Specifications
| Type | Description |
|---|---|
| Part Number | XL-3210UGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 3.2 x 1.0 x 1.5 mm |
| Outline Dimensions | 3.2 x 1.0 x 1.5 mm; L/W/H |
| Luminous Color | Green; water clear colloid |
| Colloid | Water clear; green luminous color |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| RoHS Compliance | Complies with RoHS Directive; environmental protection products |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature and Time | 260°C, <=6 s; absolute maximum rating |
| Luminous Intensity | 600 to 1450 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 535 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.5 to 3.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 28 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin E6 | 600 to 700 mcd; IF=20 mA |
| Brightness Bin E7 | 700 to 800 mcd; IF=20 mA |
| Brightness Bin E8 | 800 to 900 mcd; IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd; IF=20 mA |
| Brightness Bin F1 | 1000 to 1150 mcd; IF=20 mA |
| Brightness Bin F2 | 1150 to 1300 mcd; IF=20 mA |
| Brightness Bin F3 | 1300 to 1450 mcd; IF=20 mA |
| Voltage Bin N11-7 | 2.5 to 2.7 V; IF=20 mA |
| Voltage Bin N11-8 | 2.7 to 2.9 V; IF=20 mA |
| Voltage Bin N11-9 | 2.9 to 3.1 V; IF=20 mA |
| Voltage Bin N12-1 | 3.1 to 3.3 V; IF=20 mA |
| Wavelength Bin HG02 | 515 to 520 nm; IF=20 mA |
| Wavelength Bin HG03 | 520 to 525 nm; IF=20 mA |
| Wavelength Bin HG04 | 525 to 530 nm; IF=20 mA |
| Wavelength Bin HG05 | 530 to 535 nm; IF=20 mA |
| Default Test Ambient Temperature | 25 ±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours; Ta=85±5°C, RH=90-95%, IR-reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; solder temperature T.sol |
| Lead Process Reflow Maximum Temperature | 235°C +5/-0°C; keep at maximum temperature for 10-15 s |
| Lead-Free Reflow Maximum Temperature | 255°C +0/-5°C; keep at maximum temperature for 5-10 s |
| Solderability Test | 235±5°C, 2±0.5 s immersion; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Cleaning Condition | under 30°C for 3 min or under 50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; general maximum ultrasonic power |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours; after opening package |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent material has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-3210UGC is a XINGLIGHT green SMD indicator LED with water clear colloid and a 3.2 x 1.0 x 1.5 mm outline. The device is categorized as an LED and is specified with MSL 3 moisture sensitivity and compliance with the RoHS Directive.
At Ta=25°C, absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under pulse conditions, 5 V reverse voltage, and 2000 V ESD antistatic ability. Optical and electrical test data at IF=20 mA includes 600 to 1450 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 2.5 to 3.3 V forward voltage, 120° typical viewing angle, and 28 nm typical half wave width.
Assembly information includes 260°C lead soldering for up to 6 s, a recommended maximum welding condition of 240±5°C for 6 s, and up to two reflow cycles. Storage controls specify use within 1 year unopened at ≤30°C and <60% RH, or solder within 168 hours after opening at ≤30°C and <40% RH.
Key Features
- Green luminous color with water clear colloid
- 3.2 x 1.0 x 1.5 mm SMD outline
- MSL 3 moisture sensitivity classification
- RoHS Directive compliance stated in datasheet
- 20 mA maximum continuous forward current at Ta=25°C
- 600 to 1450 mcd luminous intensity at IF=20 mA
- 515 to 535 nm dominant wavelength range
- 2.5 to 3.3 V forward voltage at IF=20 mA
- 120° typical viewing angle at IF=20 mA
- -40 to +85 °C operating temperature range
- 2000 V ESD antistatic ability rating
- Two maximum reflow soldering cycles
Typical Applications
- Green status indication
- Compact panel indicators
- PCB-mounted visual indicators
- Equipment operating-state displays
- Signal presence indication
- Consumer electronics indicators
- Industrial control indicators
Procurement Notes
When requesting a quote for XL-3210UGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-3210UGC use?
XL-3210UGC uses an SMD LED package with outline dimensions of 3.2 x 1.0 x 1.5 mm. The datasheet also states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, XL-3210UGC is specified for 600 to 1450 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 28 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range is specified for XL-3210UGC?
The datasheet specifies a forward voltage range of 2.5 to 3.3 V at IF=20 mA and Ta=25°C. Voltage bins listed at IF=20 mA cover 2.5 to 2.7 V, 2.7 to 2.9 V, 2.9 to 3.1 V, and 3.1 to 3.3 V.
What storage conditions apply after opening the package?
After opening the package, the datasheet specifies storage at ≤30°C and <40% RH, with soldering within 168 hours. If the moisture absorbent material has faded or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.