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XL-5730UBC-05 SMD LED: Thermal & Bin Code Analysis

The XL-5730UBC-05 from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the component for board integration, assess consi...

XL-5730UBC-05 SMD LED: Thermal & Bin Code Analysis

📌 Product Overview

The XL-5730UBC-05 is a 0.5W surface-mount device (SMD) from XINGLIGHT, specifically engineered for applications requiring high-intensity blue light emission. 💡 Housed in a standard 5.7 x 3.0 x 0.8 mm form factor, this component utilizes a transparent water colloid to maximize luminous intensity while maintaining compliance with ROHS environmental standards.

This model is optimized for automated SMT production lines, offering a balance of brightness and thermal efficiency. 👇 The design focus lies in its compatibility with infrared reflow soldering processes, making it a versatile choice for rigid board layouts in commercial fixtures.

🔦 Typical Applications

Based on its 120-degree viewing angle and luminous flux range, the XL-5730UBC-05 is suitable for the following scenarios:

  • Commercial Lighting: Ideal for downlights and linear light strips where consistent color mixing is required.
  • Backlighting: Effective for LCD backlights and indicator panels due to its compact footprint.
  • Signage: High brightness supports advertising words and light boxes requiring clear visibility.
  • Decorative Lighting: Adaptable to flexible light strips for accent lighting applications.

📊 Key Technical Specifications

The following table outlines the optoelectrical characteristics at $T_a=25^\circ C$:

ParameterSymbolMin.Typ.Max.UnitConditions
Luminous Intensity$\Phi$8-17LM$I_F=150mA$
Forward Voltage$V_F$2.8-3.4V$I_F=150mA$
Dominant Wavelength$\lambda_d$450-465nm$I_F=150mA$
Peak Wavelength$\lambda_p$-460-nm$I_F=150mA$
Viewing Angle$2\theta_{1/2}$-120-deg$I_F=150mA$
Reverse Current$I_R$--$\le 5$$\mu A$$V_R=5V$

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these parameters may result in permanent device failure. 💡 Strict adherence to these limits is critical for reliability assurance.

ParameterSymbolMax. ValueUnitNotes
Max Power Dissipation$P_D$500mW-
Max Continuous Forward Current$I_F$150mA-
Peak Forward Current$I_{FP}$300mAPulse width $\le 0.1ms$
Max Reverse Voltage$V_R$5V-
ESD AbilityESD2000VHuman Body Model
Operating Temperature$T_{OPR}$-40 ~ +85$^\circ C$-
Storage Temperature$T_{STR}$-40 ~ +85$^\circ C$-
Soldering Temp$T_{SOL}$260$^\circ C$$\le 6$ seconds

📦 Package, Dimensions & Assembly Notes

  • Outline Dimensions: The component measures 5.7mm (L) x 3.0mm (W) x 0.8mm (H).
  • Moisture Sensitivity: Classified as MSL Level 3. 🚀 Ensure proper baking before reflow if exposed to ambient moisture beyond the floor life.
  • Soldering Process:
    • Lead-Free: Peak temp $255^\circ C$ +0/-5; Time above $217^\circ C$: 60-120s.
    • Lead Process: Peak temp $235^\circ C$ +5/-0; Time above $183^\circ C$: 60-150s.
  • Packaging: Supplied in EIA standard compliant packaging for automated pick-and-place efficiency.

🤝 Sourcing & Supply Considerations

When integrating the XL-5730UBC-05 into high-volume production, consider the following supply chain factors:

  • Binning Consistency: Verify brightness (H6-H8) and voltage (N13-3 to N13-5) bin codes to ensure uniform light output across batches.
  • Cross-Reference: Confirm package dimensions if using this as a drop-in replacement for other 5730 series LEDs.
  • Procurement Verification: Source through authorized channels to avoid counterfeits, especially for commercial lighting applications requiring strict ROHS compliance.

❓ FAQ

Q: What is the maximum current I can drive the XL-5730UBC-05 with continuously?
A: The Absolute Maximum Rating for continuous forward current ($I_F$) is 150 mA. Exceeding this will likely degrade the LED lifespan or cause immediate failure.

Q: Does this LED require specific handling for moisture?
A: Yes, the datasheet specifies a Moisture Sensitivity Level (MSL) of 3. This means the components should be used within a specified time frame after opening the vacuum seal or baked prior to SMT reflow soldering to prevent "popcorning" damage.

Q: What are the binning codes for this model?
A: Brightness is binned between H6 (8-10 LM) and H8 (13-17 LM). Forward voltage bins range from N13-3 (2.8-3.0V) to N13-5 (3.2-3.4V). Wavelength bins are HB02 through HB04 (450-465nm).

Q: Is this component compatible with lead-free soldering processes?
A: Yes, it is suitable for both lead-free and lead-based infrared reflow soldering. For lead-free, the maximum peak temperature is $255^\circ C$ with strict time limits above $217^\circ C$ (60-120 seconds).

Q: What is the typical viewing angle?
A: The typical viewing angle ($2\theta_{1/2}$) is 120 degrees, making it suitable for area lighting and backlighting where broad light dispersion is needed.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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