Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216SYGC-FB |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3216 SMD LED, 3.2 x 1.6 x 0.8 mm |
| Appearance Dimension | 3.2 x 1.6 x 0.8 mm; L/W/H |
| Luminous Color | High brightness green; colorless transparent colloid |
| Colloid / Lens | Colorless transparent; product description |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C <=6 s; absolute maximum rating |
| Luminous Intensity | 50 min, 100 max mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 565 min, 575 max nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 570 typ nm; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8 min, 2.4 max V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 15 typ nm; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D1 | 50 to 80 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HYG03 | 565 to 567.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HYG04 | 567.5 to 570 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HYG05 | 570 to 572.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HYG06 | 572.5 to 575 nm; IF=20 mA, wavelength error ±1 nm |
| General Test Ambient Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; test at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C to -40 ±5°C; 20 min each |
| Anti-tin Test | 260 ±5°C for 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s |
| Weldability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, units in mm |
| Hand Soldering Iron Power | <30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; less than 3 s per terminal, one time only |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommendation |
| Maximum Reflow Soldering Cycles | 2 times; reflow soldering |
| Cleaning With Alcohol | under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year; before opening moisture-proof package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; operation after opening |
| Baking Condition | 60 ±5°C for 24 hours; if moisture absorbent material has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XINGLIGHT XL-3216SYGC-FB is a high brightness green surface-mount LED supplied in a 3216 SMD LED package. The package dimensions are 3.2 x 1.6 x 0.8 mm, with an outline dimension tolerance of ±0.25 mm unless otherwise noted. The emitted color is high brightness green, and the product description specifies a colorless transparent colloid/lens structure.
At IF=20 mA and Ta=25°C, the LED is specified for 50 to 100 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, 15 nm typical half wave width, and 120° typical viewing angle. Forward voltage is specified from 1.8 to 2.4 V, while reverse current is limited to <=1 µA at VR=5 V.
Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, 5 V reverse voltage, and 2000 V ESD rating. Assembly guidance includes MSL 3 handling, up to 2 reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and opened-package soldering within 168 hours.
Key Features
- 3216 SMD LED package, 3.2 x 1.6 x 0.8 mm
- High brightness green output with colorless transparent colloid
- 50 to 100 mcd luminous intensity at 20 mA
- 565 to 575 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under specified pulse conditions
- MSL 3 moisture sensitivity classification
- -40 to +85°C operating temperature range
- Lead-free reflow peak 255°C +0/-5°C
- Opened package soldering window of 168 hours
Typical Applications
- Green status indicators
- PCB-mounted visual indicators
- Compact electronic display points
- Signal and control panels
- Backlight or marking points
- Color-coded equipment indication
- Low-profile SMD LED assemblies
Procurement Notes
When requesting a quote for XL-3216SYGC-FB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-3216SYGC-FB use?
XL-3216SYGC-FB uses a 3216 SMD LED package with appearance dimensions of 3.2 x 1.6 x 0.8 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 50 to 100 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, 15 nm typical half wave width, and 120° typical viewing angle.
What current and voltage limits apply to this LED?
The maximum continuous forward current is 20 mA at Ta=25°C. Peak forward current is 80 mA for pulse width <=0.1 ms and duty <=1/10. Maximum reverse voltage is 5 V, and forward voltage is 1.8 to 2.4 V at 20 mA.
How should opened packages be handled before soldering?
After opening the package, storage should be <=30°C and <40% RH, with soldering completed within 168 hours or 7 days. The recommended workshop condition after opening is <=30°C and <60% RH.
What soldering limits are specified for XL-3216SYGC-FB?
The datasheet specifies a maximum of 2 reflow soldering cycles. Lead-free reflow peak temperature is 255°C +0/-5°C for 5 to 10 seconds. Hand soldering is recommended only for repair or rework, using <30 W and <300°C for less than 3 seconds per terminal.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.