XL-3216RGBC High Brightness RGB SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-3216RGBC High Brightness RGB SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-3216RGBC
Manufacturer
XINGLIGHT
Package
3216 SMD, 3.2 x 1.6 x 0.8 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-3216RGBC from XINGLIGHT is a high brightness RGB SMD LED in a 3216 package measuring 3.2 x 1.6 x 0.8 mm. The device uses transparent colloid encapsulation and supports red, green, and blue emission with a typical 120 deg viewing angle. At IF=20 mA and Ta=25°C, typical luminous intensity is 150 mcd red, 550 mcd green, and 180 mcd blue. Dominant wavelength ranges are 620-630 nm red, 520-530 nm green, and 460-475 nm blue. It is suitable for SMT automatic production and reflow soldering, with MSL 3 handling requirements.

Specifications

TypeDescription
Part NumberXL-3216RGBC
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case3216 SMD, 3.2 x 1.6 x 0.8 mm
Outline Dimensions3.2 x 1.6 x 0.8 mm; L/W/H
Luminous ColorRGB; high brightness, transparent colloid
Encapsulant / ColloidTransparent colloid; high brightness RGB LED
Moisture Sensitivity LevelMSL 3; moisture sensitivity level stated as 3 levels
RoHS ComplianceComplies with RoHS Directive; environmental protection products
Packaging StandardEIA standard packaging; standard packaging
SMT CompatibilitySuitable for SMT automatic production; automatic placement
Reflow CompatibilitySuitable for reflow soldering process; SMT assembly
Power Dissipation - Red50 mW; Ta=25°C absolute maximum rating
Power Dissipation - Green70 mW; Ta=25°C absolute maximum rating
Power Dissipation - Blue70 mW; Ta=25°C absolute maximum rating
Peak Forward Current - Red80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Peak Forward Current - Green80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Peak Forward Current - Blue80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Forward Working Current - Red20 mA; Ta=25°C absolute maximum rating
Forward Working Current - Green20 mA; Ta=25°C absolute maximum rating
Forward Working Current - Blue20 mA; Ta=25°C absolute maximum rating
Reverse Voltage - Red5 V; Ta=25°C absolute maximum rating
Reverse Voltage - Green5 V; Ta=25°C absolute maximum rating
Reverse Voltage - Blue5 V; Ta=25°C absolute maximum rating
ESD Rating2000 V; antistatic ability
Operating Ambient Temperature-40°C to +85°C; Topr
Storage Temperature-40°C to +85°C; Tstg
Reflow Soldering Limit260°C, 6 s; Tsol welding conditions
Manual Soldering Limit300°C, 3 s; Tsol welding conditions
Luminous Intensity - Redtyp 150 mcd; IF=20 mA, Ta=25°C
Luminous Intensity - Greentyp 550 mcd; IF=20 mA, Ta=25°C
Luminous Intensity - Bluetyp 180 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength - Redmin 620 nm, max 630 nm; IF=20 mA, Ta=25°C
Dominant Wavelength - Greenmin 520 nm, max 530 nm; IF=20 mA, Ta=25°C
Dominant Wavelength - Bluemin 460 nm, max 475 nm; IF=20 mA, Ta=25°C
Peak Wavelength - Redtyp 630 nm; IF=20 mA, Ta=25°C
Peak Wavelength - Greentyp 525 nm; IF=20 mA, Ta=25°C
Peak Wavelength - Bluetyp 465 nm; IF=20 mA, Ta=25°C
Spectral Half Width - Redtyp 20 nm; IF=20 mA, Ta=25°C
Spectral Half Width - Greentyp 30 nm; IF=20 mA, Ta=25°C
Spectral Half Width - Bluetyp 25 nm; IF=20 mA, Ta=25°C
Forward Voltage - Redmin 1.7 V, max 2.3 V; IF=20 mA, Ta=25°C
Forward Voltage - Greenmin 2.6 V, max 3.4 V; IF=20 mA, Ta=25°C
Forward Voltage - Bluemin 2.6 V, max 3.4 V; IF=20 mA, Ta=25°C
Viewing Angletyp 120 deg; 2θ1/2, R/G/B, IF=20 mA, Ta=25°C
Reverse Current - Redmax 1 uA; VR=5 V, Ta=25°C
Reverse Current - Greenmax 1 uA; VR=5 V, Ta=25°C
Reverse Current - Bluemax 1 uA; VR=5 V, Ta=25°C
Brightness Bin D3120-150 mcd; IF=20 mA
Brightness Bin D4150-180 mcd; IF=20 mA
Brightness Bin D5180-210 mcd; IF=20 mA
Brightness Bin D6210-240 mcd; IF=20 mA
Brightness Bin E3450-500 mcd; IF=20 mA
Brightness Bin E4500-550 mcd; IF=20 mA
Brightness Bin E5550-600 mcd; IF=20 mA
Brightness Bin E6600-700 mcd; IF=20 mA
Brightness Bin E7700-800 mcd; IF=20 mA
Brightness Bin E8800-900 mcd; IF=20 mA
Brightness Tolerance±10%; brightness grading
Voltage Bin N11-31.7-1.9 V; IF=20 mA
Voltage Bin N11-41.9-2.1 V; IF=20 mA
Voltage Bin N11-52.1-2.3 V; IF=20 mA
Voltage Bin N13-22.6-2.8 V; IF=20 mA
Voltage Bin N13-32.8-3.0 V; IF=20 mA
Voltage Bin N11-82.7-2.9 V; IF=20 mA
Voltage Bin N11-92.9-3.1 V; IF=20 mA
Voltage Tolerance±0.1 V; voltage grading
Wavelength Bin HR02620-625 nm; IF=20 mA
Wavelength Bin HB04460-465 nm; IF=20 mA
Wavelength Bin HB05465-470 nm; IF=20 mA
Wavelength Bin HB06470-475 nm; IF=20 mA
Wavelength Bin HG03520-525 nm; IF=20 mA
Wavelength Bin HG04525-530 nm; IF=20 mA
Wavelength Tolerance±1 nm; wavelength grading
Default Test Ambient Temperature25±5°C; unless otherwise indicated
Moisture-Proof Grade Reliability Test0/22 failed LEDs; 260°C max reflow, 10 s, twice; pre-reflow storage 30°C, 70% RH, 168 h; JEITA ED-4701 300.301
Lead-Free Reflow Reliability Test0/22 failed LEDs; maximum reflow temperature 245±5°C, 5 s; JEITA ED-4701 303/303A
Thermal Cycling Reliability Test0/22 failed LEDs; -40°C 30 min to 25°C 5 min to 100°C 30 min to 25°C 5 min, 100 cycles; JESD22-A104
Thermal Shock Reliability Test0/22 failed LEDs; -35°C 15 min, conversion time 3 min, 85°C 15 min, 100 cycles; JESD22-A106
High Temperature Storage Reliability Test0/22 failed LEDs; Ta=100°C, 1000 h; JESD22-A103
Low Temperature Storage Reliability Test0/22 failed LEDs; Ta=-40°C, 1000 h; JESD22-A119
Normal Temperature Aging Reliability Test0/22 failed LEDs; Ta=25°C, IF=20 mA, 1000 h; JESD22-A108
Forward Voltage Failure Criterion> U.S.L * 1.1; IF=20 mA
Light Intensity Failure Criterion< L.S.L * 0.7; IF=20 mA
Reverse Current Failure Criterion> U.S.L * 2.0; VR=5 V
Welding Reliability Failure CriterionSolder paste covering pads less than 95%; welding reliability standard #2
Dimension Tolerance±0.25 mm; unless otherwise noted
Tape/Reel Dimension Tolerance±0.15 mm; belt and disk dimensions
Recommended Manual Soldering Iron Power<30 W; hand soldering for repair/rework
Manual Soldering Recommendation<300°C, <3 s per terminal, one time only; hand soldering
Maximum Reflow Count2 times; reflow soldering
Recommended Maximum Soldering Temperature240±5°C for 6 s; product recommended maximum welding temperature
Cleaning With AlcoholUnder 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; general maximum ultrasonic power before pretest
Unopened Storage Condition<=30°C, <=60% RH, use within 1 year; before opening moisture-proof package
Opened Storage Condition<=30°C, <=40% RH, solder within 168 h / 7 days; after opening package
Recommended Workshop Condition<=30°C, <=60% RH; product operation after opening
Baking Condition60±5°C for 24 h; if moisture absorbent faded or LEDs exceeded storage time
Datasheet Statusrequest_only

