Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012UWC-DS |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | 2012 SMD LED, 2.0 x 1.2 x 0.8 mm |
| Package dimensions | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous color | White light; yellow colloid/package resin |
| RoHS compliance | Meets RoHS requirements; environmental protection product |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| Output behavior | Positive output, power-on long flash; on power application |
| Operating voltage | 2.0 to 4.5 V; VDD, Ta=25°C unless otherwise defined |
| Operating current | 0.2 mA max; IDD, no load, VDD=3 V, Ta=25°C |
| Driving current | 20 mA typ; IOL at VDS=1.0 V, VDD=3 V, Ta=25°C |
| Operating temperature | -40 to 85 °C; TOPR |
| Storage temperature | -40 to 85 °C; TSTR |
| Luminous intensity | 500 to 900 mcd; IF=20 mA, Ta=25°C |
| Half intensity viewing angle | 120 deg typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Color temperature | 6000 to 7500 K; IF=20 mA, Ta=25°C |
| Reverse current | 5 uA max; VR=5 V, Ta=25°C |
| Brightness bin E4 | 500 to 550 mcd; IF=20 mA |
| Brightness bin E5 | 550 to 600 mcd; IF=20 mA |
| Brightness bin E6 | 600 to 700 mcd; IF=20 mA |
| Brightness bin E7 | 700 to 800 mcd; IF=20 mA |
| Brightness bin E8 | 800 to 900 mcd; IF=20 mA |
| Color temperature bin UW8 | 6000 to 6900 K; IF=20 mA |
| Color temperature bin UW9 | 6500 to 7500 K; IF=20 mA |
| General dimensional tolerance | ±0.25 mm; unless otherwise noted |
| Tape/reel dimensional tolerance | ±0.1 mm; belt and disk dimensions |
| Hand soldering iron power | Less than 30 W; hand soldering for repair/rework only |
| Hand soldering temperature | Under 300 °C; each terminal once only |
| Hand soldering time | Less than 3 s per terminal; each terminal once only |
| Maximum reflow cycles | 2 times max; reflow soldering |
| Recommended maximum soldering temperature | 240±5 °C for 6 s; product recommended maximum welding temperature |
| Cleaning condition | Under 30 °C for 3 min or under 50 °C for 30 s; alcohol cleaning after soldering |
| Ultrasonic cleaning power | 300 W max; pretest recommended before cleaning |
| Unopened storage condition | ≤30 °C, ≤60% RH, use within 1 year; before opening package |
| Opened storage condition | ≤30 °C, ≤40% RH, solder within 168 hours / 7 days; after opening package |
| Baking condition | 60±5 °C for 24 hours; if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-2012UWC-DS is a XINGLIGHT white SMD flashing LED supplied in a compact 2012 package with 2.0 x 1.2 x 0.8 mm dimensions. It is specified as a white-light device using yellow colloid/package resin and provides positive output with a power-on long flash behavior.
Electrical operation is defined over a 2.0 to 4.5 V VDD range at Ta=25°C unless otherwise defined. The datasheet lists 0.2 mA maximum operating current with no load at VDD=3 V and 20 mA typical driving current at VDS=1.0 V, VDD=3 V, Ta=25°C. Optical specifications at IF=20 mA include 500 to 900 mcd luminous intensity, 120 degree typical half-intensity viewing angle, and 6000 to 7500 K color temperature.
The part is suitable for compact white flashing LED indication where the stated voltage range, viewing angle, luminous intensity bins, and color temperature bins match the design requirement. Assembly handling is governed by MSL 3 requirements, two maximum reflow cycles, hand soldering below 30 W and under 300°C for less than 3 seconds per terminal, and specified storage, cleaning, and baking conditions.
Key Features
- 2012 SMD package, 2.0 x 1.2 x 0.8 mm
- White light with yellow colloid/package resin
- Positive output with power-on long flash behavior
- 2.0 to 4.5 V operating voltage range
- 0.2 mA maximum no-load operating current
- 20 mA typical driving current at VDD=3 V
- 500 to 900 mcd luminous intensity at IF=20 mA
- 120 degree typical half-intensity viewing angle
- 6000 to 7500 K color temperature range
- MSL 3 moisture sensitivity classification
- RoHS requirements met per datasheet
- Two maximum reflow soldering cycles
Typical Applications
- Compact white flashing indicators
- Power-on flash indication
- Surface-mount status lights
- Low-voltage LED signaling
- Wide-angle visual indication
- Cool-white indicator lighting
- Reflow-assembled LED boards
Procurement Notes
When requesting a quote for XL-2012UWC-DS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-2012UWC-DS use?
XL-2012UWC-DS uses a 2012 SMD LED package with 2.0 x 1.2 x 0.8 mm L/W/H dimensions. The general dimensional tolerance is ±0.25 mm unless otherwise noted.
What operating voltage range is specified for this LED?
The datasheet specifies a VDD operating voltage range of 2.0 to 4.5 V at Ta=25°C unless otherwise defined. No-load operating current is listed as 0.2 mA maximum at VDD=3 V.
What optical output does the XL-2012UWC-DS provide?
At IF=20 mA and Ta=25°C, the part is specified for 500 to 900 mcd luminous intensity, 120 degree typical half-intensity viewing angle, and 6000 to 7500 K color temperature.
What soldering limits are stated in the datasheet?
The datasheet allows a maximum of two reflow cycles and recommends a maximum soldering temperature of 240±5°C for 6 seconds. Hand soldering is limited to less than 30 W, under 300°C, and less than 3 seconds per terminal.
How should opened packages be stored before soldering?
After opening the package, the storage condition is ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. If storage limits are exceeded or the package/desiccant fails, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
