Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012SURC-DS |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2012 SMD, 2.0 x 1.2 x 0.8 mm |
| Appearance Dimension | 2.0 x 1.2 x 0.8 mm, L/W/H |
| Luminous Color | High brightness red, transparent colloid |
| Lens / Colloid | Transparent colloid, red luminous color version |
| Moisture Sensitivity Level | MSL 3, specified as 3 levels |
| Operating Voltage | 2.0-4.5 V, VDD, Ta=25°C unless otherwise defined |
| Operating Current | 0.2 mA max, IDD, no load, VDD=3 V, Ta=25°C |
| Driving Current | 20 mA typ, IOL, VDS=1.0 V, VDD=3 V, Ta=25°C |
| Operating Temperature | -40 to 85 °C, TOPR |
| Storage Temperature Range | -40 to 85 °C, TSTR |
| Luminous Intensity | 80-150 mcd, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 620-630 nm, IF=20 mA, Ta=25°C |
| Peak Wavelength | 625 nm typ, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd, IF=20 mA |
| Brightness Bin D3 | 120-150 mcd, IF=20 mA |
| Wavelength Bin HR02 | 620-625 nm, IF=20 mA |
| Wavelength Bin HR03 | 625-630 nm, IF=20 mA |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours, Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours, Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours, Ta=-40±5°C |
| Cold And Hot Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot And Cold Impact Test | 100 cycles, IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-tin Test | 260±5°C for 10±1 s, 2 times, soldering temperature T.sol |
| Lead Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; above 183°C for 60-150 s; ramp max 3°C/s; cooling max 6°C/s |
| Lead-free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; above 217°C for 60-120 s; ramp max 3°C/s; cooling max 6°C/s |
| Solderability Test | 235±5°C, 2±0.5 s immersion; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Outline Dimension Tolerance | ±0.25 mm, unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm, belt and disk dimensions, units in mm |
| Hand Soldering Temperature | under 300°C, soldering iron less than 30 W; each terminal less than 3 s, one time only |
| Maximum Reflow Cycles | 2 times max, reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s, product recommended maximum welding temperature |
| Cleaning Condition | alcohol cleaning under 30°C for 3 min or under 50°C for 30 s, after soldering |
| Ultrasonic Cleaning Power | 300 W max recommended, pretest required to confirm no LED damage |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours / 7 days after opening package |
| Recommended Workshop Condition | ≤30°C, <60% RH, operation after opening package |
| Baking Condition | 60±5°C for 24 hours if desiccant failed or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL-2012SURC-DS is a high brightness red SMD LED supplied in a 2012 surface-mount package. The package outline is 2.0 x 1.2 x 0.8 mm, and the red luminous version uses transparent colloid construction. The datasheet lists MSL 3 moisture sensitivity for handling and assembly planning.
Optical ratings are specified at IF=20 mA and Ta=25°C. Luminous intensity is 80-150 mcd, with D2 and D3 brightness bins covering 80-120 mcd and 120-150 mcd. Dominant wavelength is 620-630 nm, divided into HR02 and HR03 wavelength bins, and the peak wavelength is 625 nm typical. The viewing angle is 120° typical.
Electrical and environmental data include a 2.0-4.5 V operating voltage range, 0.2 mA maximum operating current under no-load VDD=3 V conditions, and 20 mA typical driving current under the stated IOL test condition. Assembly notes include two maximum reflow cycles, defined lead and lead-free reflow profiles, hand soldering under 300°C, and storage controls after opening.
Key Features
- 2012 SMD package measures 2.0 x 1.2 x 0.8 mm
- High brightness red output with transparent colloid lens
- 80-150 mcd luminous intensity at IF=20 mA
- 620-630 nm dominant wavelength range at IF=20 mA
- 625 nm typical peak wavelength at IF=20 mA
- 120° typical viewing angle for board-level indication
- Specified operating range from -40 to 85°C
- MSL 3 moisture sensitivity level for handling control
- Two maximum reflow soldering cycles specified
- Opened packages require soldering within 168 hours
Typical Applications
- Red status indicators
- Compact panel indicators
- Board-level signal lights
- Small display light points
- Equipment indication windows
- Red visual alert positions
- Surface-mount indicator assemblies
Procurement Notes
When requesting a quote for XL-2012SURC-DS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-2012SURC-DS use?
XL-2012SURC-DS uses a 2012 SMD package with an appearance dimension of 2.0 x 1.2 x 0.8 mm. The datasheet states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What optical output is specified for this red LED?
At IF=20 mA and Ta=25°C, the datasheet specifies 80-150 mcd luminous intensity, 620-630 nm dominant wavelength, 625 nm typical peak wavelength, and a 120° typical viewing angle.
What storage controls apply after opening the package?
After opening the package, the LEDs should be stored at ≤30°C and <40% RH and soldered within 168 hours, or 7 days. The recommended workshop condition after opening is ≤30°C and <60% RH.
What soldering limits are listed in the datasheet?
The datasheet lists two maximum reflow cycles, hand soldering under 300°C with a soldering iron under 30 W, and each terminal soldered for less than 3 seconds one time only.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.