Specifications
| Type | Description |
|---|---|
| Part Number | XL-3433UYC-02 |
| Manufacturer | XINGLIGHT |
| Product Type | Yellow SMD LED |
| Category | LED |
| Outline Dimensions | 3.4 x 3.3 x 1.9 mm; L/W/H |
| Luminous Color | Yellow; colorless transparent colloid/lens |
| Colloid / Lens | Colorless transparent; Yellow LED |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| RoHS Compliance | Complied with RoHS Directive; environmental protection process |
| Maximum Power Dissipation | 200 mW; Ta=25°C |
| Maximum Continuous Forward Current | 60 mA; Ta=25°C |
| Peak Forward Current | 120 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C <=6 s; Ta=25°C absolute maximum rating table |
| Luminous Flux | 10-20 lm; IF=60 mA, Ta=25°C |
| Dominant Wavelength | 585-595 nm; IF=60 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ; IF=60 mA, Ta=25°C |
| Forward Voltage | 1.8-2.4 V; IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=60 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=60 mA, Ta=25°C |
| Reverse Current | <=5 µA; VR=5 V, Ta=25°C |
| Brightness Bin H7 | 10-13 lm; IF=60 mA |
| Brightness Bin H8 | 13-17 lm; IF=60 mA |
| Brightness Bin H9 | 17-20 lm; IF=60 mA |
| Voltage Bin N12-7 | 1.8-2.0 V; IF=60 mA |
| Voltage Bin N12-8 | 2.0-2.2 V; IF=60 mA |
| Voltage Bin N12-9 | 2.2-2.4 V; IF=60 mA |
| Dominant Wavelength Bin HY03 | 585-587.5 nm; IF=60 mA |
| Dominant Wavelength Bin HY04 | 587.5-590 nm; IF=60 mA |
| Dominant Wavelength Bin HY05 | 590-592.5 nm; IF=60 mA |
| Dominant Wavelength Bin HY06 | 592.5-595 nm; IF=60 mA |
| Recommended Test Ambient Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; text also states test at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Thermal Cycle Test | 100 cycles; 105°C 30 min -> 25°C 5 min -> -55°C 30 min -> 25°C 5 min |
| Thermal Shock Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; time at peak 10-15 s; ramp max 3°C/s; cooling max 6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; time at peak 5-10 s; ramp max 3°C/s; cooling max 6°C/s |
| Weldability Test | 235±5°C, 2±0.5 s immersion; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, units in mm |
| Hand Soldering Iron Power | <30 W; recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once only, less than 3 s |
| Maximum Reflow Cycles | 2 times; reflow soldering should not be done more than twice |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Post-Solder Cleaning With Alcohol | 30°C for 3 min or 50°C for 30 s; recommended cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Conditions | <=30°C, <=60% RH, within 1 year; before opening moisture-proof anti-static package |
| Opened Storage Conditions | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Conditions | <=30°C, <=60% RH; after opening package / operation environment |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent fades or LEDs exceed storage time |
| Datasheet Status | request_only |
Product Overview
The XL-3433UYC-02 is a XINGLIGHT yellow SMD LED built in a 3.4 x 3.3 x 1.9 mm surface-mount package. The datasheet identifies a colorless transparent colloid/lens for the yellow emitter, with a 120° typical viewing angle at IF=60 mA and Ta=25°C.
Optical and electrical parameters are specified at IF=60 mA and Ta=25°C, including 10-20 lm luminous flux, 585-595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 1.8-2.4 V forward voltage. Reverse current is specified as <=5 µA at VR=5 V.
Absolute maximum ratings include 200 mW power dissipation, 60 mA continuous forward current, 120 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, 5 V reverse voltage, and 2000 V ESD rating. Assembly guidance covers MSL 3 storage, two maximum reflow cycles, hand-soldering limits, cleaning conditions, and baking at 60±5°C for 24 hours when required.
Key Features
- Yellow SMD LED with colorless transparent lens
- 3.4 x 3.3 x 1.9 mm surface-mount package
- 10-20 lm luminous flux at 60 mA
- 585-595 nm dominant wavelength range
- 1.8-2.4 V forward voltage at 60 mA
- 120° typical viewing angle at 60 mA
- 60 mA maximum continuous forward current
- 120 mA peak forward current under pulsed drive
- MSL 3 moisture sensitivity classification
- RoHS Directive compliant process stated
Typical Applications
- Yellow status indication
- SMD indicator assemblies
- Wide-angle panel indicators
- Low-voltage LED circuits
- Reflow-soldered PCB indicators
- Moisture-controlled SMT production
- Repair or rework soldering
Procurement Notes
When requesting a quote for XL-3433UYC-02, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-3433UYC-02 use?
XL-3433UYC-02 uses a 3.4 x 3.3 x 1.9 mm SMD LED package. The outline dimension tolerance is ±0.25 mm unless otherwise noted in the manufacturer technical datasheet.
What are the optical ratings at 60 mA?
At IF=60 mA and Ta=25°C, the datasheet specifies 10-20 lm luminous flux, 585-595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What soldering limits are specified for this LED?
The datasheet lists 260°C for <=6 s as a lead soldering limit and recommends a maximum welding temperature of 240±5°C for 6 s. Reflow soldering should not be performed more than two times.
How should opened packages be stored before assembly?
After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.
Is the XL-3433UYC-02 RoHS compliant?
Yes, the datasheet states the product complies with the RoHS Directive and follows an environmental protection process. For specific regulatory certificates, contact XINGLIGHT directly.
What is the typical viewing angle of this yellow SMD LED?
The XL-3433UYC-02 specifies a 120° typical viewing angle at IF=60 mA and Ta=25°C, making it suitable for wide-angle indicator and panel lighting applications.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.