Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012UBC-DS |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2012 SMD, 2.0 x 1.2 x 0.8 mm |
| Appearance Dimension | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | Blue; high brightness |
| Colloid / Lens | Transparent colloid |
| RoHS Compliance | Meets RoHS requirements; environmental protection product |
| Moisture Sensitivity Level | MSL 3 |
| Output Type | Positive output; power-on long flash |
| Operating Voltage | 2.0 to 4.5 V; VDD, Ta=25°C unless otherwise defined |
| Operating Current | 0.2 mA max; IDD, VDD=3V, no load, Ta=25°C |
| Driving Current | 20 mA typ; IOL, VDS=1.0V, Ta=25°C |
| Operating Temperature | -40 to 85 °C; TOPR |
| Storage Temperature | -40 to 85 °C; TSTR |
| Luminous Intensity | 120 to 240 mcd; IF=20mA, Ta=25°C |
| Dominant Wavelength | 460 to 475 nm; IF=20mA, Ta=25°C |
| Peak Wavelength | 470 nm typ; IF=20mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20mA, Ta=25°C |
| Brightness Bin D3 | 120 to 150 mcd; IF=20mA |
| Brightness Bin D4 | 150 to 180 mcd; IF=20mA |
| Brightness Bin D5 | 180 to 210 mcd; IF=20mA |
| Brightness Bin D6 | 210 to 240 mcd; IF=20mA |
| Wavelength Bin HB04 | 460 to 465 nm; IF=20mA |
| Wavelength Bin HB05 | 465 to 470 nm; IF=20mA |
| Wavelength Bin HB06 | 470 to 475 nm; IF=20mA |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 50 cycles; 105°C 30min, 25°C 5min, -55°C 30min, 25°C 5min |
| Hot and Cold Impact Test | 50 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C, 20min each |
| Anti-tin Test Temperature | 260±5°C; T.sol soldering temperature |
| Anti-tin Test Duration | 10±1 seconds, 2 times; soldering resistance test |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 seconds |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 seconds |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; product recommendation |
| Hand Soldering Iron Power | Less than 30 W; recommended for repair/rework only |
| Hand Soldering Temperature | Below 300°C; each terminal once, less than 3 seconds |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | 300 W max; pretest required to confirm no LED damage |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year; moisture-proof anti-electrostatic package |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours / 7 days; after package opening |
| Recommended Workshop Condition | ≤30°C, <60% RH; operation environment |
| Baking Condition | 60±5°C for 24 hours; if moisture absorber faded or storage time exceeded |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Datasheet Status | request_only |
Product Overview
XL-2012UBC-DS operates from 2.0 to 4.5 V and is characterized at Ta=25°C unless otherwise defined. The datasheet lists 0.2 mA maximum operating current at VDD=3 V with no load, 20 mA typical driving current, 120 to 240 mcd luminous intensity at IF=20 mA, a 460 to 475 nm dominant wavelength range, 470 nm typical peak wavelength, and a 120° typical viewing angle.
For assembly, the part is rated MSL 3 and meets RoHS requirements. The datasheet includes lead and lead-free reflow peak conditions, a recommended maximum soldering temperature of 240±5°C for 6 seconds, hand soldering guidance below 300°C for less than 3 seconds per terminal, and post-solder alcohol cleaning limits. Storage guidance covers unopened, opened, workshop, and baking conditions.
Key Features
- Blue flashing SMD LED with positive output
- 2012 package measuring 2.0 x 1.2 x 0.8 mm
- Transparent colloid lens construction
- 2.0 to 4.5 V operating voltage range
- 120 to 240 mcd luminous intensity at 20 mA
- 460 to 475 nm dominant wavelength range
- 470 nm typical peak wavelength at 20 mA
- 120° typical viewing angle at 20 mA
- -40 to 85 °C operating temperature range
- MSL 3 moisture sensitivity level
- RoHS requirements met per datasheet
Typical Applications
- Blue status indication
- Power-on long flash indicators
- Compact SMD indicator designs
- Low-voltage LED circuits
- Panel indication assemblies
- Portable equipment indicators
- Surface-mount blue signal lights
Procurement Notes
When requesting a quote for XL-2012UBC-DS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-2012UBC-DS use?
XL-2012UBC-DS uses a 2012 SMD package with appearance dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What optical output is specified for this LED?
The device is specified as a blue high-brightness LED with 120 to 240 mcd luminous intensity at IF=20 mA and Ta=25°C. The dominant wavelength is 460 to 475 nm, with a 470 nm typical peak wavelength.
What operating voltage and temperature ranges apply?
The datasheet specifies a 2.0 to 4.5 V operating voltage range. Operating temperature and storage temperature are both listed as -40 to 85 °C.
What storage controls are required after opening?
After opening the package, storage should be at ≤30°C and <40% RH, and soldering should be completed within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.