Specifications
| Type | Description |
|---|---|
| Part Number | XL-1615UOUWC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.6 x 1.5 x 0.6 mm |
| Outline Dimensions | 1.6 x 1.5 x 0.6 mm, L/W/H |
| Luminous Color and Colloid | Orange and white / yellow colloid, product description |
| Moisture Sensitivity Level | MSL 3, product characteristics |
| Process Compatibility | Suitable for SMT automatic production, product characteristics |
| Soldering Process Compatibility | Suitable for reflow soldering process, product characteristics |
| Power Dissipation, Orange | 50 mW, Ta=25°C |
| Power Dissipation, White | 70 mW, Ta=25°C |
| Peak Forward Current, Orange | 80 mA, Ta=25°C |
| Peak Forward Current, White | 80 mA, Ta=25°C |
| Forward Working Current, Orange | 20 mA, Ta=25°C |
| Forward Working Current, White | 20 mA, Ta=25°C |
| Reverse Voltage, Orange | 5 V, Ta=25°C |
| Reverse Voltage, White | 5 V, Ta=25°C |
| ESD Withstand | 2000 V, Ta=25°C |
| Operating Ambient Temperature | -40°C to +85°C, Topr |
| Storage Temperature | -40°C to +85°C, Tstg |
| Reflow Soldering Condition | 260°C, 6 s, Tsol |
| Manual Soldering Condition | 300°C, 3 s, Tsol |
| Luminous Intensity, Orange | 80-210 mcd, IF=20 mA, Ta=25°C |
| Luminous Intensity, White | 800-1300 mcd, IF=20 mA, Ta=25°C |
| Peak Wavelength, Orange | 602 nm typ, IF=20 mA, Ta=25°C |
| Dominant Wavelength, Orange | 600-606 nm, IF=20 mA, Ta=25°C |
| Forward Voltage, Orange | 1.9-2.3 V, IF=20 mA, Ta=25°C |
| Forward Voltage, White | 2.6-3.4 V, IF=20 mA, Ta=25°C |
| Half Wave Width, Orange | 20 nm typ, IF=20 mA, Ta=25°C |
| Chromaticity Coordinate X, White | 0.2618 typ, IF=20 mA, Ta=25°C |
| Chromaticity Coordinate Y, White | 0.2250 typ, IF=20 mA, Ta=25°C |
| Half Intensity Viewing Angle | 130 deg typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | 1 μA max, VR=5 V, Ta=25°C |
| Brightness Grading D2 | 80-120 mcd, IF=20 mA |
| Brightness Grading D3 | 120-150 mcd, IF=20 mA |
| Brightness Grading D4 | 150-180 mcd, IF=20 mA |
| Brightness Grading D5 | 180-210 mcd, IF=20 mA |
| Brightness Grading E8 | 800-900 mcd, IF=20 mA |
| Brightness Grading E9 | 900-1000 mcd, IF=20 mA |
| Brightness Grading F1 | 1000-1150 mcd, IF=20 mA |
| Brightness Grading F2 | 1150-1300 mcd, IF=20 mA |
| Brightness Grading Error | ±10%, brightness grading |
| Voltage Grading N11-4 | 1.9-2.1 V, IF=20 mA |
| Voltage Grading N11-5 | 2.1-2.3 V, IF=20 mA |
| Voltage Grading N13-2 | 2.6-2.8 V, IF=20 mA |
| Voltage Grading N13-3 | 2.8-3.0 V, IF=20 mA |
| Voltage Grading N13-4 | 3.0-3.2 V, IF=20 mA |
| Voltage Grading N13-5 | 3.2-3.4 V, IF=20 mA |
| Voltage Grading Error | ±0.1 V, voltage grading |
| Wavelength Grading HO01 | 600-602.5 nm, IF=20 mA |
| Wavelength Grading HO02 | 602.5-605 nm, IF=20 mA |
| Wavelength Grading HO03 | 605-607.5 nm, IF=20 mA |
| Wavelength Grading Error | ±1 nm, wavelength grading |
| General Test Ambient Temperature | 25±5°C, unless otherwise indicated |
| Operating Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage | 240 hours ±2 hours, IR reflow in-board 2 times, Ta=85±5°C, RH=90-95% |
| High Temperature Storage | 1000 hours, Ta=85±5°C |
| Low Temperature Storage | 1000 hours, Ta=-40±5°C |
| Thermal Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Thermal Shock Test | 100 cycles, IR reflow in-board 2 times; 100±5°C for 20 min to -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times, T.sol soldering temperature |
| Lead Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s, lead process infrared reflow welding |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s, lead-free infrared reflow welding |
| Solderability Test | 235±5°C, immersion time 2±0.5 s, immersion speed 25±2.5 mm/s, tin loading rate ≥95% pad area |
| Outline Dimension Tolerance | ±0.25 mm, unless otherwise noted |
