Specifications
| Type | Description |
|---|---|
| Part Number | XL-3216UYC-FJ |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3216 SMD LED, 3.2 x 1.6 x 0.8 mm |
| Component Type | LED |
| Outline Dimensions | 3.2 x 1.6 x 0.8 mm; L/W/H |
| Luminous Color | Yellow; transparent/water clear colloid |
| Colloid / Lens | Water clear / transparent colloid; yellow LED |
| Moisture Sensitivity Level | MSL 3; specified as 3 levels |
| RoHS Compliance | Complies with RoHS Directive; environmental protection products |
| Maximum Power Dissipation | 60 mW; Ta=25°C |
| Maximum Continuous Forward Current | 30 mA; Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C, ≤6 s; Ta=25°C absolute maximum rating table |
| Pulse Condition Note | Pulse width ≤0.1 ms, duty ≤1/10; absolute maximum rating note |
| Luminous Intensity | 260 to 600 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 587 to 595 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 130° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | ≤1 µA; VR=9 V, Ta=25°C |
| Brightness Bin D7 | 240 to 270 mcd; IF=20 mA |
| Brightness Bin D8 | 270 to 300 mcd; IF=20 mA |
| Brightness Bin D9 | 300 to 350 mcd; IF=20 mA |
| Brightness Bin E1 | 350 to 400 mcd; IF=20 mA |
| Brightness Bin E2 | 400 to 450 mcd; IF=20 mA |
| Brightness Bin E3 | 450 to 500 mcd; IF=20 mA |
| Brightness Bin E4 | 500 to 550 mcd; IF=20 mA |
| Brightness Bin E5 | 550 to 600 mcd; IF=20 mA |
| Brightness Measurement Tolerance | ±10%; brightness grading |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA |
| Voltage Measurement Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HY03 | 585 to 587.5 nm; IF=20 mA |
| Wavelength Bin HY04 | 587.5 to 590 nm; IF=20 mA |
| Wavelength Bin HY05 | 590 to 592.5 nm; IF=20 mA |
| Wavelength Bin HY06 | 592.5 to 595 nm; IF=20 mA |
| Wavelength Measurement Tolerance | ±1 nm; wavelength grading |
| Default Test Ambient Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C 20 min to -40±5°C 20 min |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; hold 10-15 s at peak range |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; hold 5-10 s at peak range |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Dimensional Tolerance | ±0.25 mm; unless otherwise noted |
| Tape / Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W recommended; repair/rework hand soldering only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times maximum; reflow soldering |
| Recommended Maximum Welding Temperature | 240±15°C for 6 s; product recommendation |
| Cleaning Solvent | Alcohol recommended; after soldering |
| Cleaning Condition | ≤30°C for 3 min or ≤50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | ≤300 W generally; pretest required |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening moisture-proof anti-static package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; operation after opening |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-3216UYC-FJ is a XINGLIGHT yellow SMD chip LED supplied in a 3216 surface-mount package with 3.2 x 1.6 x 0.8 mm outline dimensions. The device uses a water clear transparent colloid for the yellow LED emitter and is categorized as an LED component.
At IF=20 mA and Ta=25°C, the LED is specified for 260 to 600 mcd luminous intensity, 587 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 1.9 to 2.4 V forward voltage, 20 nm typical half wave width, and 130° typical viewing angle. Absolute maximum ratings include 60 mW power dissipation, 30 mA continuous forward current, 5 V reverse voltage, and 2000 V ESD antistatic ability.
Assembly data includes MSL 3 handling, RoHS compliance, two maximum reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and recommended maximum welding temperature of 240±15°C for 6 s. Storage guidance includes unopened storage at ≤30°C and ≤60% RH within 1 year, and opened storage at ≤30°C and ≤40% RH with soldering within 168 hours.
Key Features
- Yellow SMD chip LED in 3216 package
- 3.2 x 1.6 x 0.8 mm outline
- Water clear transparent colloid lens
- 260 to 600 mcd at IF=20 mA
- 587 to 595 nm dominant wavelength
- 1.9 to 2.4 V forward voltage
- 130° typical viewing angle at 20 mA
- MSL 3 moisture sensitivity level
- RoHS Directive compliant product
- Two maximum reflow soldering cycles
Typical Applications
- Yellow status indicators
- Control panel indicators
- Compact signal lamps
- SMD display indicators
- Equipment warning lights
- PCB-mounted visual indicators
Procurement Notes
When requesting a quote for XL-3216UYC-FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-3216UYC-FJ use?
XL-3216UYC-FJ uses a 3216 SMD LED package with outline dimensions of 3.2 x 1.6 x 0.8 mm. The datasheet also lists a general dimensional tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 260 to 600 mcd luminous intensity, 587 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 130° typical viewing angle.
What soldering limits apply to this LED?
The datasheet lists lead soldering at 260°C for ≤6 s, maximum reflow soldering count of 2 times, and a recommended maximum welding temperature of 240±15°C for 6 s. Hand soldering is recommended below 300°C for less than 3 s per terminal.
How should opened packages be stored before soldering?
After opening, the package should be kept at ≤30°C and ≤40% RH, with soldering completed within 168 hours or 7 days. The recommended workshop condition after opening is ≤30°C and ≤60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.