm; L/W/H |
| Luminous Color | RGY; Red/Green/Yellow LED |
| Lens / Colloid | Transparent colloid; package material appearance |
| RoHS Compliance | Complies with RoHS directive; environmental protection products |
| Moisture Sensitivity Level | MSL 3 |
| Package Compatibility | Suitable for SMT automatic production |
| Reflow Compatibility | Compatible with infrared reflow solder process |
| Power Dissipation - Red | 50 mW; Ta=25°C |
| Power Dissipation - Green | 75 mW; Ta=25°C |
| Power Dissipation - Yellow | 50 mW; Ta=25°C |
| Peak Forward Current - Red | 60 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current - Green | 60 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current - Yellow | 60 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Forward Working Current - Red | 20 mA; Ta=25°C |
| Forward Working Current - Green | 20 mA; Ta=25°C |
| Forward Working Current - Yellow | 20 mA; Ta=25°C |
| Reverse Voltage | 5 V; R/G/Y, Ta=25°C |
| Operating Ambient Temperature | -40°C to +85°C; Topr |
| Storage Temperature | -40°C to +85°C; Tstg |
| Reflow Soldering Limit | 260°C, 6 s; absolute maximum soldering condition |
| Manual Soldering Limit | 300°C, 3 s; absolute maximum soldering condition |
| Luminous Intensity - Red | Min 80 mcd, Max 180 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity - Green | Min 600 mcd, Max 1000 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity - Yellow | Min 80 mcd, Max 150 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Red | Min 615 nm, Typ 620 nm, Max 625 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Green | Min 520 nm, Max 535 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Yellow | Min 587 nm, Max 594 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Red | Typ 630 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Green | Typ 525 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Yellow | Typ 595 nm; IF=20 mA, Ta=25°C |
| Half Wave Width - Green | Typ 25 nm; IF=20 mA, Ta=25°C |
| Forward Voltage - Red | Min 1.8 V, Max 2.4 V; IF=20 mA, Ta=25°C |
| Forward Voltage - Green | Min 2.5 V, Max 3.3 V; IF=20 mA, Ta=25°C |
| Forward Voltage - Yellow | Min 1.8 V, Max 2.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | Typ 120 deg; 2θ1/2, R/G/Y, IF=20 mA, Ta=25°C |
| Reverse Current - Red | Max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current - Green | Max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current - Yellow | Max 1 uA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA |
| Brightness Bin E5 | 550 to 600 mcd; IF=20 mA |
| Brightness Bin E6 | 600 to 700 mcd; IF=20 mA |
| Brightness Bin E7 | 700 to 800 mcd; IF=20 mA |
| Brightness Bin E8 | 800 to 900 mcd; IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; brightness grading |
| Voltage Bin R8-4 | 1.8 to 2.2 V; IF=20 mA |
| Voltage Bin R9-3 | 1.9 to 2.2 V; IF=20 mA |
| Voltage Bin N11-7 | 2.5 to 2.7 V; IF=20 mA |
| Voltage Bin N11-8 | 2.7 to 2.9 V; IF=20 mA |
| Voltage Bin N11-9 | 2.9 to 3.1 V; IF=20 mA |
| Voltage Bin N12-1 | 3.1 to 3.3 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HR01 | 615 to 620 nm; IF=20 mA |
| Wavelength Bin HR02 | 620 to 625 nm; IF=20 mA |
| Wavelength Bin HG03 | 520 to 525 nm; IF=20 mA |
| Wavelength Bin HG04 | 525 to 530 nm; IF=20 mA |
| Wavelength Bin HG05 | 530 to 535 nm; IF=20 mA |
| Wavelength Bin HY04 | 587.5 to 590 nm; IF=20 mA |
| Wavelength Bin HY05 | 590 to 592.5 nm; IF=20 mA |
| Wavelength Bin HY06 | 592.5 to 595 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm; wavelength grading |
| Recommended Reflow Peak Temperature | 240±5°C for 6 s; Pb-free reflow soldering recommendation |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Hand Soldering Iron Power | <30 W; hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once, less than 3 s |
| Alcohol Cleaning Condition | Under 30°C for 3 minutes or under 50°C for 30 seconds; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Life | 1 year; moisture-proof anti-electrostatic package, <=30°C, <=60%RH |
| Opened Storage Condition | <=30°C, <=40%RH, use within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60%RH; product operation environment |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-1615SURUYUGC-A is a XINGLIGHT high brightness RGY SMD LED built in a 1.6 x 1.5 x 0.6 mm surface-mount package. The package uses transparent colloid and integrates red, green, and yellow luminous output, making it suited to compact multicolor indication where a small SMD footprint is required.
Electrical and optical ratings are specified at IF=20 mA and Ta=25°C for the main optical parameters. Luminous intensity ranges are 80 to 180 mcd for red, 600 to 1000 mcd for green, and 80 to 150 mcd for yellow. Dominant wavelength ranges are 615 to 625 nm for red, 520 to 535 nm for green, and 587 to 594 nm for yellow, with a typical 120 degree viewing angle for R/G/Y.
The LED is suitable for SMT automatic production and compatible with infrared reflow soldering. Handling and process constraints include MSL 3, a recommended Pb-free reflow peak of 240±5°C for 6 seconds, up to two reflow cycles, and opened-package use within 168 hours at <=30°C and <=40%RH.
Key Features
- 1.6 x 1.5 x 0.6 mm SMD package
- Red, green, and yellow luminous output
- Transparent colloid package appearance
- Suitable for SMT automatic production
- Compatible with infrared reflow soldering
- Typical 120 degree viewing angle
- 20 mA forward working current per color
- MSL 3 moisture sensitivity level
- RoHS directive compliant device
- -40°C to +85°C operating ambient range
Typical Applications
- Multicolor status indicators
- Compact panel indicators
- SMT indicator assemblies
- Red green yellow signal displays
- Wide-angle visual indication
- Reflow-assembled electronics
- Moisture-controlled SMT production
Procurement Notes
When requesting a quote for XL-1615SURUYUGC-A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-1615SURUYUGC-A use?
XL-1615SURUYUGC-A uses an SMD package with outline dimensions of 1.6 x 1.5 x 0.6 mm. The package has transparent colloid and is suitable for SMT automatic production.
What colors are available in this LED?
The device is specified as an RGY LED, meaning it provides red, green, and yellow luminous output. At IF=20 mA and Ta=25°C, the dominant wavelength ranges are 615 to 625 nm red, 520 to 535 nm green, and 587 to 594 nm yellow.
What are the forward voltage ranges at 20 mA?
At IF=20 mA and Ta=25°C, forward voltage is specified as 1.8 to 2.4 V for red, 2.5 to 3.3 V for green, and 1.8 to 2.4 V for yellow.
What soldering process limits apply to this part?
The device is compatible with infrared reflow soldering. The absolute maximum reflow soldering condition is 260°C for 6 seconds, while the recommended Pb-free reflow peak is 240±5°C for 6 seconds with a maximum of two reflow cycles.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.