Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216SURC-FB |
| Manufacturer | XINGLIGHT |
| Product Type | Red SMD LED |
| Category | LED |
| Package / Case | 3216 SMD, 3.2 x 1.6 x 0.8 mm |
| Appearance Dimensions | 3.2 x 1.6 x 0.8 mm; L/W/H |
| Luminous Color | Red; colorless transparent colloid |
| Colloid / Lens Appearance | Colorless transparent |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS Directive |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature / Time | 260°C <=6 s |
| Luminous Intensity | 80-120 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 620-630 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 625 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9-2.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd; IF=20 mA; brightness error ±10% |
| Voltage Bin N11-4 | 1.9-2.1 V; IF=20 mA; voltage error ±0.1 V |
| Voltage Bin N11-5 | 2.1-2.3 V; IF=20 mA; voltage error ±0.1 V |
| Wavelength Bin HR02 | 620-625 nm; IF=20 mA; wavelength error ±1 nm |
| Default Test Ambient Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; test at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours; Ta=85 ±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s |
| Recommended Maximum Welding Temperature | 240 ±5°C / 6 s; product recommendation |
| Manual Soldering Iron Power | <30 W; hand soldering for repair/rework |
| Manual Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Reflow Soldering Limit | Maximum 2 times; reflow soldering |
| Package Storage Before Opening | <=30°C, <60% RH, use within 1 year; unopened moisture-proof anti-static package |
| Package Storage After Opening | <=30°C, <40% RH, solder within 168 hours; after opening package |
| Baking Condition | 60 ±5°C for 24 hours; if moisture absorbent has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-3216SURC-FB is a XINGLIGHT red SMD LED supplied in a 3216 surface-mount package with 3.2 x 1.6 x 0.8 mm appearance dimensions. The device has a colorless transparent colloid and is listed as RoHS compliant with moisture sensitivity level MSL 3.
At IF=20 mA and Ta=25°C, the LED provides 80-120 mcd luminous intensity, a 620-630 nm dominant wavelength, 625 nm typical peak wavelength, 1.9-2.3 V forward voltage, 120° typical viewing angle, and 20 nm typical half wave width. Absolute ratings at Ta=25°C include 50 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under the specified pulse condition, and 5 V maximum reverse voltage.
Assembly guidance includes lead soldering at 260°C for no more than 6 s, maximum two reflow soldering passes, and recommended welding at 240 ±5°C for 6 s. Storage guidance covers unopened storage within 1 year at <=30°C and <60% RH, and soldering within 168 hours after opening at <=30°C and <40% RH.
Key Features
- Red SMD LED in 3216 surface-mount package
- 3.2 x 1.6 x 0.8 mm appearance dimensions
- Colorless transparent colloid and lens appearance
- 80-120 mcd luminous intensity at 20 mA
- 620-630 nm dominant wavelength for red emission
- 1.9-2.3 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- MSL 3 moisture sensitivity level
- RoHS Directive compliant device listing
Typical Applications
- Red PCB status indicators
- Compact panel indication
- Signal lamp assemblies
- Consumer electronics indicators
- Instrument display backlighting
- Low-profile red visual alerts
- Surface-mount indicator arrays
Procurement Notes
When requesting a quote for XL-3216SURC-FB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-3216SURC-FB use?
XL-3216SURC-FB uses a 3216 SMD package with appearance dimensions of 3.2 x 1.6 x 0.8 mm for length, width, and height.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the device is specified for 80-120 mcd luminous intensity, 620-630 nm dominant wavelength, 625 nm typical peak wavelength, 120° typical viewing angle, and 20 nm typical half wave width.
What current and voltage limits apply to this LED?
At Ta=25°C, maximum continuous forward current is 20 mA, peak forward current is 80 mA under the stated pulse condition, maximum reverse voltage is 5 V, and forward voltage is 1.9-2.3 V at 20 mA.
How should opened packages be stored before soldering?
After opening, the package should be kept at <=30°C and <40% RH, and the LEDs should be soldered within 168 hours. Baking is specified at 60 ±5°C for 24 hours if storage time is exceeded or the moisture absorbent has faded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
