Specifications
| Type | Description |
|---|---|
| Part Number | XL-3210SURSYGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3.2 x 1.0 x 1.5 mm SMD package |
| Outline Dimensions | 3.2 x 1.0 x 1.5 mm; L/W/H |
| Luminous Color and Colloid | RGB / water colloid; transparent encapsulation |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complied with RoHS directive; environmental protection process |
| Consumed Power Red | 50 mW; Ta=25°C absolute maximum rating |
| Consumed Power Yellow-Green | 50 mW; Ta=25°C absolute maximum rating |
| Peak Forward Current Red | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current Yellow-Green | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Forward Working Current Red | 20 mA; Ta=25°C absolute maximum rating |
| Forward Working Current Yellow-Green | 20 mA; Ta=25°C absolute maximum rating |
| Reverse Voltage Red | 5 V; Ta=25°C absolute maximum rating |
| Reverse Voltage Yellow-Green | 5 V; Ta=25°C absolute maximum rating |
| ESD Withstand Voltage | 2000 V; antistatic ability |
| Operating Ambient Temperature | -40°C to +85°C; Topr |
| Storage Ambient Temperature | -40°C to +85°C; Tstg |
| Reflow Soldering Condition | 260°C, 6 s; Tsol absolute maximum soldering condition |
| Manual Welding Condition | 300°C, 3 s; Tsol absolute maximum soldering condition |
| Light Intensity Red | Min 120 mcd; IF=20 mA, Ta=25°C |
| Light Intensity Yellow-Green | Typ 50 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength Red | Min 620 nm, Max 630 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength Yellow-Green | Min 565 nm, Max 575 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Red | Typ 625 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Yellow-Green | Typ 570 nm; IF=20 mA, Ta=25°C |
| Half Wave Width Red | Typ 20 nm; IF=20 mA, Ta=25°C |
| Half Wave Width Yellow-Green | Typ 15 nm; IF=20 mA, Ta=25°C |
| Forward Voltage Red | Min 1.8 V, Max 2.4 V; IF=20 mA, Ta=25°C |
| Forward Voltage Yellow-Green | Min 1.7 V, Max 2.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | Typ 120 deg; 2θ1/2, R/YG, IF=20 mA, Ta=25°C |
| Reverse Current Red | Max 5 uA; VR=5 V, Ta=25°C |
| Reverse Current Yellow-Green | Max 5 uA; VR=5 V, Ta=25°C |
| Brightness Grade D1 | 50 to 80 mcd; IF=20 mA |
| Brightness Grade D2 | 80 to 120 mcd; IF=20 mA |
| Brightness Grade D3 | 120 to 150 mcd; IF=20 mA |
| Brightness Grade D4 | 150 to 180 mcd; IF=20 mA |
| Voltage Grade N11-3 | 1.7 to 1.9 V; IF=20 mA |
| Voltage Grade N11-4 | 1.9 to 2.1 V; IF=20 mA |
| Voltage Grade N11-5 | 2.1 to 2.3 V; IF=20 mA |
| Voltage Grade N12-7 | 1.8 to 2.0 V; IF=20 mA |
| Voltage Grade N12-8 | 2.0 to 2.2 V; IF=20 mA |
| Voltage Grade N12-9 | 2.2 to 2.4 V; IF=20 mA |
| Wavelength Grade HR02 | 620 to 625 nm; IF=20 mA |
| Wavelength Grade HR03 | 625 to 630 nm; IF=20 mA |
| Wavelength Grade HYG03 | 565 to 567.5 nm; IF=20 mA |
| Wavelength Grade HYG04 | 567.5 to 570 nm; IF=20 mA |
| Wavelength Grade HYG05 | 570 to 572.5 nm; IF=20 mA |
| Wavelength Grade HYG06 | 572.5 to 575 nm; IF=20 mA |
| Test Environment Temperature | 25 ±5°C; unless otherwise indicated |
| Dimensional Tolerance | ±0.25 mm; unless otherwise noted, outline dimensions |
| Carrier Tape Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Recommended Maximum Reflow Temperature | 240 ±5°C for 6 s; Pb-free reflow soldering recommendation |
| Maximum Number of Reflow Cycles | 2 times; reflow soldering |
| Hand Soldering Iron Power | Less than 30 W; hand soldering recommendation |
| Hand Soldering Temperature | Under 300°C; each terminal, one time only, less than 3 s |
| Alcohol Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s; cleaning after soldering |
| Ultrasonic Cleaning Power | Max 300 W; pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; operation/workshop environment |
| Baking Condition | 60 ±5°C for 24 hours; if moisture absorbent material fades or storage time is exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-3210SURSYGC is a XINGLIGHT LED supplied as an RGB water-clear SMD LED. Its outline dimensions are 3.2 x 1.0 x 1.5 mm, with transparent water colloid encapsulation and a listed dimensional tolerance of ±0.25 mm unless otherwise noted.
Electrical ratings at Ta=25°C include 50 mW consumed power for both red and yellow-green, 20 mA forward working current for each color, 80 mA peak forward current with pulse width <=0.1 ms and duty <=1/10, and 5 V reverse voltage. Optical characteristics at IF=20 mA and Ta=25°C include red dominant wavelength from 620 to 630 nm, yellow-green dominant wavelength from 565 to 575 nm, red peak wavelength of 625 nm, yellow-green peak wavelength of 570 nm, and 120° typical viewing angle.
Assembly guidance includes MSL 3 handling, Pb-free reflow recommendation of 240 ±5°C for 6 s, a maximum of two reflow cycles, and hand soldering under 300°C for less than 3 s per terminal.
Key Features
- 3.2 x 1.0 x 1.5 mm SMD package
- RGB water-clear LED with transparent water colloid encapsulation
- MSL 3 moisture sensitivity level
- RoHS directive compliance stated in datasheet
- Red and yellow-green 20 mA forward working current
- 80 mA peak forward current under pulsed conditions
- Red dominant wavelength range of 620 to 630 nm
- Yellow-green dominant wavelength range of 565 to 575 nm
- Typical 120 degree viewing angle at 20 mA
- Operating and storage temperature range -40°C to +85°C
- 2000 V ESD withstand voltage
- Pb-free reflow recommendation: 240 ±5°C for 6 s
Typical Applications
- Compact SMD indicator lighting
- Red and yellow-green status indicators
- PCB-mounted visual signaling
- Multicolor panel indication
- Small electronic device indicators
- Equipment operating-state display
- Reflow-assembled LED boards
Procurement Notes
When requesting a quote for XL-3210SURSYGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-3210SURSYGC use?
XL-3210SURSYGC uses a 3.2 x 1.0 x 1.5 mm SMD package. The datasheet lists the outline dimensions as L/W/H and gives a dimensional tolerance of ±0.25 mm unless otherwise noted.
What are the red and yellow-green wavelength ranges?
At IF=20 mA and Ta=25°C, the red dominant wavelength is specified from 620 to 630 nm. The yellow-green dominant wavelength is specified from 565 to 575 nm.
What soldering conditions are specified for this LED?
The absolute maximum reflow soldering condition is 260°C for 6 s, while the Pb-free recommendation is 240 ±5°C for 6 s with a maximum of two reflow cycles. Hand soldering is under 300°C for less than 3 s per terminal.
What storage conditions apply after opening the package?
After opening, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. If the moisture absorbent material fades or storage time is exceeded, baking is specified at 60 ±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
