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XL-2012UGC-DS Emerald Green SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS

Part Number: XL-2012UGC-DS
Manufacturer: XINGLIGHT
Package: 2012 SMD, 2.0 x 1.2 x 0.8 mm
Category: LED
Product Type: SMD LED

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Quick Sourcing Note

XL-2012UGC-DS from XINGLIGHT is an emerald green SMD LED in a 2012 package measuring 2.0 x 1.2 x 0.8 mm. It uses transparent colloid encapsulation and provides 400-600 mcd luminous intensity at IF=20 mA and Ta=25°C. The dominant wavelength range is 515-530 nm, with a typical 525 nm peak wavelength and typical 120° viewing angle. Electrical ratings include 2.0-4.5 V operating voltage, maximum 0.2 mA operating current under no-load conditions at VDD=3 V, and typical 20 mA driving current. It is suited for SMT indicator and visual signaling designs using automatic mounting and reflow soldering.

Specifications

Type	Description
Part Number	XL-2012UGC-DS
Manufacturer	XINGLIGHT
Product Type	SMD LED
Category	LED
Package Case	2012 SMD, 2.0 x 1.2 x 0.8 mm
Package Dimensions	2.0 x 1.2 x 0.8 mm; L/W/H
Luminous Color	High brightness emerald green; transparent colloid
Colloid Type	Transparent colloid; LED encapsulation
RoHS Compliance	Meets RoHS requirements; environmental protection product
Moisture Sensitivity Level	MSL 3
Packaging Standard	EIA standard packaging
Mounting Compatibility	Suitable for automatic mounter; SMT assembly
Soldering Process Compatibility	Suitable for reflow soldering process; SMT assembly
Output Type	Positive output, power on long flash; powered operation
Operating Voltage	2.0-4.5 V; VDD, Ta=25°C unless otherwise defined
Operating Current	Max 0.2 mA; IDD, VDD=3 V, no load
Driving Current	Typ 20 mA; IOL, VDS=1.0 V
Operating Temperature	-40 to 85 °C; TOPR
Storage Temperature	-40 to 85 °C; TSTR
Luminous Intensity	400-600 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength	515-530 nm; IF=20 mA, Ta=25°C
Peak Wavelength	Typ 525 nm; IF=20 mA, Ta=25°C
Viewing Angle	Typ 120°; 2θ1/2, IF=20 mA, Ta=25°C
Brightness Grade E2	400-450 mcd; IF=20 mA
Brightness Grade E3	450-500 mcd; IF=20 mA
Brightness Grade E4	500-550 mcd; IF=20 mA
Brightness Grade E5	550-600 mcd; IF=20 mA
Wavelength Grade HG02	515-520 nm; IF=20 mA
Wavelength Grade HG03	520-525 nm; IF=20 mA
Wavelength Grade HG04	525-530 nm; IF=20 mA
Working Life Test	1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature High Humidity Storage Test	240 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test	1000 hours; Ta=85±5°C
Low Temperature Storage Test	1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test	100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test	100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each
Anti-Tin Test	260±5°C for 10±1 seconds, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature	235°C +5/-0°C; keep at peak for 10-15 seconds
Lead-Free Reflow Peak Temperature	255°C +0/-5°C; keep at peak for 5-10 seconds
Weldability Test	235±5°C, immersion time 2±0.5 seconds; immersion speed 25±2.5 mm/s, tin loading rate ≥95% pad area
Dimensional Tolerance	±0.25 mm; unless otherwise noted
Tape/Reel Dimensional Tolerance	±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power	Less than 30 W; manual repair/rework soldering
Hand Soldering Temperature	Under 300°C; each terminal less than 3 seconds, one time only
Maximum Reflow Count	2 times; reflow soldering
Recommended Maximum Welding Temperature	240±5°C for 6 seconds; product recommendation
Cleaning With Alcohol	Under 30°C for 3 minutes or under 50°C for 30 seconds; after soldering
Ultrasonic Cleaning Power	Max 300 W; pretest required before cleaning
Unopened Storage Conditions	≤30°C, ≤60% RH, use within 1 year; before opening moisture-proof package
Opened Storage Conditions	≤30°C, ≤40% RH, solder within 168 hours; after opening package
Recommended Workshop Conditions	≤30°C, ≤60% RH; operation after opening package
Baking Condition	60±5°C for 24 hours; if moisture absorbent faded or storage time exceeded
Datasheet Status	request_only

Product Overview

XL-2012UGC-DS is a XINGLIGHT emerald green SMD LED supplied in a compact 2012 package. The package dimensions are 2.0 x 1.2 x 0.8 mm, with a dimensional tolerance of ±0.25 mm unless otherwise noted. The device uses transparent colloid encapsulation and is described as a high brightness emerald green LED.

Optical characteristics at IF=20 mA and Ta=25°C include 400-600 mcd luminous intensity, 515-530 nm dominant wavelength, typical 525 nm peak wavelength, and a typical 120° viewing angle. Brightness grades span E2 through E5 from 400 mcd to 600 mcd, while wavelength grades HG02, HG03, and HG04 cover 515-530 nm.

For assembly, the device supports EIA standard packaging, automatic mounting, and reflow soldering. It is rated MSL 3 and meets RoHS requirements. Handling guidance includes a maximum of two reflow cycles, recommended maximum welding at 240±5°C for 6 seconds, and storage controls before and after opening the moisture-proof package.

Key Features

2012 SMD package, 2.0 x 1.2 x 0.8 mm
High brightness emerald green transparent colloid LED
400-600 mcd luminous intensity at IF=20 mA
515-530 nm dominant wavelength at IF=20 mA
Typical 525 nm peak wavelength at IF=20 mA
Typical 120° viewing angle at IF=20 mA
2.0-4.5 V operating voltage range
Suitable for automatic mounter and reflow soldering
MSL 3 moisture sensitivity level
RoHS requirements met per datasheet
EIA standard packaging support
Maximum two reflow soldering cycles

Typical Applications

Emerald green status indicators
Compact PCB visual signaling
SMT indicator assemblies
Automatic-mounter LED placement
Reflow-soldered electronic assemblies
Low-profile panel indication
Power-on long-flash output designs

Procurement Notes

When requesting a quote for XL-2012UGC-DS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-2012UGC-DS?

XL-2012UGC-DS uses a 2012 SMD package with stated dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet also lists a dimensional tolerance of ±0.25 mm unless otherwise noted.

What optical output does this LED provide?

At IF=20 mA and Ta=25°C, the LED provides 400-600 mcd luminous intensity, 515-530 nm dominant wavelength, typical 525 nm peak wavelength, and a typical 120° viewing angle.

What assembly processes are supported by XL-2012UGC-DS?

The datasheet states that the LED is suitable for automatic mounter use and reflow soldering. It uses EIA standard packaging and allows a maximum of two reflow soldering cycles.

What storage conditions apply after opening the package?

After opening the moisture-proof package, storage should be ≤30°C and ≤40% RH, with soldering completed within 168 hours. Recommended workshop conditions are ≤30°C and ≤60% RH.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.