Product Overview

The XL-3216RGBC is a XINGLIGHT high brightness RGB SMD LED supplied in a compact 3216 surface-mount package. Its outline dimensions are 3.2 x 1.6 x 0.8 mm, with transparent colloid encapsulation and RGB luminous color output.

Electrical and optical ratings are specified at IF=20 mA and Ta=25°C for the main characteristics. Typical luminous intensity values are 150 mcd for red, 550 mcd for green, and 180 mcd for blue. Forward voltage ranges are 1.7-2.3 V for red and 2.6-3.4 V for green and blue, with a typical viewing angle of 120 deg.

Assembly-related facts include EIA standard packaging, compatibility with SMT automatic production, and suitability for reflow soldering. The part is rated MSL 3, complies with the RoHS Directive, and has operating and storage temperature ranges of -40°C to +85°C. These parameters support use in compact RGB indication, display, and lighting assemblies requiring surface-mount processing.

Key Features

  • 3216 SMD package, 3.2 x 1.6 x 0.8 mm
  • RGB luminous color with transparent colloid encapsulation
  • Typical 120 deg viewing angle at IF=20 mA
  • Red dominant wavelength range from 620 to 630 nm
  • Green dominant wavelength range from 520 to 530 nm
  • Blue dominant wavelength range from 460 to 475 nm
  • 20 mA forward working current per color channel
  • MSL 3 moisture sensitivity level
  • Suitable for SMT automatic production
  • Suitable for reflow soldering process
  • RoHS Directive compliance stated in datasheet
  • Operating ambient temperature from -40°C to +85°C

Typical Applications

  • RGB status indicators
  • Compact display backlighting
  • Color indication panels
  • Surface-mount lighting assemblies
  • Consumer electronic indicators
  • Control panel indicators
  • RGB display modules

Procurement Notes

When requesting a quote for XL-3216RGBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-3216RGBC use?

XL-3216RGBC uses a 3216 SMD package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The datasheet also states a general dimension tolerance of ±0.25 mm unless otherwise noted.

What are the RGB optical wavelengths?

At IF=20 mA and Ta=25°C, the dominant wavelength ranges are 620-630 nm for red, 520-530 nm for green, and 460-475 nm for blue. Typical peak wavelengths are 630 nm, 525 nm, and 465 nm respectively.

What forward voltage ranges are specified?

At IF=20 mA and Ta=25°C, the red channel forward voltage range is 1.7-2.3 V. The green and blue channels are each specified from 2.6 V to 3.4 V.

Is XL-3216RGBC suitable for SMT assembly?

The datasheet states that XL-3216RGBC is suitable for SMT automatic production and suitable for the reflow soldering process. It is supplied with EIA standard packaging and has a maximum reflow count of 2 times.

What storage conditions apply after opening the package?

After opening, the specified storage condition is <=30°C and <=40% RH, with soldering within 168 hours or 7 days. If storage time is exceeded or the moisture absorbent fades, baking at 60±5°C for 24 hours is specified.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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