Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012BGWC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 0805 SMD LED, 2.0 x 1.2 x 0.8 mm |
| Outline Dimensions | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | Ice blue; light green colloid |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| RoHS Compliance | Complies with RoHS directive; environmental protection process |
| Mounting Process | SMT automatic production compatible; surface mount assembly |
| Soldering Process Compatibility | Reflow soldering process compatible; SMT LED assembly |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature and Time | 260°C for <=6 s; absolute maximum rating |
| Luminous Intensity | 270 to 500 mcd; IF=20 mA, Ta=25°C |
| Color Temperature | Not specified; IF=20 mA, Ta=25°C |
| Chromaticity Coordinate X | 0.1169 to 0.1372; IF=20 mA, Ta=25°C |
| Chromaticity Coordinate Y | 0.1384 to 0.2389; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.7 to 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | 1 µA max; VR=5 V, Ta=25°C |
| Brightness Bin D8 | 270 to 300 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D9 | 300 to 350 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E1 | 350 to 400 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E2 | 400 to 450 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E3 | 450 to 500 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-8 | 2.6 to 2.7 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0 to 3.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1 to 3.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2 to 3.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-6 | 3.3 to 3.4 V; IF=20 mA, voltage error ±0.1 V |
| Chromaticity Coordinate Tolerance | ±0.01; XY coordinate error |
| Test Ambient Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR-Reflow in-board 2 times; Ta=85 ±5°C, RH=90 to 95% |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-Reflow in-board 2 times; 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-tin Test | 260 ±5°C for 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10 to 15 s; lead reflow process |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C for 5 to 10 s; lead-free reflow process |
| Weldability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape and Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, dimensions in mm |
| Hand Soldering Iron Power | <30 W recommended; hand soldering only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once only, less than 3 s |
| Maximum Reflow Cycles | 2 times max; reflow soldering |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product soldering recommendation |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W generally recommended; pretest required before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; product operation/storage handling recommendation |
| Baking Condition | 60 ±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-2012BGWC is an XINGLIGHT ice blue SMD LED built in an 0805 surface-mount package. Its outline dimensions are 2.0 x 1.2 x 0.8 mm, with light green colloid noted for the ice blue luminous color. The part is intended for SMT automatic production and is compatible with reflow soldering processes.
Electrical and optical parameters are specified at IF=20 mA and Ta=25°C. Luminous intensity is 270 to 500 mcd, forward voltage is 2.7 to 3.4 V, chromaticity coordinates are X=0.1169 to 0.1372 and Y=0.1384 to 0.2389, and viewing angle is 120° typ. Reverse current is 1 µA max at VR=5 V.
Assembly and handling limits include MSL 3 moisture sensitivity, 2 maximum reflow cycles, and opened-package storage at <=30°C and <=40% RH with soldering within 168 hours / 7 days. The device suits compact SMT indicator and illumination uses where an ice blue LED, 0805 footprint, and reflow assembly compatibility are required.
Key Features
- 0805 SMD LED package, 2.0 x 1.2 x 0.8 mm
- Ice blue luminous color with light green colloid
- 270 to 500 mcd luminous intensity at 20 mA
- 2.7 to 3.4 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulse conditions
- -40 to +85 °C operating temperature range
- MSL 3 moisture sensitivity level
- Reflow soldering compatible, 2 cycles maximum
- RoHS directive compliance stated in datasheet
- 2000 V ESD withstand voltage at Ta=25°C
Typical Applications
- Compact status indicators
- SMT panel indicators
- Ice blue signal lighting
- Portable device indicators
- Control panel illumination
- Reflow-assembled LED boards
- Small-format backlighting
- Color-coded equipment indicators
Procurement Notes
When requesting a quote for XL-2012BGWC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-2012BGWC?
XL-2012BGWC uses an 0805 SMD LED package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, XL-2012BGWC has 270 to 500 mcd luminous intensity, X chromaticity of 0.1169 to 0.1372, Y chromaticity of 0.1384 to 0.2389, and a 120° typical viewing angle.
What forward voltage range is specified?
The datasheet specifies a forward voltage range of 2.7 to 3.4 V at IF=20 mA and Ta=25°C. Voltage bin ranges from 2.6 to 3.4 V are also listed with ±0.1 V voltage error.
What soldering processes are supported?
XL-2012BGWC is compatible with SMT automatic production and reflow soldering. The datasheet lists a maximum of 2 reflow cycles and recommends a maximum welding temperature of 240 ±5°C for 6 seconds.
How should opened packages be stored?
After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours / 7 days. Baking is specified at 60 ±5°C for 24 hours if storage time is exceeded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.