Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216SURC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | 3216 SMD, 3.2 x 1.6 x 0.8 mm |
| Outline Dimensions | 3.2 x 1.6 x 0.8 mm; L/W/H |
| Luminous Color | Red; transparent/water clear colloid |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; Ta=25°C absolute maximum rating table |
| Luminous Intensity | 80 to 180 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 615 to 630 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 620 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA |
| Brightness Measurement Tolerance | ±10%; brightness grading |
| Voltage Bin N11-4 | 1.9 to 2.1 V; IF=20 mA |
| Voltage Bin N11-5 | 2.1 to 2.3 V; IF=20 mA |
| Voltage Measurement Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HR01 | 615 to 620 nm; IF=20 mA |
| Wavelength Bin HR02 | 620 to 625 nm; IF=20 mA |
| Wavelength Bin HR03 | 625 to 630 nm; IF=20 mA |
| Wavelength Measurement Tolerance | ±1 nm; wavelength grading |
| General Test Ambient Temperature | 25 ±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85 ±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min; -40 ±5°C for 20 min |
| Anti-Tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s |
| Solderability Test | 235 ±5°C, 2 ±0.5 s immersion; immersion speed 25 ±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once only, less than 3 s |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommendation |
| Alcohol Cleaning Condition | 30°C for 3 min or 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours; after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; operation after package opening |
| Baking Condition | 60 ±5°C for 24 hours; if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
Electrical ratings at Ta=25°C include 50 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under pulse conditions, 5 V maximum reverse voltage, and 2000 V ESD withstand voltage. Optical characteristics at IF=20 mA include 80 to 180 mcd luminous intensity, 20 nm typical half wave width, and a 120° typical viewing angle.
For assembly, the part is rated MSL 3 and supports up to two reflow soldering cycles. Lead-free reflow peak temperature is specified as 255°C +0/-5°C for 5 to 10 s, while manual soldering is limited to less than 300°C, less than 3 s per terminal, with an iron under 30 W. These characteristics support compact surface-mount red indication, display status, and signal lighting designs.
Key Features
- 3216 SMD package measures 3.2 x 1.6 x 0.8 mm
- Red luminous output with transparent/water clear colloid
- 80 to 180 mcd luminous intensity at 20 mA
- 615 to 630 nm dominant wavelength at 20 mA
- 1.9 to 2.3 V forward voltage at 20 mA
- 120° typical viewing angle for wide emission
- 20 mA maximum continuous forward current rating
- 50 mW maximum power dissipation at 25°C
- 2000 V ESD withstand voltage at 25°C
- MSL 3 moisture sensitivity classification
Typical Applications
- Red status indicators
- Surface-mount display marking
- Compact signal lighting
- Panel indication circuits
- Portable device indicators
- Consumer electronics indicators
- Control board visual alerts
Procurement Notes
When requesting a quote for XL-3216SURC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-3216SURC use?
XL-3216SURC uses a 3216 SMD package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The listed outline dimension tolerance is ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED has 80 to 180 mcd luminous intensity, 615 to 630 nm dominant wavelength, 620 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range is specified for this LED?
The forward voltage is specified as 1.9 to 2.3 V at IF=20 mA and Ta=25°C. Voltage grading includes N11-4 from 1.9 to 2.1 V and N11-5 from 2.1 to 2.3 V.
What storage conditions apply after opening the package?
After opening the package, storage is specified at <=30°C and <40% RH, with soldering within 168 hours. The recommended workshop condition after opening is <=30°C and <60% RH.
How many reflow soldering cycles are allowed?
The maximum reflow count is specified as 2 times. Lead-free reflow peak temperature is 255°C +0/-5°C for 5 to 10 s, while lead process reflow peak temperature is 235°C +5/-0°C for 10 to 15 s.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.