Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012VRC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2012 SMD LED, 2.0 x 1.2 x 0.8 mm |
| Outline Dimensions | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | Red light; red colloid package |
| Colloid Color | Red colloid; red light LED |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| SMT Compatibility | Suitable for SMT automatic production; surface mount assembly |
| Reflow Compatibility | Suitable for reflow soldering process; SMT soldering |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C, <=6 s; absolute maximum rating table |
| Luminous Intensity | 80 to 270 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 615 to 630 nm; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.7 to 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120 deg; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | typ 20 nm; IF=20 mA, Ta=25°C |
| Reverse Current | max 1 µA; VR=5 V, Ta=25°C |
| Brightness Grade D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D6 | 210 to 240 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D7 | 240 to 270 mcd; IF=20 mA, brightness error ±10% |
| Voltage Grade M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-3 | 3.0 to 3.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-4 | 3.1 to 3.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-5 | 3.2 to 3.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-6 | 3.3 to 3.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Grade HR01 | 615 to 620 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HR02 | 620 to 625 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HR03 | 625 to 630 nm; IF=20 mA, wavelength error ±1 nm |
| General Test Ambient Temperature | 25 ±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85 ±5°C, RH=90 to 95% |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-Tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; time at peak 10 to 15 s; temperature above 183°C for 60 to 150 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; time at peak 5 to 10 s; temperature above 217°C for 60 to 120 s |
| Weldability Test | 235 ±5°C, 2 ±0.5 s immersion; immersion speed 25 ±2.5 mm/s; tin loading rate >=95% pad area |
| Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | less than 30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | under 300°C; each LED terminal less than 3 s, one time only |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommended maximum soldering temperature |
| Alcohol Cleaning Condition | under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | max 300 W; pretest required before ultrasonic cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof antistatic package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours; after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; operation after opening package |
| Baking Condition | 60 ±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-2012VRC is a XINGLIGHT red SMD indicator LED built in a 2012 surface-mount package. The body dimensions are 2.0 x 1.2 x 0.8 mm, and the device is specified as a red light LED with red colloid encapsulation.
At IF=20 mA and Ta=25°C, the device provides 80 to 270 mcd luminous intensity, 615 to 630 nm dominant wavelength, 2.7 to 3.4 V forward voltage, 120 degree viewing angle, and a typical 20 nm half wave width. Reverse current is specified at a maximum of 1 µA at VR=5 V.
The LED is suitable for SMT automatic production and reflow soldering. It is rated MSL 3, complies with the RoHS Directive, and has defined handling, storage, baking, soldering, cleaning, and reliability test conditions for production use in red indication and surface-mount signal applications.
Key Features
- 2012 SMD LED package, 2.0 x 1.2 x 0.8 mm
- Red light output with red colloid encapsulation
- 80 to 270 mcd luminous intensity at 20 mA
- 615 to 630 nm dominant wavelength range
- 2.7 to 3.4 V forward voltage at 20 mA
- 120 degree viewing angle for indicator visibility
- 20 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- Suitable for SMT automatic production and reflow soldering
- RoHS Directive compliant environmental process
Typical Applications
- Red status indication
- Surface-mount signal indicators
- SMT control panels
- Reflow-assembled LED boards
- Compact red visual indicators
Procurement Notes
When requesting a quote for XL-2012VRC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size is specified for XL-2012VRC?
XL-2012VRC is specified as a 2012 SMD LED package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet lists the dimension tolerance as ±0.25 mm unless otherwise noted.
What optical output range does this red LED provide?
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 270 mcd luminous intensity, 615 to 630 nm dominant wavelength, 120 degree viewing angle, and typical 20 nm half wave width.
What current and voltage limits apply to XL-2012VRC?
The maximum continuous forward current is 20 mA at Ta=25°C. Peak forward current is 80 mA for pulse width <=0.1 ms and duty <=1/10. Maximum reverse voltage is 5 V, and forward voltage is 2.7 to 3.4 V at 20 mA.
Is XL-2012VRC compatible with SMT reflow assembly?
Yes. The extracted datasheet facts state that XL-2012VRC is suitable for SMT automatic production and suitable for reflow soldering. Lead-free reflow peak temperature is listed as 255°C +0/-5°C with 5 to 10 s at peak.
What storage handling is required after opening the package?
After opening, the LED should be stored at <=30°C and <40% RH and soldered within 168 hours. The recommended workshop condition is <=30°C and <60% RH. Baking is specified as 60 ±5°C for 24 hours when required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.