Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216UGC-FB |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3216 SMD, 3.2 x 1.6 x 0.8 mm |
| Appearance Dimensions | 3.2 x 1.6 x 0.8 mm, L/W/H |
| Luminous Color | High brightness green, transparent colloid |
| Lens / Colloid | Transparent colloid, green LED |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complied with RoHS Directive |
| Maximum Power Dissipation | 70 mW, Ta=25°C |
| Maximum Continuous Forward Current | 20 mA, Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD / Antistatic Ability | 2000 V, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C, Ta=25°C absolute maximum ratings table |
| Storage Temperature Range | -40 to +85 °C, Ta=25°C absolute maximum ratings table |
| Lead Soldering Temperature / Time | 260°C <=6 s, Ta=25°C absolute maximum ratings table |
| Luminous Intensity | 450 to 900 mcd, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 535 nm, IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ, IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.4 V, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA, VR=5 V, Ta=25°C |
| Brightness Grade E3 | 450 to 500 mcd, IF=20 mA, brightness error ±10% |
| Brightness Grade E4 | 500 to 550 mcd, IF=20 mA, brightness error ±10% |
| Brightness Grade E5 | 550 to 600 mcd, IF=20 mA, brightness error ±10% |
| Brightness Grade E6 | 600 to 700 mcd, IF=20 mA, brightness error ±10% |
| Brightness Grade E7 | 700 to 800 mcd, IF=20 mA, brightness error ±10% |
| Brightness Grade E8 | 800 to 900 mcd, IF=20 mA, brightness error ±10% |
| Voltage Grade M18-8 | 2.6 to 2.7 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M18-9 | 2.7 to 2.8 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-1 | 2.8 to 2.9 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-2 | 2.9 to 3.0 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-3 | 3.0 to 3.1 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-4 | 3.1 to 3.2 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-5 | 3.2 to 3.3 V, IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-6 | 3.3 to 3.4 V, IF=20 mA, voltage error ±0.1 V |
| Wavelength Grade HG02 | 515 to 520 nm, IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HG03 | 520 to 525 nm, IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HG04 | 525 to 530 nm, IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HG05 | 530 to 535 nm, IF=20 mA, wavelength error ±1 nm |
| Test Environment Temperature | 25±5°C, unless otherwise indicated |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature, tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours, Ta=85±5°C, RH=90-95%, IR-reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours, Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours, Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles, IR-reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times, soldering temperature T.sol |
| Lead Process Infrared Reflow Peak Temperature | 235°C +5/-0°C, keep at peak for 10-15 s; heat-up max 3°C/s from 183°C to peak; cooling max 6°C/s |
| Lead-Free Process Infrared Reflow Peak Temperature | 255°C +0/-5°C, keep at peak for 5-10 s; heat-up max 3°C/s from 217°C to peak; cooling max 6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s, immersion speed 25±2.5 mm/s, tin loading rate >=95% pad area |
| Dimension Tolerance | ±0.25 mm, unless otherwise noted |
| Tape / Reel Dimensional Tolerance | ±0.1 mm, belt and disk dimensions, dimensions in mm |
| Hand Soldering Iron Power | <30 W, manual welding only for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times, reflow soldering should not be done more than two times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Alcohol Cleaning Condition | <=30°C for 3 min or <=50°C for 30 s, after soldering |
| Ultrasonic Cleaning Power | <=300 W, pretest required to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year, before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <=10% RH, solder within 168 hours / 7 days, recommended workshop condition <=30°C and <=60% RH |
| Baking Condition | 60±5°C for 24 hours, if moisture absorbent has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-3216UGC-FB is a XINGLIGHT high brightness green SMD LED supplied in a 3216 surface-mount package. The appearance dimensions are 3.2 x 1.6 x 0.8 mm, with a transparent colloid lens over the green LED emitter. The part is listed as compliant with the RoHS Directive and has moisture sensitivity level MSL 3.
At IF=20 mA and Ta=25°C, the LED is specified for 450 to 900 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, and 120° typical viewing angle. Forward voltage is 2.6 to 3.4 V under the same test condition, with reverse current limited to <=1 µA at VR=5 V.
Assembly data includes a maximum of two reflow cycles, lead-free infrared reflow peak temperature of 255°C +0/-5°C, and recommended maximum welding temperature of 240±5°C for 6 s. Storage guidance covers unopened storage at <=30°C and <=60% RH for use within 1 year, and opened storage at <=30°C and <=10% RH with soldering within 168 hours.
Key Features
- 3216 SMD package, 3.2 x 1.6 x 0.8 mm
- High brightness green output with transparent colloid lens
- 450 to 900 mcd luminous intensity at 20 mA
- 515 to 535 nm dominant wavelength range
- 2.6 to 3.4 V forward voltage at 20 mA
- 120° typical viewing angle for broad emission
- 20 mA maximum continuous forward current rating
- MSL 3 moisture sensitivity classification
- -40 to +85°C operating temperature range
- RoHS Directive compliance stated in datasheet
Typical Applications
- Green status indicators
- PCB-mounted signal lamps
- Compact panel indication
- Equipment operation indicators
- Color-coded warning indicators
- SMD display backlighting
- Low-profile visual signaling
Procurement Notes
When requesting a quote for XL-3216UGC-FB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-3216UGC-FB use?
XL-3216UGC-FB uses a 3216 SMD package with appearance dimensions of 3.2 x 1.6 x 0.8 mm. The datasheet lists a general dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 450 to 900 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What soldering limits apply to this LED?
The datasheet states a maximum lead soldering condition of 260°C for <=6 s and recommends a maximum welding temperature of 240±5°C for 6 s. Reflow soldering should not be performed more than two times.
How should opened parts be stored before soldering?
After opening the moisture-proof anti-electrostatic package, the recommended storage condition is <=30°C and <=10% RH, with soldering within 168 hours or 7 days. The recommended workshop condition is <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.