Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012UWC-A |
| Manufacturer | XINGLIGHT |
| Product Type | White SMD LED |
| Category | LED |
| Package / Case | 2012 SMD LED, 2.0 x 1.2 x 0.8 mm |
| Outline Dimensions | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | White; yellow colloid |
| RoHS Compliance | Complied with RoHS Directive; environmental protection products |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| Packaging Standard | EIA standard packaging |
| SMT Compatibility | Suitable for SMT automatic production; surface mount assembly |
| Reflow Soldering Compatibility | Suitable for reflow soldering process; assembly process |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| Antistatic Ability | 2000 V; ESD, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; Ta=25°C absolute maximum rating table |
| Luminous Intensity | 550-1150 mcd; IF=20 mA, Ta=25°C |
| Color Temperature | 4500-6500 K; IF=20 mA, Ta=25°C |
| Chromaticity Coordinate X | Typ 0.335; IF=20 mA, Ta=25°C |
| Chromaticity Coordinate Y | Typ 0.35; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6-3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | Typ 120°; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | Max 1 µA; VR=5 V, Ta=25°C |
| Brightness Bin E5 | 550-600 mcd; IF=20 mA |
| Brightness Bin E6 | 600-700 mcd; IF=20 mA |
| Brightness Bin E7 | 700-800 mcd; IF=20 mA |
| Brightness Bin E8 | 800-900 mcd; IF=20 mA |
| Brightness Bin E9 | 900-1000 mcd; IF=20 mA |
| Brightness Bin F1 | 1000-1150 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; brightness grading |
| Voltage Bin M18-8 | 2.6-2.7 V; IF=20 mA |
| Voltage Bin M18-9 | 2.7-2.8 V; IF=20 mA |
| Voltage Bin M19-1 | 2.8-2.9 V; IF=20 mA |
| Voltage Bin M19-2 | 2.9-3.0 V; IF=20 mA |
| Voltage Bin M19-3 | 3.0-3.1 V; IF=20 mA |
| Voltage Bin M19-4 | 3.1-3.2 V; IF=20 mA |
| Voltage Bin M19-5 | 3.2-3.3 V; IF=20 mA |
| Voltage Bin M19-6 | 3.3-3.4 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; voltage grading |
| Color Zone Code XC2 | UW7-11; main color zone code |
| Color Zone Code XC3 | UW6-10; main color zone code |
| Color Zone Code XC4 | UW5-9; main color zone code |
| Chromaticity Coordinate Tolerance | ±0.01; color grading, XY coordinates |
| Test Environment Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR-Reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-Reflow in-board 2 times; 100±5°C for 20 min and -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Reflow Peak Temperature | 235°C +5/-0°C; lead process, hold 10-15 s at peak |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; lead-free process, hold 5-10 s at peak |
| Solderability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | Less than 30 W; hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | Under 300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Solvent | Alcohol recommended; after soldering |
| Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | Max 300 W; pretest required before ultrasonic cleaning |
| Unopened Storage Life | 1 year; moisture-proof anti-electrostatic package with desiccant |
| Pre-Opening Storage Condition | <=30°C, <60% RH; before opening package |
| Post-Opening Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; product operation/workshop environment |
| Baking Condition | 60±5°C for 24 hours; if desiccant fades or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-2012UWC-A is a XINGLIGHT white SMD LED supplied in a compact 2012 surface-mount package with 2.0 x 1.2 x 0.8 mm outline dimensions. The luminous color is white with yellow colloid construction, and the part is classified as a White SMD LED in the LED category.
Electrical and optical specifications are defined at IF=20 mA and Ta=25°C. The LED has 550-1150 mcd luminous intensity, 4500-6500 K color temperature, chromaticity coordinates of typ 0.335 for X and typ 0.35 for Y, 2.6-3.4 V forward voltage, typ 120° viewing angle, and max 1 µA reverse current at VR=5 V.
For assembly, the datasheet identifies SMT automatic production compatibility, suitability for reflow soldering, EIA standard packaging, MSL 3 moisture sensitivity, and RoHS compliance. Handling data includes a maximum of two reflow cycles, recommended maximum welding temperature of 240±5°C for 6 s, and post-opening storage at <=30°C, <40% RH with soldering within 168 hours / 7 days.
Key Features
- 2012 SMD LED package, 2.0 x 1.2 x 0.8 mm
- White luminous color with yellow colloid construction
- 550-1150 mcd luminous intensity at IF=20 mA
- 4500-6500 K color temperature at IF=20 mA
- 2.6-3.4 V forward voltage at IF=20 mA
- Typical 120° viewing angle at IF=20 mA
- MSL 3 moisture sensitivity classification
- Suitable for SMT automatic production
- Suitable for reflow soldering process
- RoHS Directive compliance stated in datasheet
- -40 to +85°C operating temperature range
- EIA standard packaging specified
Typical Applications
- SMT LED assemblies
- Reflow-soldered circuit boards
- White indicator lighting
- Compact 2012 LED layouts
- Controlled-bin brightness designs
- 4500-6500 K white light designs
- Moisture-controlled production workflows
Procurement Notes
When requesting a quote for XL-2012UWC-A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size is used for XL-2012UWC-A?
XL-2012UWC-A uses a 2012 SMD LED package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the device is specified for 550-1150 mcd luminous intensity, 4500-6500 K color temperature, typical chromaticity coordinates of X 0.335 and Y 0.35, and a typical 120° viewing angle.
What forward voltage range is specified for this LED?
The forward voltage range is 2.6-3.4 V at IF=20 mA and Ta=25°C. The datasheet also provides voltage bins from M18-8 at 2.6-2.7 V through M19-6 at 3.3-3.4 V, with ±0.1 V voltage tolerance.
What assembly processes are supported by XL-2012UWC-A?
The datasheet states that XL-2012UWC-A is suitable for SMT automatic production and for the reflow soldering process. It also specifies a maximum reflow count of two times and a recommended maximum welding temperature of 240±5°C for 6 s.
How should the LED be stored after opening?
After opening the package, the storage condition is <=30°C and <40% RH, and soldering should be completed within 168 hours, or 7 days. If the desiccant fades or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.