Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216UBC-FB |
| Manufacturer | XINGLIGHT |
| Product Type | Blue SMD LED |
| Category | LED |
| Package / Case | 3216 SMD LED, 3.2 x 1.6 x 0.8 mm |
| Appearance Dimension | 3.2 x 1.6 x 0.8 mm (L/W/H) |
| Luminous Color | Blue, colorless transparent colloid/lens |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 70 mW at Ta=25°C |
| Maximum Continuous Forward Current | 20 mA at Ta=25°C |
| Peak Forward Current | 80 mA, pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Withstand Voltage | 2000 V at Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C ≤6 s |
| Luminous Intensity | 80-240 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 460-475 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 465 nm typ at IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6-3.4 V at IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 25 nm typ at IF=20 mA, Ta=25°C |
| Reverse Current | ≤1 µA at VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin D3 | 120-150 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150-180 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180-210 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin D6 | 210-240 mcd at IF=20 mA, brightness error ±10% |
| Voltage Bin M18-8 | 2.6-2.7 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7-2.8 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8-2.9 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9-3.0 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0-3.1 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1-3.2 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2-3.3 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-6 | 3.3-3.4 V at IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HB04 | 460-465 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HB05 | 465-470 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HB06 | 470-475 nm at IF=20 mA, wavelength error ±1 nm |
| General Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours at Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles: 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles, IR reflow in-board 2 times; 100±5°C 20 min to -40±5°C 20 min |
| Anti-tin Test | 260±5°C for 10±1 s, 2 times |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; peak 10-15 s; above 183°C for 60-150 s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C; peak 5-10 s; above 217°C for 60-120 s |
| Lead-free Reflow Heating Rate | Maximum 3°C/s from 217°C to peak temperature |
| Reflow Cooling Rate | Maximum 6°C/s for lead and lead-free process profiles |
| Weldability Test | 235±5°C, immersion 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W, recommended only for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal less than 3 s, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Reflow Soldering Limit | Maximum 2 times |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended to confirm no LED damage |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-3216UBC-FB is a XINGLIGHT blue SMD LED supplied in a 3216 surface-mount package. The package dimensions are 3.2 x 1.6 x 0.8 mm, with a colorless transparent colloid/lens and blue luminous output. The device is identified as an MSL 3 component in the manufacturer technical datasheet.
At IF=20 mA and Ta=25°C, the LED is specified for 80-240 mcd luminous intensity, 460-475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, 2.6-3.4 V forward voltage, and 120° typical viewing angle. Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current with pulse width ≤0.1 ms and duty ≤1/10, 5 V reverse voltage, and 2000 V ESD withstand voltage.
Assembly guidance includes reflow limits, hand-soldering restrictions, cleaning conditions, and moisture storage requirements. These parameters support use in compact blue PCB indication, panel indicators, instrument signals, and other assemblies requiring a small 3216 SMD blue LED.
Key Features
- Blue SMD LED in compact 3216 package
- 3.2 x 1.6 x 0.8 mm appearance dimensions
- Colorless transparent colloid/lens with blue luminous output
- 80-240 mcd luminous intensity at 20 mA
- 460-475 nm dominant wavelength at 20 mA
- 2.6-3.4 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulsed operation
- -40 to +85°C operating temperature range
- MSL 3 moisture sensitivity level
- Maximum two reflow soldering cycles
Typical Applications
- Blue PCB status indicators
- Compact surface-mount indicator lights
- Control-panel indication
- Instrument signal indicators
- Consumer electronics indicator LEDs
- Backlighting for small control areas
- Maintenance and repair indicator assemblies
Procurement Notes
When requesting a quote for XL-3216UBC-FB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-3216UBC-FB?
XL-3216UBC-FB uses a 3216 SMD LED package with appearance dimensions of 3.2 x 1.6 x 0.8 mm. The outline dimension tolerance is specified as ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the device is specified for 80-240 mcd luminous intensity, 460-475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.
What current and voltage limits apply to this LED?
The maximum continuous forward current is 20 mA at Ta=25°C. Peak forward current is 80 mA when pulse width is ≤0.1 ms and duty is ≤1/10. Maximum reverse voltage is 5 V.
How should opened XL-3216UBC-FB packages be stored?
After opening, storage is specified at ≤30°C and <40% RH, with soldering within 168 hours or 7 days. If package or desiccant conditions fail or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.