Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012SYGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Outline Dimensions | 2.0 x 1.2 x 0.8 mm, L/W/H |
| Luminous Color | Yellow-green, transparent/water clear colloid |
| Lens / Colloid | Water clear / transparent colloid, luminous color and colloid |
| RoHS Compliance | Complies with RoHS directive, environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| SMT Compatibility | Suitable for SMT automatic production |
| Reflow Compatibility | Suitable for reflow soldering process |
| Maximum Power Dissipation | 50 mW, Ta=25°C |
| Maximum Continuous Forward Current | 20 mA, Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD / Antistatic Ability | 2000 V, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C, Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C, Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C <=6 s, absolute maximum rating |
| Luminous Intensity | 50 to 120 mcd, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 565 to 575 nm, IF=20 mA, Ta=25°C |
| Peak Wavelength | 570 nm typ, IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, IF=20 mA, Ta=25°C, 2θ1/2 |
| Half Wave Width | 20 nm typ, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA, VR=5 V, Ta=25°C |
| Brightness Bin D1 | 50 to 80 mcd, IF=20 mA |
| Brightness Bin D2 | 80 to 120 mcd, IF=20 mA |
| Brightness Tolerance | ±10%, brightness grading |
| Voltage Bin M17-9 | 1.8 to 1.9 V, IF=20 mA |
| Voltage Bin M18-1 | 1.9 to 2.0 V, IF=20 mA |
| Voltage Bin M18-2 | 2.0 to 2.1 V, IF=20 mA |
| Voltage Bin M18-3 | 2.1 to 2.2 V, IF=20 mA |
| Voltage Bin M18-4 | 2.2 to 2.3 V, IF=20 mA |
| Voltage Bin M18-5 | 2.3 to 2.4 V, IF=20 mA |
| Voltage Tolerance | ±0.1 V, voltage grading |
| Wavelength Bin HYG03 | 565 to 567.5 nm, IF=20 mA |
| Wavelength Bin HYG04 | 567.5 to 570 nm, IF=20 mA |
| Wavelength Bin HYG05 | 570 to 572.5 nm, IF=20 mA |
| Wavelength Bin HYG06 | 572.5 to 575 nm, IF=20 mA |
| Wavelength Tolerance | ±1 nm, wavelength grading |
| General Test Ambient Temperature | 25±5°C, unless otherwise indicated |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours, Ta=85±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours, Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours, Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles, IR reflow in-board 2 times; 100±5°C for 20 min to -40±5°C for 20 min |
| Anti-tin Test | 260±5°C, 10±1 s, 2 times, soldering temperature T.sol |
| Lead Reflow Peak Temperature | 235°C +5/-0°C, lead process, time at peak 10 to 15 s |
| Lead-free Reflow Peak Temperature | 255°C +0/-5°C, lead-free process, time at peak 5 to 10 s |
| Weldability Test | Tin loading rate >=95% pad area, soldering temperature 235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s |
| Outline Dimension Tolerance | ±0.25 mm, unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm, belt and disk dimensions |
| Hand Soldering Iron Power | <30 W recommended, hand soldering for repair/rework only |
| Hand Soldering Temperature | <300°C, each terminal once only, less than 3 s |
| Maximum Reflow Count | 2 times maximum, reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s, product recommendation |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s, after soldering |
| Ultrasonic Cleaning Power | <=300 W generally recommended, pretest required before cleaning |
| Unopened Storage Life | 1 year, moisture-proof anti-electrostatic package with desiccant |
| Pre-opening Storage Condition | <=30°C, <=60% RH, before opening package |
| Post-opening Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <=60% RH, after opening package / operation |
| Baking Condition | 60±5°C for 24 hours, if desiccant has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-2012SYGC from XINGLIGHT is a yellow-green SMD chip LED supplied in a 2012 surface-mount package with 2.0 x 1.2 x 0.8 mm outline dimensions. The device uses a transparent, water-clear colloid and is intended for SMT automatic production and reflow soldering processes. The datasheet identifies RoHS compliance and moisture sensitivity level MSL 3.
Key Features
- Yellow-green SMD chip LED in 2012 package
- 2.0 x 1.2 x 0.8 mm outline dimensions
- Water-clear transparent colloid lens construction
- 50 to 120 mcd at IF=20 mA
- 565 to 575 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage range
- 120° typical viewing angle at IF=20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulse conditions
- MSL 3 moisture sensitivity level
- Suitable for SMT automatic production
- Compatible with reflow soldering process
Typical Applications
- Yellow-green status indicators
- Compact PCB indicator lamps
- Control panel indication
- Instrument display indicators
- Backlighting for small interfaces
- Signal and mode indication
- Surface-mount LED assemblies
Procurement Notes
When requesting a quote for XL-2012SYGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-2012SYGC?
XL-2012SYGC uses a 2012 SMD LED package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 50 to 120 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, 120° typical viewing angle, and 20 nm typical half wave width.
What forward voltage range does this LED specify?
The forward voltage range is 1.8 to 2.4 V at IF=20 mA and Ta=25°C. The datasheet also defines voltage bins from 1.8 to 1.9 V through 2.3 to 2.4 V, with ±0.1 V voltage tolerance.
What assembly processes are supported by XL-2012SYGC?
The device is listed as suitable for SMT automatic production and reflow soldering. The datasheet gives a maximum reflow count of two times, along with lead and lead-free reflow peak temperature conditions.
How should opened packages be stored before soldering?
After opening, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.