XL-2835SURC-02FJ Red Transparent SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-2835SURC-02FJ Red Transparent SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-2835SURC-02FJ
Manufacturer
XINGLIGHT
Package
2835 SMD LED, 2.8 x 3.5 x 0.8 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-2835SURC-02FJ from XINGLIGHT is a red transparent SMD LED in a 2835 package measuring 2.8 x 3.5 x 0.8 mm. It emits red light through transparent colloid and is intended for surface-mount automatic production with infrared reflow soldering compatibility. Key electrical and optical parameters include 1150-1800 mcd luminous intensity, 620-630 nm dominant wavelength, 625 nm typical peak wavelength, 1.8-2.4 V forward voltage, and 120° typical viewing angle at IF=60 mA and Ta=25°C. Absolute maximum ratings include 200 mW power dissipation, 60 mA continuous forward current, 5 V reverse voltage, and -40 to +85°C operating range.

Specifications

TypeDescription
Part NumberXL-2835SURC-02FJ
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case2835 SMD LED, 2.8 x 3.5 x 0.8 mm
Outline Dimensions2.8 x 3.5 x 0.8 mm
Luminous ColorRed light
ColloidTransparent
Moisture Sensitivity LevelMSL 3
RoHS ComplianceComplies with RoHS Directive
SMT CompatibilitySuitable for SMT automatic production
Reflow CompatibilitySuitable for infrared reflow soldering
Maximum Power Dissipation200 mW
Maximum Continuous Forward Current60 mA
Peak Forward Current200 mA
Maximum Reverse Voltage5 V
ESD Rating2000 V
Operating Temperature Range-40 to +85 °C
Storage Temperature Range-40 to +85 °C
Lead Soldering Temperature/Time260°C <=6 s
Luminous Intensity1150-1800 mcd
Dominant Wavelength620-630 nm
Peak Wavelength625 nm typ
Forward Voltage1.8-2.4 V
Viewing Angle120° typ
Half Wave Width20 nm typ
Reverse Current<=5 µA
Brightness Bin F21150-1300 mcd
Brightness Bin F31300-1450 mcd
Brightness Bin F41450-1600 mcd
Brightness Bin F51600-1800 mcd
Forward Voltage Bin N12-71.8-2.0 V
Forward Voltage Bin N12-82.0-2.2 V
Forward Voltage Bin N12-92.2-2.4 V
Dominant Wavelength Bin HR02620-625 nm
Dominant Wavelength Bin HR03625-630 nm
Dimension Tolerance±0.25 mm
Carrier Tape Dimension Tolerance±0.1 mm
Hand Soldering Iron Power<30 W
Hand Soldering Temperature<300°C
Maximum Reflow Cycles2 times
Recommended Maximum Welding Temperature240±5°C for 6 s
Post-Solder CleaningAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s
Ultrasonic Cleaning Power<=300 W
Unopened Storage Condition<=30°C, <60% RH, use within 1 year
Opened Storage Condition<=30°C, <40% RH, solder within 168 hours / 7 days
Recommended Workshop Condition<=30°C, <60% RH
Baking Condition60±5°C for 24 hours
Datasheet Statusrequest_only

Product Overview

XL-2835SURC-02FJ is a XINGLIGHT red transparent SMD LED supplied in a 2835 surface-mount package. The outline dimensions are 2.8 x 3.5 x 0.8 mm with a stated dimension tolerance of ±0.25 mm unless otherwise noted. The device uses transparent colloid for red light output.

At IF=60 mA and Ta=25°C, the LED is specified for 1150-1800 mcd luminous intensity, 620-630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle. Forward voltage is specified from 1.8-2.4 V, with reverse current up to 5 µA at VR=5 V.

Assembly guidance includes suitability for SMT automatic production and infrared reflow soldering. The datasheet lists MSL 3 handling, RoHS compliance, up to two reflow cycles, and a recommended maximum welding temperature of 240±5°C for 6 seconds. These parameters support use in red indication, display backlighting zones, panel lighting, and compact surface-mount signal lighting designs.

Key Features

  • Red light output with transparent colloid
  • 2835 SMD package measuring 2.8 x 3.5 x 0.8 mm
  • 1150-1800 mcd luminous intensity at IF=60 mA
  • 620-630 nm dominant wavelength at IF=60 mA
  • 1.8-2.4 V forward voltage at IF=60 mA
  • 120° typical viewing angle at IF=60 mA
  • 60 mA maximum continuous forward current
  • 200 mW maximum power dissipation at Ta=25°C
  • MSL 3 moisture sensitivity level
  • Suitable for SMT automatic production
  • Suitable for infrared reflow soldering
  • Complies with RoHS Directive

Typical Applications

  • Red status indicators
  • Surface-mount signal lighting
  • Display indicator points
  • Control panel indicators
  • Compact red illumination zones
  • Equipment front-panel lighting
  • PCB-mounted visual alerts

Procurement Notes

When requesting a quote for XL-2835SURC-02FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-2835SURC-02FJ use?

XL-2835SURC-02FJ uses a 2835 SMD LED package with outline dimensions of 2.8 x 3.5 x 0.8 mm. The datasheet states a general dimension tolerance of ±0.25 mm unless otherwise noted.

What are the main optical specifications at 60 mA?

At IF=60 mA and Ta=25°C, the LED is specified for 1150-1800 mcd luminous intensity, 620-630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.

What soldering guidance is listed for this LED?

The datasheet states suitability for infrared reflow soldering and SMT automatic production. Reflow soldering is limited to two times, with a recommended maximum welding temperature of 240±5°C for 6 seconds.

How should opened packages be stored before soldering?

After opening the package, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours or 7 days. If moisture indication or storage time limits are exceeded, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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