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XL-5730UBC-05 SMD LED: Thermal & Bin Code Analysis

The XL-5730UBC-05 from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the component for board integration, assess consi...

XL-5730UBC-05 SMD LED: Thermal & Bin Code Analysis

📌 Product Overview

The XL-5730UBC-05 is a 0.5W surface-mount device (SMD) from XINGLIGHT, specifically engineered for applications requiring high-intensity blue light emission. 💡 Housed in a standard 5.7 x 3.0 x 0.8 mm form factor, this component utilizes a transparent water colloid to maximize luminous intensity while maintaining compliance with ROHS environmental standards.

This model is optimized for automated SMT production lines, offering a balance of brightness and thermal efficiency. 👇 The design focus lies in its compatibility with infrared reflow soldering processes, making it a versatile choice for rigid board layouts in commercial fixtures.

🔦 Typical Applications

Based on its 120-degree viewing angle and luminous flux range, the XL-5730UBC-05 is suitable for the following scenarios:

  • Commercial Lighting: Ideal for downlights and linear light strips where consistent color mixing is required.
  • Backlighting: Effective for LCD backlights and indicator panels due to its compact footprint.
  • Signage: High brightness supports advertising words and light boxes requiring clear visibility.
  • Decorative Lighting: Adaptable to flexible light strips for accent lighting applications.

📊 Key Technical Specifications

The following table outlines the optoelectrical characteristics at $T_a=25^\circ C$:

ParameterSymbolMin.Typ.Max.UnitConditions
Luminous Intensity$\Phi$8-17LM$I_F=150mA$
Forward Voltage$V_F$2.8-3.4V$I_F=150mA$
Dominant Wavelength$\lambda_d$450-465nm$I_F=150mA$
Peak Wavelength$\lambda_p$-460-nm$I_F=150mA$
Viewing Angle$2\theta_{1/2}$-120-deg$I_F=150mA$
Reverse Current$I_R$--$\le 5$$\mu A$$V_R=5V$

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these parameters may result in permanent device failure. 💡 Strict adherence to these limits is critical for reliability assurance.

ParameterSymbolMax. ValueUnitNotes
Max Power Dissipation$P_D$500mW-
Max Continuous Forward Current$I_F$150mA-
Peak Forward Current$I_{FP}$300mAPulse width $\le 0.1ms$
Max Reverse Voltage$V_R$5V-
ESD AbilityESD2000VHuman Body Model
Operating Temperature$T_{OPR}$-40 ~ +85$^\circ C$-
Storage Temperature$T_{STR}$-40 ~ +85$^\circ C$-
Soldering Temp$T_{SOL}$260$^\circ C$$\le 6$ seconds

📦 Package, Dimensions & Assembly Notes

  • Outline Dimensions: The component measures 5.7mm (L) x 3.0mm (W) x 0.8mm (H).
  • Moisture Sensitivity: Classified as MSL Level 3. 🚀 Ensure proper baking before reflow if exposed to ambient moisture beyond the floor life.
  • Soldering Process:
    • Lead-Free: Peak temp $255^\circ C$ +0/-5; Time above $217^\circ C$: 60-120s.
    • Lead Process: Peak temp $235^\circ C$ +5/-0; Time above $183^\circ C$: 60-150s.
  • Packaging: Supplied in EIA standard compliant packaging for automated pick-and-place efficiency.

🤝 Sourcing & Supply Considerations

When integrating the XL-5730UBC-05 into high-volume production, consider the following supply chain factors:

  • Binning Consistency: Verify brightness (H6-H8) and voltage (N13-3 to N13-5) bin codes to ensure uniform light output across batches.
  • Cross-Reference: Confirm package dimensions if using this as a drop-in replacement for other 5730 series LEDs.
  • Procurement Verification: Source through authorized channels to avoid counterfeits, especially for commercial lighting applications requiring strict ROHS compliance.

❓ FAQ

Q: What is the maximum current I can drive the XL-5730UBC-05 with continuously?
A: The Absolute Maximum Rating for continuous forward current ($I_F$) is 150 mA. Exceeding this will likely degrade the LED lifespan or cause immediate failure.

Q: Does this LED require specific handling for moisture?
A: Yes, the datasheet specifies a Moisture Sensitivity Level (MSL) of 3. This means the components should be used within a specified time frame after opening the vacuum seal or baked prior to SMT reflow soldering to prevent "popcorning" damage.

Q: What are the binning codes for this model?
A: Brightness is binned between H6 (8-10 LM) and H8 (13-17 LM). Forward voltage bins range from N13-3 (2.8-3.0V) to N13-5 (3.2-3.4V). Wavelength bins are HB02 through HB04 (450-465nm).

Q: Is this component compatible with lead-free soldering processes?
A: Yes, it is suitable for both lead-free and lead-based infrared reflow soldering. For lead-free, the maximum peak temperature is $255^\circ C$ with strict time limits above $217^\circ C$ (60-120 seconds).

Q: What is the typical viewing angle?
A: The typical viewing angle ($2\theta_{1/2}$) is 120 degrees, making it suitable for area lighting and backlighting where broad light dispersion is needed.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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