Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012SURC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2012 SMD, 2.0 x 1.2 x 0.8 mm |
| Outline Dimensions | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | Red; transparent/water colloid package |
| Colloid / Lens | Water colloid / transparent; red LED body description |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| SMT Compatibility | Suitable for SMT automatic production |
| Reflow Soldering Compatibility | Suitable for reflow soldering process |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C rating table |
| Lead Soldering Temperature / Time | 260°C <=6 s; maximum soldering condition |
| Luminous Intensity | 80 to 120 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 620 to 625 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 630 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.1 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin | D2, 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin | N11-4, 1.9 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin | HR02, 620 to 625 nm; IF=20 mA, wavelength error ±1 nm |
| Test Ambient Temperature | 25 ±5°C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature, tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times, 100 ±5°C to -40 ±5°C, 20 min each |
| Anti-Tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s, ramp max 3°C/s, cooling max 6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s, ramp max 3°C/s, cooling max 6°C/s |
| Weldability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s, tin loading rate >=95% pad area |
| Unspecified Dimension Tolerance | ±0.25 mm; outline dimensions unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W recommended; manual soldering only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times maximum; reflow soldering |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W generally; pretest required before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH |
| Baking Condition | 60 ±5°C for 24 hours if desiccant fades or LEDs exceed storage time |
| Datasheet Status | request_only |
Product Overview
The XL-2012SURC is a XINGLIGHT red SMD chip LED built in a compact 2012 surface-mount package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The LED body is described as a water-colloid, transparent package, and the emitted luminous color is red.
Electrical and optical characteristics are specified at IF=20 mA and Ta=25°C. The part has 80 to 120 mcd luminous intensity, 620 to 625 nm dominant wavelength, 630 nm typical peak wavelength, 20 nm typical half-wave width, 1.9 to 2.1 V forward voltage, and 120° typical viewing angle. Reverse current is specified at <=1 µA at VR=5 V.
Assembly data identifies the device as suitable for SMT automatic production and reflow soldering. The datasheet lists MSL 3 moisture sensitivity, RoHS compliance, two maximum reflow cycles, lead and lead-free reflow peak profiles, hand-soldering limits for repair or rework, alcohol cleaning conditions, and storage requirements for unopened and opened moisture-proof anti-electrostatic packages.
Key Features
- Red SMD chip LED in transparent water-colloid package
- 2012 package measures 2.0 x 1.2 x 0.8 mm
- 80 to 120 mcd luminous intensity at 20 mA
- 620 to 625 nm dominant wavelength at 20 mA
- 1.9 to 2.1 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current rating
- 80 mA peak forward current under pulse conditions
- MSL 3 moisture sensitivity level
- RoHS Directive compliance stated in datasheet
- Suitable for SMT automatic production and reflow soldering
- Two maximum reflow soldering cycles specified
Typical Applications
- SMT automatic production
- Reflow-soldered LED assemblies
- Red indicator light circuits
- Compact surface-mount PCB layouts
- Repair and rework soldering
- Process-controlled LED production
- RoHS-directed electronics assemblies
Procurement Notes
When requesting a quote for XL-2012SURC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-2012SURC use?
XL-2012SURC uses a 2012 SMD package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet lists an unspecified outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 120 mcd luminous intensity, 620 to 625 nm dominant wavelength, 630 nm typical peak wavelength, 20 nm typical half-wave width, and 120° typical viewing angle.
What soldering limits are specified for this LED?
The datasheet lists a maximum lead soldering condition of 260°C for <=6 seconds, a recommended maximum welding condition of 240 ±5°C for 6 seconds, and a maximum of two reflow soldering cycles.
How should opened packages be stored before soldering?
After opening the moisture-proof anti-electrostatic package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering completed within 168 hours, or 7 days.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.