Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216RGBC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3216 SMD, 3.2 x 1.6 x 0.8 mm |
| Outline Dimensions | 3.2 x 1.6 x 0.8 mm; L/W/H |
| Luminous Color | RGB; high brightness, transparent colloid |
| Encapsulant / Colloid | Transparent colloid; high brightness RGB LED |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| RoHS Compliance | Complies with RoHS Directive; environmental protection products |
| Packaging Standard | EIA standard packaging; standard packaging |
| SMT Compatibility | Suitable for SMT automatic production; automatic placement |
| Reflow Compatibility | Suitable for reflow soldering process; SMT assembly |
| Power Dissipation - Red | 50 mW; Ta=25°C absolute maximum rating |
| Power Dissipation - Green | 70 mW; Ta=25°C absolute maximum rating |
| Power Dissipation - Blue | 70 mW; Ta=25°C absolute maximum rating |
| Peak Forward Current - Red | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current - Green | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current - Blue | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Forward Working Current - Red | 20 mA; Ta=25°C absolute maximum rating |
| Forward Working Current - Green | 20 mA; Ta=25°C absolute maximum rating |
| Forward Working Current - Blue | 20 mA; Ta=25°C absolute maximum rating |
| Reverse Voltage - Red | 5 V; Ta=25°C absolute maximum rating |
| Reverse Voltage - Green | 5 V; Ta=25°C absolute maximum rating |
| Reverse Voltage - Blue | 5 V; Ta=25°C absolute maximum rating |
| ESD Rating | 2000 V; antistatic ability |
| Operating Ambient Temperature | -40°C to +85°C; Topr |
| Storage Temperature | -40°C to +85°C; Tstg |
| Reflow Soldering Limit | 260°C, 6 s; Tsol welding conditions |
| Manual Soldering Limit | 300°C, 3 s; Tsol welding conditions |
| Luminous Intensity - Red | typ 150 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity - Green | typ 550 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity - Blue | typ 180 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Red | min 620 nm, max 630 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Green | min 520 nm, max 530 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Blue | min 460 nm, max 475 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Red | typ 630 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Green | typ 525 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Blue | typ 465 nm; IF=20 mA, Ta=25°C |
| Spectral Half Width - Red | typ 20 nm; IF=20 mA, Ta=25°C |
| Spectral Half Width - Green | typ 30 nm; IF=20 mA, Ta=25°C |
| Spectral Half Width - Blue | typ 25 nm; IF=20 mA, Ta=25°C |
| Forward Voltage - Red | min 1.7 V, max 2.3 V; IF=20 mA, Ta=25°C |
| Forward Voltage - Green | min 2.6 V, max 3.4 V; IF=20 mA, Ta=25°C |
| Forward Voltage - Blue | min 2.6 V, max 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | typ 120 deg; 2θ1/2, R/G/B, IF=20 mA, Ta=25°C |
| Reverse Current - Red | max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current - Green | max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current - Blue | max 1 uA; VR=5 V, Ta=25°C |
| Brightness Bin D3 | 120-150 mcd; IF=20 mA |
| Brightness Bin D4 | 150-180 mcd; IF=20 mA |
| Brightness Bin D5 | 180-210 mcd; IF=20 mA |
| Brightness Bin D6 | 210-240 mcd; IF=20 mA |
| Brightness Bin E3 | 450-500 mcd; IF=20 mA |
| Brightness Bin E4 | 500-550 mcd; IF=20 mA |
| Brightness Bin E5 | 550-600 mcd; IF=20 mA |
| Brightness Bin E6 | 600-700 mcd; IF=20 mA |
| Brightness Bin E7 | 700-800 mcd; IF=20 mA |
| Brightness Bin E8 | 800-900 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; brightness grading |
| Voltage Bin N11-3 | 1.7-1.9 V; IF=20 mA |
| Voltage Bin N11-4 | 1.9-2.1 V; IF=20 mA |
| Voltage Bin N11-5 | 2.1-2.3 V; IF=20 mA |
| Voltage Bin N13-2 | 2.6-2.8 V; IF=20 mA |
| Voltage Bin N13-3 | 2.8-3.0 V; IF=20 mA |
| Voltage Bin N11-8 | 2.7-2.9 V; IF=20 mA |
| Voltage Bin N11-9 | 2.9-3.1 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HR02 | 620-625 nm; IF=20 mA |
| Wavelength Bin HB04 | 460-465 nm; IF=20 mA |
| Wavelength Bin HB05 | 465-470 nm; IF=20 mA |
| Wavelength Bin HB06 | 470-475 nm; IF=20 mA |
| Wavelength Bin HG03 | 520-525 nm; IF=20 mA |
| Wavelength Bin HG04 | 525-530 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm; wavelength grading |
| Default Test Ambient Temperature | 25±5°C; unless otherwise indicated |
| Moisture-Proof Grade Reliability Test | 0/22 failed LEDs; 260°C max reflow, 10 s, twice; pre-reflow storage 30°C, 70% RH, 168 h; JEITA ED-4701 300.301 |
| Lead-Free Reflow Reliability Test | 0/22 failed LEDs; maximum reflow temperature 245±5°C, 5 s; JEITA ED-4701 303/303A |
