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XL-3216SYGC Common Green SMD LED

Q: What package size does XL-3216SYGC use?

XL-3216SYGC uses a 3216 SMD LED package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The general dimension tolerance is ±0.25 mm unless otherwise noted.

Q: What soldering limits apply to this LED?

The device is suitable for reflow soldering with a maximum reflow count of two times. The recommended maximum welding temperature is 240 ±5°C for 6 seconds, while hand soldering should use less than 30 W and less than 300°C per terminal for under 3 seconds.

Q: How should opened packages be stored before soldering?

After opening the package, storage should be at <=30°C and <=40% RH, and the LEDs should be soldered within 168 hours or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.

RFQ Available Sourcing Support Alternative Matching RoHS

Part Number: XL-3216SYGC
Manufacturer: XINGLIGHT
Package: 3216 SMD LED, 3.2 x 1.6 x 0.8 mm
Category: LED
Product Type: SMD LED

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Quick Sourcing Note

XL-3216SYGC from XINGLIGHT is a common green SMD LED in a 3216 package measuring 3.2 x 1.6 x 0.8 mm. It uses a water-clear transparent colloid and is specified for SMT automatic production and reflow soldering. At IF=20 mA and Ta=25°C, luminous intensity is 50 to 100 mcd, dominant wavelength is 565 to 575 nm, peak wavelength is 570 nm typical, and viewing angle is 120° typical. Electrical limits include 20 mA continuous forward current, 80 mA peak forward current, 50 mW power dissipation, 5 V reverse voltage, and 2000 V ESD antistatic ability.

Specifications

Type	Description
Part Number	XL-3216SYGC
Manufacturer	XINGLIGHT
Product Type	SMD LED
Category	LED
Package / Case	3216 SMD LED, 3.2 x 1.6 x 0.8 mm
Outline Dimensions	3.2 x 1.6 x 0.8 mm; L/W/H
Luminous Color	High brightness common green; transparent/water-clear colloid
Colloid / Lens	Water-clear / transparent colloid; package appearance
RoHS Compliance	Complies with RoHS directive; environmental protection process
Moisture Sensitivity Level	MSL 3
Packaging Standard	EIA standard packaging
SMT Compatibility	Suitable for SMT automatic production
Reflow Soldering Compatibility	Suitable for reflow soldering process
Maximum Power Dissipation	50 mW; Ta=25°C
Maximum Continuous Forward Current	20 mA; Ta=25°C
Peak Forward Current	80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage	5 V; Ta=25°C
ESD Antistatic Ability	2000 V; Ta=25°C
Operating Temperature Range	-40 to +85 °C; Ta=25°C absolute maximum rating table
Storage Temperature Range	-40 to +85 °C; Ta=25°C absolute maximum rating table
Lead Soldering Temperature / Time	260°C <=6 s; Ta=25°C absolute maximum rating table
Luminous Intensity	50 min, 100 max mcd; IF=20 mA, Ta=25°C
Dominant Wavelength	565 min, 575 max nm; IF=20 mA, Ta=25°C
Peak Wavelength	570 typ nm; IF=20 mA, Ta=25°C
Forward Voltage	1.9 min, 2.4 max V; IF=20 mA, Ta=25°C
Viewing Angle	120° typ; 2θ1/2, IF=20 mA, Ta=25°C
Half Wave Width	20 typ nm; IF=20 mA, Ta=25°C
Reverse Current	<=1 µA max; VR=5 V, Ta=25°C
Brightness Bin D1	50 to 80 mcd; IF=20 mA, brightness error ±10%
Brightness Bin D2	80 to 120 mcd; IF=20 mA, brightness error ±10%
Voltage Bin M18-1	1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V
Voltage Bin M18-2	2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V
Voltage Bin M18-3	2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V
Voltage Bin M18-4	2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V
Voltage Bin M18-5	2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V
Wavelength Bin HYG03	565 to 567.5 nm; IF=20 mA, wavelength error ±1 nm
Wavelength Bin HYG04	567.5 to 570 nm; IF=20 mA, wavelength error ±1 nm
Wavelength Bin HYG05	570 to 572.5 nm; IF=20 mA, wavelength error ±1 nm
Wavelength Bin HYG06	572.5 to 575 nm; IF=20 mA, wavelength error ±1 nm
Default Test Ambient Temperature	25 ±5 °C; unless otherwise indicated
Working Life Test	1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature / High Humidity Storage Test	240 hours ±2 hours; IR reflow in-board 2 times, Ta=85±5°C, RH=90-95%
High Temperature Storage Test	1000 hours; Ta=85±5°C
Low Temperature Storage Test	1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test	100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test	100 cycles; IR reflow in-board 2 times; 100±5°C 20 min to -40±5°C 20 min
Anti-tin Test	260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature	235°C +5/-0°C; keep at peak for 10-15 s
Lead-Free Reflow Peak Temperature	255°C +0/-5°C; keep at peak for 5-10 s
Solderability Test	Tin loading rate >=95% pad area; T.sol=235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s
General Dimension Tolerance	±0.25 mm; unless otherwise noted
Tape/Reel Dimension Tolerance	±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power	<30 W; hand soldering recommended only for repair/rework
Hand Soldering Temperature	<300°C; each terminal less than 3 s, one time only
Maximum Reflow Count	2 times max; reflow soldering
Recommended Maximum Welding Temperature	240 ±5°C for 6 s; product recommended maximum soldering temperature
Cleaning Condition	Alcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering
Ultrasonic Cleaning Power	<=300 W generally; pretest required before ultrasonic cleaning
Unopened Storage Condition	<=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package
Opened Storage Condition	<=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition	<=30°C, <=60% RH; operation after opening package
Baking Condition	60 ±5°C for 24 hours; if moisture absorbent faded or LEDs exceeded storage time
Datasheet Status	request_only

