Specifications
| Type | Description |
|---|---|
| Part Number | XL-5730UBC-05 |
| Manufacturer | XINGLIGHT |
| Product Type | 5730 blue 0.5W SMD LED |
| Category | LED |
| Package/Case | 5730 SMD LED, 5.7 x 3.0 x 0.8 mm |
| Package Dimensions | 5.7 x 3.0 x 0.8 mm; outline dimensions L/W/H |
| Emitted Color | High brightness blue |
| Lens / Colloid | Water clear colloid |
| RoHS Compliance | Complied with RoHS Directive; environmental protection products |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 500 mW at Ta=25°C |
| Maximum Continuous Forward Current | 150 mA at Ta=25°C |
| Peak Forward Current | 300 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C for <=6 s; absolute maximum rating |
| Luminous Flux | 8 min, 17 max lm; IF=150 mA, Ta=25°C; datasheet row labeled Luminous Intensity |
| Dominant Wavelength | 450 min, 465 max nm; IF=150 mA, Ta=25°C |
| Peak Wavelength | 460 typ nm; IF=150 mA, Ta=25°C |
| Forward Voltage | 2.8 min, 3.4 max V; IF=150 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=150 mA, Ta=25°C |
| Half Wave Width | 25 typ nm; IF=150 mA, Ta=25°C |
| Reverse Current | <=5 µA; VR=5 V, Ta=25°C |
| Brightness Bin H6 | 8 to 10 lm; IF=150 mA |
| Brightness Bin H7 | 10 to 13 lm; IF=150 mA |
| Brightness Bin H8 | 13 to 17 lm; IF=150 mA |
| Voltage Bin N13-3 | 2.8 to 3.0 V; IF=150 mA |
| Voltage Bin N13-4 | 3.0 to 3.2 V; IF=150 mA |
| Voltage Bin N13-5 | 3.2 to 3.4 V; IF=150 mA |
| Wavelength Bin HB02 | 450 to 455 nm; IF=150 mA |
| Wavelength Bin HB03 | 455 to 460 nm; IF=150 mA |
| Wavelength Bin HB04 | 460 to 465 nm; IF=150 mA |
| Test Environment Temperature | 25 ±5°C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; datasheet also states test at 20 mA |
| High Temperature / High Humidity Storage Test | 240 hours; Ta=85 ±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min and -40 ±5°C for 20 min |
| Anti-Tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Reflow Profile | Peak 235°C +5/-0°C, 10-15 s at peak; heat-up <=3°C/s from 183°C to peak; 125 ±25°C <=120 s; above 183°C for 60-150 s |
| Lead-Free Reflow Profile | Peak 255°C +0/-5°C, 5-10 s at peak; heat-up <=3°C/s from 217°C to peak; 175 ±25°C <=180 s; above 217°C for 60-120 s; cooling <=6°C/s |
| Solderability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s; tin loading rate >=95% pad area |
| Mechanical Tolerance | ±0.25 mm unless otherwise noted |
| Tape / Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering | Soldering iron <30 W, temperature <300°C, <3 s per terminal, one time only; recommended only for repair/rework |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommendation |
| Reflow Soldering Count | Maximum 2 times |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage | Use within 1 year in moisture-proof anti-electrostatic package with moisture absorbent material |
| Storage Before Opening | <=30°C, <60% RH before opening package |
| Storage After Opening | <=30°C, <40% RH, solder within 168 hours / 7 days after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; product operation environment |
| Baking Condition | 60 ±5°C for 24 hours if moisture absorbent material has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-5730UBC-05 is a XINGLIGHT 5730 blue 0.5W SMD LED. The device uses a 5.7 x 3.0 x 0.8 mm surface-mount package with water clear colloid and high brightness blue emission. The datasheet identifies RoHS compliance and MSL 3 moisture sensitivity level.
At IF=150 mA and Ta=25°C, the LED is specified with 2.8 to 3.4 V forward voltage, 8 to 17 lm luminous flux, 450 to 465 nm dominant wavelength, 460 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle. Absolute maximum ratings include 500 mW power dissipation, 150 mA continuous forward current, 300 mA peak forward current, 5 V reverse voltage, and 2000 V ESD rating.
Assembly data includes lead and lead-free reflow profiles, a maximum of two reflow soldering cycles, hand soldering guidance for repair or rework, alcohol cleaning limits, storage limits before and after opening, and baking at 60 ±5°C for 24 hours when required.
Key Features
- 5730 blue 0.5W SMD LED package
- 5.7 x 3.0 x 0.8 mm outline dimensions
- High brightness blue emission with water clear colloid
- 2.8 to 3.4 V forward voltage at 150 mA
- 450 to 465 nm dominant wavelength range
- 8 to 17 lm luminous flux at 150 mA
- 120° typical viewing angle at 150 mA
- 150 mA maximum continuous forward current
- 500 mW maximum power dissipation at 25°C
- MSL 3 moisture sensitivity level
- RoHS Directive compliance stated in datasheet
- Lead-free reflow peak specified at 255°C
Typical Applications
- Blue indicator lighting
- Surface-mount PCB lighting
- Compact blue illumination modules
- Status display backlighting
- Instrument panel indicators
- General 5730 SMD LED assemblies
- Blue signal lighting circuits
Procurement Notes
When requesting a quote for XL-5730UBC-05, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
TOGIALED
TJ-S5730UG5W9TLC6B-A5
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What type of LED is XL-5730UBC-05?
XL-5730UBC-05 is a XINGLIGHT 5730 blue 0.5W SMD LED. The package dimensions are 5.7 x 3.0 x 0.8 mm, and the device emits high brightness blue light through a water clear colloid.
What are the main electrical ratings for XL-5730UBC-05?
At Ta=25°C, the datasheet lists 500 mW maximum power dissipation, 150 mA maximum continuous forward current, 300 mA peak forward current under the stated pulse condition, and 5 V maximum reverse voltage.
What optical parameters are specified at 150 mA?
At IF=150 mA and Ta=25°C, XL-5730UBC-05 is specified with 8 to 17 lm luminous flux, 450 to 465 nm dominant wavelength, 460 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.
What soldering and storage limits apply to this LED?
The datasheet specifies a maximum of two reflow soldering cycles, hand soldering below 300°C for less than 3 seconds per terminal, storage before opening at <=30°C and <60% RH, and soldering within 168 hours after opening.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.