| Thermal Cycling Reliability Test | 0/22 failed LEDs; -40°C 30 min to 25°C 5 min to 100°C 30 min to 25°C 5 min, 100 cycles; JESD22-A104 |
| Thermal Shock Reliability Test | 0/22 failed LEDs; -35°C 15 min, conversion time 3 min, 85°C 15 min, 100 cycles; JESD22-A106 |
| High Temperature Storage Reliability Test | 0/22 failed LEDs; Ta=100°C, 1000 h; JESD22-A103 |
| Low Temperature Storage Reliability Test | 0/22 failed LEDs; Ta=-40°C, 1000 h; JESD22-A119 |
| Normal Temperature Aging Reliability Test | 0/22 failed LEDs; Ta=25°C, IF=20 mA, 1000 h; JESD22-A108 |
| Forward Voltage Failure Criterion | > U.S.L * 1.1; IF=20 mA |
| Light Intensity Failure Criterion | < L.S.L * 0.7; IF=20 mA |
| Reverse Current Failure Criterion | > U.S.L * 2.0; VR=5 V |
| Welding Reliability Failure Criterion | Solder paste covering pads less than 95%; welding reliability standard #2 |
| Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.15 mm; belt and disk dimensions |
| Recommended Manual Soldering Iron Power | <30 W; hand soldering for repair/rework |
| Manual Soldering Recommendation | <300°C, <3 s per terminal, one time only; hand soldering |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning With Alcohol | Under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; general maximum ultrasonic power before pretest |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 h / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; product operation after opening |
| Baking Condition | 60±5°C for 24 h; if moisture absorbent faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
The XL-3216RGBC is a XINGLIGHT high brightness RGB SMD LED supplied in a compact 3216 surface-mount package. Its outline dimensions are 3.2 x 1.6 x 0.8 mm, with transparent colloid encapsulation and RGB luminous color output.
Electrical and optical ratings are specified at IF=20 mA and Ta=25°C for the main characteristics. Typical luminous intensity values are 150 mcd for red, 550 mcd for green, and 180 mcd for blue. Forward voltage ranges are 1.7-2.3 V for red and 2.6-3.4 V for green and blue, with a typical viewing angle of 120 deg.
Assembly-related facts include EIA standard packaging, compatibility with SMT automatic production, and suitability for reflow soldering. The part is rated MSL 3, complies with the RoHS Directive, and has operating and storage temperature ranges of -40°C to +85°C. These parameters support use in compact RGB indication, display, and lighting assemblies requiring surface-mount processing.
Key Features
- 3216 SMD package, 3.2 x 1.6 x 0.8 mm
- RGB luminous color with transparent colloid encapsulation
- Typical 120 deg viewing angle at IF=20 mA
- Red dominant wavelength range from 620 to 630 nm
- Green dominant wavelength range from 520 to 530 nm
- Blue dominant wavelength range from 460 to 475 nm
- 20 mA forward working current per color channel
- MSL 3 moisture sensitivity level
- Suitable for SMT automatic production
- Suitable for reflow soldering process
- RoHS Directive compliance stated in datasheet
- Operating ambient temperature from -40°C to +85°C
Typical Applications
- RGB status indicators
- Compact display backlighting
- Color indication panels
- Surface-mount lighting assemblies
- Consumer electronic indicators
- Control panel indicators
- RGB display modules
Procurement Notes
When requesting a quote for XL-3216RGBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-3216RGBC use?
XL-3216RGBC uses a 3216 SMD package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The datasheet also states a general dimension tolerance of ±0.25 mm unless otherwise noted.
What are the RGB optical wavelengths?
At IF=20 mA and Ta=25°C, the dominant wavelength ranges are 620-630 nm for red, 520-530 nm for green, and 460-475 nm for blue. Typical peak wavelengths are 630 nm, 525 nm, and 465 nm respectively.
What forward voltage ranges are specified?
At IF=20 mA and Ta=25°C, the red channel forward voltage range is 1.7-2.3 V. The green and blue channels are each specified from 2.6 V to 3.4 V.
Is XL-3216RGBC suitable for SMT assembly?
The datasheet states that XL-3216RGBC is suitable for SMT automatic production and suitable for the reflow soldering process. It is supplied with EIA standard packaging and has a maximum reflow count of 2 times.
What storage conditions apply after opening the package?
After opening, the specified storage condition is <=30°C and <=40% RH, with soldering within 168 hours or 7 days. If storage time is exceeded or the moisture absorbent fades, baking at 60±5°C for 24 hours is specified.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