| Tape and Reel Dimension Tolerance | ±0.15 mm, belt and disk dimensions |
| Recommended Hand Soldering Iron Power | <30 W, hand soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s, product recommendation |
| Maximum Reflow Count | 2 times, reflow soldering |
| Alcohol Cleaning Condition | ≤30°C for 3 min or ≤50°C for 30 s, after soldering |
| Ultrasonic Cleaning Power | ≤300 W, general maximum ultrasonic power |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year, before opening package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days, after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH, product operation after opening |
| Baking Treatment | 60±5°C for 24 hours, if desiccant has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-1615UOUWC is a XINGLIGHT orange white bicolor LED supplied as an SMD LED with 1.6 x 1.5 x 0.6 mm outline dimensions. The product description specifies orange and white emission with yellow colloid, making the device a compact two-color LED option for SMT board assemblies.
Electrical ratings are specified at Ta=25°C. Both orange and white channels have 20 mA forward working current, 80 mA peak forward current, and 5 V reverse voltage. Power dissipation is 50 mW for orange and 70 mW for white. Optical data at IF=20 mA includes 80-210 mcd orange luminous intensity, 800-1300 mcd white luminous intensity, 602 nm typical orange peak wavelength, 600-606 nm orange dominant wavelength, and 130 deg typical half-intensity viewing angle.
Assembly information includes MSL 3 handling, suitability for SMT automatic production, and compatibility with reflow soldering. The datasheet lists reflow soldering at 260°C for 6 s, manual soldering at 300°C for 3 s, maximum two reflow cycles, and storage conditions for unopened and opened packages.
Key Features
- Orange and white bicolor LED with yellow colloid
- 1.6 x 1.5 x 0.6 mm SMD LED package
- MSL 3 moisture sensitivity classification
- Suitable for SMT automatic production
- Compatible with reflow soldering process
- 20 mA forward working current per color
- 80 mA peak forward current per color
- 2000 V ESD withstand at Ta=25°C
- 130 deg typical half-intensity viewing angle
- -40°C to +85°C operating temperature range
Typical Applications
- SMT automatic production assemblies
- Reflow-soldered LED boards
- Orange and white indicator circuits
- Compact bicolor LED layouts
- Boards requiring MSL 3 handling
- Assemblies with 130 deg viewing angle
- Applications tested at 20 mA
Procurement Notes
When requesting a quote for XL-1615UOUWC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of LED is XL-1615UOUWC?
XL-1615UOUWC is an orange white bicolor LED from XINGLIGHT. The datasheet describes orange and white luminous colors with yellow colloid in an SMD LED package measuring 1.6 x 1.5 x 0.6 mm.
What are the forward voltage ratings at 20 mA?
At IF=20 mA and Ta=25°C, the orange channel forward voltage is specified as 1.9-2.3 V. Under the same test condition, the white channel forward voltage is specified as 2.6-3.4 V.
What luminous intensity ranges are specified?
At IF=20 mA and Ta=25°C, orange luminous intensity is specified as 80-210 mcd. White luminous intensity is specified as 800-1300 mcd under the same current and ambient temperature condition.
What soldering limits are listed for this LED?
The datasheet lists reflow soldering at 260°C for 6 s and manual soldering at 300°C for 3 s. It also recommends maximum welding at 240±5°C for 6 s and limits reflow soldering to 2 times.
How should opened packages be stored before soldering?
After opening the package, storage is specified at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition after opening is ≤30°C and ≤60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.