Product Overview

The XL-3216SYGC is a XINGLIGHT common green SMD LED supplied in a 3216 package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The package appearance is water-clear with a transparent colloid, and the luminous color is specified as high brightness common green.

At IF=20 mA and Ta=25°C, the device provides 50 to 100 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, 1.9 to 2.4 V forward voltage, and a 120° typical viewing angle. The half wave width is 20 nm typical, and reverse current is specified as <=1 µA at VR=5 V.

The LED is suitable for SMT automatic production and reflow soldering. Handling data includes MSL 3, RoHS compliance, EIA standard packaging, maximum two reflow cycles, and opened-package soldering within 168 hours under <=30°C and <=40% RH. Applications include compact green indication, SMT indicator placement, panel indication, and reflow-assembled PCB assemblies.

Key Features

3216 SMD package measures 3.2 x 1.6 x 0.8 mm
High brightness common green luminous color
Water-clear transparent colloid package appearance
50 to 100 mcd luminous intensity at 20 mA
565 to 575 nm dominant wavelength range
1.9 to 2.4 V forward voltage at 20 mA
120° typical viewing angle at 20 mA
20 mA maximum continuous forward current
80 mA peak forward current under pulsed conditions
MSL 3 moisture sensitivity classification
Suitable for SMT automatic production
Suitable for reflow soldering process

Typical Applications

Green status indication
SMT PCB indicator assemblies
Reflow-soldered LED boards
Compact panel indicators
Green wavelength sorting applications
Automated SMT production lines
Repair or rework assemblies

Procurement Notes

When requesting a quote for XL-3216SYGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-3216SYGC use?

XL-3216SYGC uses a 3216 SMD LED package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The general dimension tolerance is ±0.25 mm unless otherwise noted.

What are the optical ratings at 20 mA?

At IF=20 mA and Ta=25°C, luminous intensity is 50 to 100 mcd, dominant wavelength is 565 to 575 nm, peak wavelength is 570 nm typical, half wave width is 20 nm typical, and viewing angle is 120° typical.

What soldering limits apply to this LED?

The device is suitable for reflow soldering with a maximum reflow count of two times. The recommended maximum welding temperature is 240 ±5°C for 6 seconds, while hand soldering should use less than 30 W and less than 300°C per terminal for under 3 seconds.

How should opened packages be stored before soldering?

After opening the package, storage should be at <=30°C and <=40% RH, and the LEDs should be soldered within 168 hours or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.