Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216UBC |
| Manufacturer | XINGLIGHT |
| Product Type | Blue SMD LED |
| Category | LED |
| Package / Case | 3216 SMD, 3.2 x 1.6 x 0.8 mm |
| Outline Dimensions | 3.2 x 1.6 x 0.8 mm; L/W/H |
| Luminous Color | Blue; transparent/water clear colloid |
| Colloid / Lens | Transparent / water clear; Blue LED |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C, <=6 s; absolute maximum rating |
| Luminous Intensity | 80 to 210 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 460 to 475 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 465 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 25 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0 to 3.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1 to 3.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2 to 3.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-6 | 3.3 to 3.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HB04 | 460 to 465 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HB05 | 465 to 470 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR06 | 470 to 475 nm; IF=20 mA, wavelength error ±1 nm |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times, Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; ramp <=3°C/s from 183°C to peak, cooling <=6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; ramp <=3°C/s from 217°C to peak, cooling <=6°C/s |
| Solderability Test | Tin loading rate >=95% pad area; T.sol=235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s |
| Dimensional Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Maximum Reflow Soldering Cycles | 2 times; reflow soldering |
| Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s; alcohol solvent cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest required before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; product operation/workshop condition |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-3216UBC is a XINGLIGHT blue SMD LED supplied in a 3216 surface-mount package with 3.2 x 1.6 x 0.8 mm outline dimensions. The device uses a transparent, water-clear colloid/lens construction and is listed with MSL 3 moisture sensitivity and RoHS compliance in the extracted datasheet facts.
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 210 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle. Forward voltage is specified from 2.6 to 3.4 V, with reverse current not exceeding 1 µA at VR=5 V.
Assembly limits include 260°C lead soldering for no more than 6 s, a recommended maximum welding temperature of 240±5°C for 6 s, and a maximum of two reflow soldering cycles. Storage and handling facts specify unopened storage at <=30°C and <=60% RH for use within one year, and opened-package soldering within 168 hours / 7 days at <=30°C and <=40% RH.
Key Features
- 3216 SMD package, 3.2 x 1.6 x 0.8 mm
- Blue emission with transparent water-clear colloid
- 80 to 210 mcd luminous intensity at 20 mA
- 460 to 475 nm dominant wavelength range
- 2.6 to 3.4 V forward voltage at 20 mA
- 120° typical viewing angle for broad indication
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulse limits
- MSL 3 moisture sensitivity classification
- RoHS Directive compliance stated in datasheet
Typical Applications
- Blue status indicators
- Compact panel indicators
- PCB-mounted signal lights
- Backlighting for small controls
- Visual alarms and notifications
- Portable device indicators
- Instrument cluster indication
Procurement Notes
When requesting a quote for XL-3216UBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size is specified for XL-3216UBC?
XL-3216UBC is specified as a 3216 SMD LED with outline dimensions of 3.2 x 1.6 x 0.8 mm. The extracted dimensional tolerance is ±0.25 mm unless otherwise noted.
What optical output does XL-3216UBC provide at 20 mA?
At IF=20 mA and Ta=25°C, the datasheet facts specify 80 to 210 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and a 120° typical viewing angle.
What are the main electrical ratings for this blue LED?
The extracted ratings list 70 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under pulse limits, 5 V maximum reverse voltage, and 2.6 to 3.4 V forward voltage at 20 mA.
How should opened XL-3216UBC packages be handled before soldering?
After opening the package, the storage condition is <=30°C and <=40% RH, with soldering within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if the moisture absorbent has faded or storage time is exceeded.
How many reflow soldering cycles are allowed?
The extracted assembly facts specify a maximum of two reflow soldering cycles. Lead-free reflow peak temperature is listed as 255°C +0/-5°C for 5 to 10 seconds, with ramp and cooling limits stated in the datasheet facts.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.