Specifications
| Type | Description |
|---|---|
| Part Number | XL-3528SURC-FJ |
| Manufacturer | XINGLIGHT |
| Product Type | Red surface-mount LED |
| Category | LED |
| Package/Case | SMD LED, 3.5 mm x 2.8 mm x 1.9 mm |
| Package Dimensions | 3.5 mm x 2.8 mm x 1.9 mm; outline dimensions L/W/H |
| Emitted Color | Red |
| Lens/Colloid | Water clear / transparent colloid; listed as red/water colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Mounting / Assembly | Suitable for SMT automatic production |
| Reflow Compatibility | Suitable for infrared reflow soldering process |
| Maximum Power Dissipation | 50 mW at Ta=25°C |
| Maximum Continuous Forward Current | 20 mA at Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability at Ta=25°C |
| Operating Temperature Range | -40°C to +85°C |
| Storage Temperature Range | -40°C to +85°C |
| Lead Soldering Temperature/Time | 260°C, <=6 s; absolute maximum rating |
| Luminous Intensity | 400-900 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 615-630 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 625 nm typ at IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8-2.4 V at IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ at IF=20 mA, Ta=25°C |
| Reverse Current | <=5 µA at VR=5 V, Ta=25°C |
| Brightness Bin E2 | 400-450 mcd at IF=20 mA |
| Brightness Bin E3 | 450-500 mcd at IF=20 mA |
| Brightness Bin E4 | 500-550 mcd at IF=20 mA |
| Brightness Bin E5 | 550-600 mcd at IF=20 mA |
| Brightness Bin E6 | 600-700 mcd at IF=20 mA |
| Brightness Bin E7 | 700-800 mcd at IF=20 mA |
| Brightness Bin E8 | 800-900 mcd at IF=20 mA |
| Voltage Bin N12-7 | 1.8-2.0 V at IF=20 mA |
| Voltage Bin N12-8 | 2.0-2.2 V at IF=20 mA |
| Voltage Bin N12-9 | 2.2-2.4 V at IF=20 mA |
| Wavelength Bin HR01 | 615-620 nm at IF=20 mA |
| Wavelength Bin HR02 | 620-625 nm at IF=20 mA |
| Wavelength Bin HR03 | 625-630 nm at IF=20 mA |
| Test Environment Temperature | 25±5°C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Profile | 235°C +5/-0°C peak, 10-15 s at peak; ramp max 3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s; cooling max 6°C/s |
| Lead-Free Reflow Profile | 255°C +0/-5°C peak, 5-10 s at peak; ramp max 3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling max 6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Recommendation | Soldering iron <30 W, temperature <300°C, <3 s per terminal, one time only; recommended only for repair/rework |
| Maximum Reflow Count | 2 times for reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Limit | <=300 W; pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH after opening |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent material has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-3528SURC-FJ is a XINGLIGHT red surface-mount LED built in a 3.5 mm x 2.8 mm x 1.9 mm package. The datasheet describes a red emitter with water clear / transparent colloid and a 120° typical viewing angle, suitable for compact indicator and display positions where surface-mount assembly is required.
At IF=20 mA and Ta=25°C, the LED is specified for 400-900 mcd luminous intensity, 615-630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and 1.8-2.4 V forward voltage. Absolute maximum ratings include 20 mA continuous forward current, 80 mA peak forward current under pulse limits, 5 V maximum reverse voltage, and 50 mW maximum power dissipation.
Assembly data supports SMT automatic production and infrared reflow soldering. The part is RoHS compliant, rated MSL 3, and has operating and storage temperature ranges of -40°C to +85°C. Handling guidance includes a maximum of two reflow cycles, opened-package soldering within 168 hours / 7 days, and baking at 60±5°C for 24 hours when required.
Key Features
- Red surface-mount LED in 3.5 x 2.8 x 1.9 mm package
- 400-900 mcd luminous intensity at 20 mA
- 615-630 nm dominant wavelength red emission
- 1.8-2.4 V forward voltage at 20 mA
- 120° typical viewing angle for wide indication
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulse conditions
- RoHS compliant with MSL 3 moisture rating
- Suitable for SMT automatic production
- Compatible with infrared reflow soldering process
Typical Applications
- Red status indicators
- Surface-mount display indicators
- Panel indication circuits
- PCB-mounted signal lights
- Compact red visual alerts
- Reflow-assembled LED boards
Procurement Notes
When requesting a quote for XL-3528SURC-FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What type of LED is XL-3528SURC-FJ?
XL-3528SURC-FJ is a XINGLIGHT red surface-mount LED in a 3.5 mm x 2.8 mm x 1.9 mm SMD package with water clear / transparent colloid.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 400-900 mcd luminous intensity, 615-630 nm dominant wavelength, 625 nm typical peak wavelength, and 120° typical viewing angle.
What forward voltage range does this LED use?
The datasheet specifies a forward voltage range of 1.8-2.4 V at IF=20 mA and Ta=25°C. Voltage bins listed are N12-7, N12-8, and N12-9.
What assembly process is supported for XL-3528SURC-FJ?
The part is suitable for SMT automatic production and infrared reflow soldering. The datasheet lists a maximum reflow count of two times and provides lead and lead-free reflow profiles.
How should opened packages be stored before soldering?
After opening the package, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours / 7 days. Recommended workshop conditions are <=30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.