XL-3528SURC Surface-Mount Red LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-3528SURC Surface-Mount Red LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-3528SURC
Manufacturer
XINGLIGHT
Package
3528 SMD LED, 3.5 x 2.8 x 1.9 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-3528SURC from XINGLIGHT is a red surface-mount LED in a 3528 SMD package measuring 3.5 x 2.8 x 1.9 mm. It uses a water-clear transparent colloid lens and is suitable for SMT automatic production. Key operating parameters include 1.8 to 2.4 V forward voltage at 20 mA, 300 to 550 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, and 120° typical viewing angle. It supports red indication and signaling applications on SMT assemblies, with RoHS compliance, MSL 3 handling, and specified reflow, storage, and baking conditions.

Specifications

TypeDescription
Part NumberXL-3528SURC
ManufacturerXINGLIGHT
Product TypeSurface-mount red LED; suitable for SMT automatic production
CategoryLED
Package/Case3528 SMD LED, 3.5 x 2.8 x 1.9 mm
Package Dimensions3.5 x 2.8 x 1.9 mm, L/W/H
Dimension Tolerance±0.25 mm unless otherwise noted
Emitted ColorRed
Lens / ColloidWater clear / transparent colloid
RoHS ComplianceComplies with RoHS directive
Moisture Sensitivity LevelMSL 3
Maximum Power Dissipation50 mW at Ta=25°C
Maximum Continuous Forward Current20 mA at Ta=25°C
Peak Forward Current80 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C
Maximum Reverse Voltage5 V at Ta=25°C
ESD Rating2000 V antistatic ability at Ta=25°C
Operating Temperature Range-40 to +85°C
Storage Temperature Range-40 to +85°C
Lead Soldering Temperature / Time260°C, ≤6 s absolute maximum rating
Luminous Intensity300 to 550 mcd at IF=20 mA, Ta=25°C
Dominant Wavelength615 to 630 nm at IF=20 mA, Ta=25°C
Peak Wavelength625 nm typ. at IF=20 mA, Ta=25°C
Forward Voltage1.8 to 2.4 V at IF=20 mA, Ta=25°C
Viewing Angle120° typ.; 2θ1/2, IF=20 mA, Ta=25°C
Half Wave Width20 nm typ. at IF=20 mA, Ta=25°C
Reverse Current≤5 µA at VR=5 V, Ta=25°C
Brightness Bin D9300 to 350 mcd at IF=20 mA
Brightness Bin E1350 to 400 mcd at IF=20 mA
Brightness Bin E2400 to 450 mcd at IF=20 mA
Brightness Bin E3450 to 500 mcd at IF=20 mA
Brightness Bin E4500 to 550 mcd at IF=20 mA
Voltage Bin N12-71.8 to 2.0 V at IF=20 mA
Voltage Bin N12-82.0 to 2.2 V at IF=20 mA
Voltage Bin N12-92.2 to 2.4 V at IF=20 mA
Dominant Wavelength Bin HR01615 to 620 nm at IF=20 mA
Dominant Wavelength Bin HR02620 to 625 nm at IF=20 mA
Dominant Wavelength Bin HR03625 to 630 nm at IF=20 mA
Electrical / Optical Test Ambient25±5°C if not otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature, tested at 20 mA
High Temperature High Humidity Storage Test240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours at Ta=85±5°C
Low Temperature Storage Test1000 hours at Ta=-40±5°C
Cold / Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot / Cold Impact Test100 cycles; IR reflow in-board 2 times, 100±5°C to -40±5°C, 20 min each
Anti-Tin Test260±5°C for 10±1 s, 2 times
Lead-Free Reflow Peak Temperature255°C +0/-5°C for 5-10 s, lead-free process, J-STD-020C
Lead-Free Reflow Time Above 217°C60 to 120 s
Lead-Free Reflow Ramp-Up Rate≤3°C/s from 217°C to peak temperature
Lead-Free Reflow Cooling Rate≤6°C/s
Recommended Maximum Welding Temperature240±5°C for 6 s
Maximum Reflow Count2 times
Hand Soldering Temperature<300°C; soldering iron <30 W, each terminal less than 3 s, one time only
Unopened Storage Condition≤30°C, ≤60% RH, use within 1 year before opening moisture-proof anti-electrostatic package
Opened Storage Condition≤30°C, ≤40% RH, solder within 168 hours / 7 days after opening package
Baking Condition60±5°C for 24 hours if moisture absorbent material has faded or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-3528SURC is a XINGLIGHT surface-mount red LED supplied in a 3528 SMD LED package. The package dimensions are 3.5 x 2.8 x 1.9 mm with a stated dimensional tolerance of ±0.25 mm unless otherwise noted. The LED uses a water-clear transparent colloid lens and is described as suitable for SMT automatic production.

At IF=20 mA and Ta=25°C, the device is specified for 300 to 550 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, 1.8 to 2.4 V forward voltage, 20 nm typical half wave width, and 120° typical viewing angle. Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under pulse conditions, 5 V reverse voltage, and 2000 V ESD rating.

Assembly and handling data include MSL 3 classification, RoHS compliance, lead-free reflow guidance, a maximum of two reflow cycles, and storage limits for unopened and opened moisture-proof anti-electrostatic packaging. The part fits compact red indication, display, and SMT board signaling applications where the listed optical, electrical, and soldering limits are appropriate.

Key Features

  • Red surface-mount LED for SMT automatic production
  • 3528 SMD package, 3.5 x 2.8 x 1.9 mm
  • Water-clear transparent colloid lens construction
  • 300 to 550 mcd luminous intensity at 20 mA
  • 615 to 630 nm dominant wavelength range
  • 1.8 to 2.4 V forward voltage at 20 mA
  • 120° typical viewing angle at 20 mA
  • RoHS directive compliant with MSL 3 classification
  • -40 to +85°C operating temperature range
  • Lead-free reflow profile specified to J-STD-020C

Typical Applications

  • SMT red indicator lighting
  • PCB status indication
  • Red signal displays
  • Compact panel indicators
  • Surface-mount visual alerts
  • Color-coded equipment indicators

Procurement Notes

When requesting a quote for XL-3528SURC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

Alternatives

SAMSUNG

MHP3528URCT

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

SAMSUNG

S2-3528RTA

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

SAMSUNG

S4-3528RTA-C

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

Application Verification Recommended

FAQ

What type of LED is XL-3528SURC?

XL-3528SURC is a XINGLIGHT surface-mount red LED in a 3528 SMD package. The datasheet identifies it as suitable for SMT automatic production and lists a water-clear transparent colloid lens.

What are the main optical ratings at 20 mA?

At IF=20 mA and Ta=25°C, the LED is specified for 300 to 550 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.

What forward voltage range does XL-3528SURC use?

The specified forward voltage is 1.8 to 2.4 V at IF=20 mA and Ta=25°C. The datasheet also provides voltage bins of 1.8 to 2.0 V, 2.0 to 2.2 V, and 2.2 to 2.4 V.

What soldering limits apply to this LED?

The absolute lead soldering rating is 260°C for no more than 6 seconds. The recommended maximum welding temperature is 240±5°C for 6 seconds, with a maximum of two reflow soldering cycles.

How should opened packaging be handled before soldering?

After opening the package, storage is specified at ≤30°C and ≤40% RH, and the parts should be soldered within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours when required.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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